SPRSPB0 December   2024 AM2754-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagram
      1. 5.1.1 ANJ Pin Diagram
    2. 5.2 Pin Attributes
      1.      12
      2.      13
    3. 5.3 Signal Descriptions
      1.      15
      2. 5.3.1  ADC
        1.       17
      3. 5.3.2  Audio Clock References
        1.       19
      4. 5.3.3  CPSW
        1.       21
        2.       22
        3.       23
        4.       24
        5.       25
      5. 5.3.4  CPTS
        1.       27
      6. 5.3.5  ECAP
        1.       29
        2.       30
        3.       31
        4.       32
        5.       33
        6.       34
      7. 5.3.6  Emulation and Debug
        1.       36
        2.       37
      8. 5.3.7  EPWM
        1.       39
        2.       40
        3.       41
        4.       42
      9. 5.3.8  GPIO
        1.       44
        2.       45
        3.       46
      10. 5.3.9  HYPERBUS
        1.       48
      11. 5.3.10 I2C
        1.       50
        2.       51
        3.       52
        4.       53
        5.       54
        6.       55
        7.       56
        8.       57
      12. 5.3.11 MCAN
        1.       59
        2.       60
        3.       61
        4.       62
        5.       63
      13. 5.3.12 MCASP
        1.       65
        2.       66
        3.       67
        4.       68
        5.       69
      14. 5.3.13 MLB
        1.       71
      15. 5.3.14 MMC
        1.       73
      16. 5.3.15 OSPI
        1.       75
        2.       76
      17. 5.3.16 Power Supply
        1.       78
      18. 5.3.17 Reserved
        1.       80
      19. 5.3.18 System and Miscellaneous
        1.       82
        2.       83
        3.       84
        4.       85
      20. 5.3.19 SPI
        1.       87
        2.       88
        3.       89
        4.       90
        5.       91
      21. 5.3.20 TIMER
        1.       93
        2.       94
      22. 5.3.21 UART
        1.       96
        2.       97
        3.       98
        4.       99
        5.       100
        6.       101
        7.       102
        8.       103
      23. 5.3.22 USB
        1.       105
    4.     Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Electrostatic Discharge (ESD) for AEC - Q100 devices
    3. 6.3  Electrostatic Discharge (ESD) for non AEC - Q100 devices
    4. 6.4  Power-On Hours (POH) Summary
    5. 6.5  Automotive Temperature Profile
    6. 6.6  Recommended Operating Conditions
    7. 6.7  Operating Performance Points
    8. 6.8  Electrical Characteristics
      1. 6.8.1 I2C Open-Drain and Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 6.8.2 Fail-Safe Reset (FS RESET) Electrical Characteristics
      3. 6.8.3 High-Frequency Oscillators (MCU_OSC0 and OSC1) Electrical Characteristics
      4. 6.8.4 Low-Frequency Oscillator (WKUP_LFOSC0) Electrical Characteristics
      5. 6.8.5 SDIO Electrical Characteristics
      6. 6.8.6 Analog-to-Digital Converter (ADC)
      7. 6.8.7 LVCMOS Electrical Characteristics
      8. 6.8.8 USB2PHY Electrical Characteristics
    9. 6.9  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.9.1 VPP Specifications
      2. 6.9.2 Hardware Requirements
      3. 6.9.3 Programming Sequence
      4. 6.9.4 Impact to Your Hardware Warranty
    10. 6.10 Thermal Resistance Characteristics
      1. 6.10.1 Package Thermal Characteristics
    11. 6.11 Timing and Switching Characteristics
      1. 6.11.1 Timing Parameters and Information
      2. 6.11.2 Power Supply Requirements
        1. 6.11.2.1 Power Supply Slew Rate Requirement
        2. 6.11.2.2 Power Supply Sequencing
          1. 6.11.2.2.1 Power-Up Sequencing without IO Retention
          2. 6.11.2.2.2 Power-Up Sequencing with IO Retention
          3. 6.11.2.2.3 Power-Up Sequencing - IO Retention Wakeup
          4. 6.11.2.2.4 Power-Down Sequencing
      3. 6.11.3 System Timing
        1. 6.11.3.1 Reset Timing
          1.        Reset Timing Conditions
          2.        MCU_PORz Timing Requirements
          3.        144
          4.        RESETSTATz Switching Characteristics
          5.        MCU_RESETz Timing Requirements
          6.        RESETSTATz Switching Characteristics
          7.        EMUx Timing Requirements
          8.        149
          9.        BOOTMODE Timing Requirements
        2. 6.11.3.2 Error Signal Timing
          1.        Error Signal Timing Conditions
          2.        MCU_ERRORn Switching Characteristics
          3. 6.11.3.2.1 154
        3. 6.11.3.3 Clock Timing
          1.        Clock Timing Conditions
