SPRSPA7A September   2024  – November 2024 AM2612

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Package Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagram
      1. 5.1.1 AM261x ZCZ Pin Diagram
      2. 5.1.2 AM261x ZFG Pin Diagram
      3. 5.1.3 AM261x ZEJ Pin Diagram
      4. 5.1.4 AM261x ZNC Pin Diagram
    2. 5.2 Pin Attributes
      1.      15
      2.      16
    3. 5.3 Signal Descriptions
      1.      18
      2. 5.3.1  ADC
        1.       20
        2.       21
        3.       22
      3. 5.3.2  ADC_CAL
        1.       24
      4. 5.3.3  ADC VREF
        1.       26
      5. 5.3.4  CPSW
        1.       28
        2.       29
        3.       30
        4.       31
        5.       32
        6.       33
        7.       34
      6. 5.3.5  CPTS
        1.       36
      7. 5.3.6  DAC
        1.       38
      8. 5.3.7  EPWM
        1.       40
        2.       41
        3.       42
        4.       43
        5.       44
        6.       45
        7.       46
        8.       47
        9.       48
        10.       49
      9. 5.3.8  EQEP
        1.       51
        2.       52
      10. 5.3.9  FSI
        1.       54
        2.       55
      11. 5.3.10 GPIO
        1.       57
      12. 5.3.11 GPMC0
        1.       59
      13. 5.3.12 I2C
        1.       61
        2.       62
        3.       63
      14. 5.3.13 LIN
        1.       65
        2.       66
        3.       67
      15. 5.3.14 MCAN
        1.       69
        2.       70
      16. 5.3.15 SPI (MCSPI)
        1.       72
        2.       73
        3.       74
        4.       75
      17. 5.3.16 MMC
        1.       77
      18. 5.3.17 Power Supply
        1.       79
      19. 5.3.18 PRU-ICSS
        1.       81
        2.       82
        3.       83
        4.       84
        5.       85
      20. 5.3.19 OSPI
        1.       87
        2.       88
      21. 5.3.20 SDFM
        1.       90
        2.       91
      22. 5.3.21 System and Miscellaneous
        1. 5.3.21.1 Boot Mode Configuration
          1.        94
        2. 5.3.21.2 Clocking
          1.        96
          2.        97
          3.        98
        3. 5.3.21.3 Emulation and Debug
          1.        100
          2.        101
        4. 5.3.21.4 SYSTEM
          1.        103
        5. 5.3.21.5 USB0
          1.        105
        6. 5.3.21.6 VMON
          1.        107
        7.       108
          1.        109
      23. 5.3.22 UART
        1.       111
        2.       112
        3.       113
        4.       114
        5.       115
        6.       116
      24. 5.3.23 XBAR
        1.       118
        2.       119
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Electrical Characteristics
      1. 6.3.1 Digital and Analog IO Electrical Characteristics
    4. 6.4 Thermal Resistance Characteristics
      1. 6.4.1 Package Thermal Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Processor Subsystems
      1. 7.2.1 Arm Cortex-R5F Subsystem
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 External Oscillator
      2. 8.1.2 JTAG, EMU, and TRACE
      3. 8.1.3 Hardware Reference Design and Guidelines
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • ZFG|304
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4.1 Package Thermal Characteristics

It is recommended to perform thermal simulations at the system level with the worst-case device power consumption.
PARAMETER DESCRIPTION ℃/W(1)(2) AIR FLOW (m/s)(3)
RΘJC Junction-to-case TBD N/A
RΘJB Junction-to-board TBD N/A
RΘJA Junction-to-free air TBD 0
RΘJA Junction-to-moving air TBD 1
TBD 2
TBD 3
ΨJT Junction-to-package top TBD 0
TBD 1
TBD 2
TBD 3
ΨJB Junction-to-board TBD 0
TBD 1
TBD 2
TBD 3
(1) These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Packages
(2) ℃/W = degrees Celsius per watt
(3) m/s = meters per second