          2.        Clock Timing Requirements
          3. 6.11.3.3.1 158
          4.        Clock Switching Characteristics
          5. 6.11.3.3.2 160
      4. 6.11.4 Clock Specifications
        1. 6.11.4.1 Input Clocks / Oscillators
          1. 6.11.4.1.1 MCU_OSC0 and OSC1 Internal Oscillator Clock Source
            1. 6.11.4.1.1.1 HFOSC (MCU_OSC0 and OSC1) Crystal Circuit Requirements
            2. 6.11.4.1.1.2 HFOSC (MCU_OSC0 and OSC1) Switching Characteristics - Crystal Mode
            3. 6.11.4.1.1.3 Load Capacitance
            4. 6.11.4.1.1.4 Shunt Capacitance
          2. 6.11.4.1.2 MCU_OSC0 and OSC1 LVCMOS Digital Clock Source
          3. 6.11.4.1.3 WKUP_LFOSC0 Internal Oscillator Clock Source
            1. 6.11.4.1.3.1 LFOSC (WKUP_LFOSC0) Crystal Circuit Requirements
            2. 6.11.4.1.3.2 LFOSC (WKUP_LFOSC0) Switching Characteristics - Crystal Mode
          4. 6.11.4.1.4 WKUP_LFOSC0 LVCMOS Digital Clock Source
          5. 6.11.4.1.5 WKUP_LFOSC0 Not Used
        2. 6.11.4.2 Recommended System Precautions for Clock and Control Signal Transitions
      5. 6.11.5 Peripherals
        1. 6.11.5.1  ATL
          1.        ATL Timing Conditions
          2.        ATL_AWS[x] Timing Requirements
          3.        ATL_BWS[x] Timing Requirements
          4.        ATL_PCLK Timing Requirements
          5.        ATCLK[x] Switching Characteristics
        2. 6.11.5.2  CPSW3G
          1. 6.11.5.2.1 CPSW3G MDIO Timing
            1.         CPSW3G MDIO Timing Conditions
            2.         CPSW3G MDIO Timing Requirements
            3.         CPSW3G MDIO Switching Characteristics
            4.         187
          2. 6.11.5.2.2 CPSW3G RMII Timing
            1.         CPSW3G RMII Timing Conditions
            2.         CPSW3G RMII[x]_REFCLK Timing Requirements - RMII Mode
            3.         191
            4.         CPSW3G RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RXER Timing Requirements - RMII Mode
            5.         193
            6.         CPSW3G RMII[x]_TXD[1:0], and RMII[x]_TXEN Switching Characteristics - RMII Mode
            7.         195
          3. 6.11.5.2.3 CPSW3G RGMII Timing
            1.         CPSW3G RGMII Timing Conditions
            2.         CPSW3G RGMII[x]_RCLK Timing Requirements - RGMII Mode
            3.         CPSW3G RGMII[x]_RD[3:0], and RGMII[x]_RCTL Timing Requirements - RGMII Mode
            4.         200
            5.         CPSW3G RGMII[x]_TCLK Switching Characteristics - RGMII Mode
            6.         CPSW3G RGMII[x]_TD[3:0], and RGMII[x]_TCTL Switching Characteristics - RGMII Mode
            7.         203
        3. 6.11.5.3  ECAP
          1.        ECAP Timing Conditions
          2.        ECAP Timing Requirements
          3.        207
          4.        ECAP Switching Characteristics
          5.        209
        4. 6.11.5.4  Emulation and Debug
          1. 6.11.5.4.1 Trace
            1.         Trace Timing Conditions
            2.         Trace Switching Characteristics
            3.         214
          2. 6.11.5.4.2 JTAG
            1.         JTAG Timing Conditions
            2.         JTAG Timing Requirements
            3.         JTAG Switching Characteristics
            4.         219
        5. 6.11.5.5  EPWM
          1.        EPWM Timing Conditions
          2.        EPWM Timing Requirements
          3.        223
          4.        EPWM Switching Characteristics
          5.        225
        6. 6.11.5.6  GPIO
          1.        GPIO Timing Conditions
          2.        GPIO Timing Requirements
          3.        GPIO Switching Characteristics
        7. 6.11.5.7  HyperBus
          1.        HyperBus Timing Conditions
          2.        HyperBus Timing Requirements
          3.        HyperBus 166MHz Switching Characteristics
          4.        HyperBus 100MHz Switching Characteristics
        8. 6.11.5.8  I2C
        9. 6.11.5.9  MCAN
          1.        MCAN Timing Conditions
          2.        MCAN Switching Characteristics
        10. 6.11.5.10 MCASP
          1.        MCASP Timing Conditions
          2.        MCASP Timing Requirements
          3.        242
          4.        MCASP Switching Characteristics
          5.        244
        11. 6.11.5.11 MCSPI
          1.        MCSPI Timing Conditions
          2.        MCSPI Timing Requirements - Controller Mode
          3.        248
          4.        MCSPI Switching Characteristics - Controller Mode
          5.        250
          6.        MCSPI Timing Requirements - Peripheral Mode
          7.        252
          8.        MCSPI Switching Characteristics - Peripheral Mode
          9.        254
        12. 6.11.5.12 MLB
          1.        MLB Timing Conditions
          2.        MLB Timing Requirements for MLBCLK - 3-pin
          3.        MLB Timing Requirements for Receive Data - 3-pin
          4.        MLB Switching Characteristics - 3-Pin
          5.        MLB Timing Requirements for MLBCLK - 6-pin
          6.        MLB Timing Requirements for Receive Data - 6-pin
          7.        MLB Switching Characteristics - 6-Pin
        13. 6.11.5.13 MMCSD
          1. 6.11.5.13.1 MMC0 - eMMC/SDIO Interface
            1.         MMC Timing Conditions
            2.         MMC Timing Requirements - 3.3V Legacy SDR Mode
            3.         267
            4.         MMC Switching Characteristics - 3.3V Legacy SDR Mode
            5.         269
            6.         MMC Timing Requirements - 3.3V High Speed SDR Mode
            7.         271
            8.         MMC Switching Characteristics - 3.3V High Speed SDR Mode
            9.         273
            10.         MMC Timing Requirements - 1.8V Legacy SDR, UHS-I SDR12 Mode
            11.         275
            12.         MMC Switching Characteristics - 1.8V Legacy SDR, UHS-I SDR12 Mode
            13.         277
            14.         MMC Timing Requirements - 1.8V High Speed SDR, UHS-I SDR25 Mode
            15.         279
            16.         MMC Switching Characteristics - 1.8V High Speed SDR, UHS-I SDR25 Mode
            17.         281
            18.         MMC Switching Characteristics - UHS-I SDR50 Mode
            19.         283
            20.         MMC Switching Characteristics - UHS-I DDR50 Mode
            21.         285
            22.         MMC Switching Characteristics - HS200 Mode
            23.         287
        14. 6.11.5.14 OSPI
          1.        OSPI Timing Conditions
          2. 6.11.5.14.1 OSPI0 PHY Mode
            1. 6.11.5.14.1.1 OSPI0 With PHY Data Training
              1.          OSPI DLL Delay Mapping for PHY Data Training
              2.          OSPI Timing Requirements - PHY Data Training
              3.          294
              4.          OSPI Switching Characteristics - PHY Data Training
              5.          296
            2. 6.11.5.14.1.2 OSPI0 Without Data Training
              1. 6.11.5.14.1.2.1 OSPI0 PHY SDR Timing
                1.           OSPI DLL Delay Mapping for PHY SDR Timing Modes
                2.           OSPI Timing Requirements - PHY SDR Mode
                3.           301
                4.           OSPI Switching Characteristics - PHY SDR Mode
                5.           303
              2. 6.11.5.14.1.2.2 OSPI0 PHY DDR Timing
                1.           OSPI DLL Delay Mapping for PHY DDR Timing Modes
                2.           OSPI Timing Requirements - PHY DDR Mode
                3.           307
                4.           OSPI Switching Characteristics - PHY DDR Mode
                5.           309
          3. 6.11.5.14.2 OSPI0 Tap Mode
            1. 6.11.5.14.2.1 OSPI0 Tap SDR Timing
              1.          OSPI Timing Requirements - Tap SDR Mode
              2.          313
              3.          OSPI Switching Characteristics - Tap SDR Mode
              4.          315
            2. 6.11.5.14.2.2 OSPI0 Tap DDR Timing
              1.          OSPI Timing Requirements - Tap DDR Mode
              2.          318
              3.          OSPI Switching Characteristics - Tap DDR Mode
              4.          320
        15. 6.11.5.15 Timers
          1.        Timer Timing Conditions
          2.        Timer Timing Requirements
          3.        Timer Switching Characteristics
          4.        325
        16. 6.11.5.16 UART
          1.        UART Timing Conditions
          2.        UART Timing Requirements
          3.        UART Switching Characteristics
          4.        330
        17. 6.11.5.17 USB
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Processor Subsystems
      1. 7.3.1 Arm Cortex-R5F Subsystem
      2. 7.3.2 Device/Power Manager
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 Power Supply
      2. 8.1.2 External Oscillator
      3. 8.1.3 JTAG, EMU, and TRACE
      4. 8.1.4 Unused Pins
    2. 8.2 Peripheral- and Interface-Specific Design Information
      1. 8.2.1 OSPI/QSPI/SPI Board Design and Layout Guidelines
        1. 8.2.1.1 No Loopback, Internal PHY Loopback, and Internal Pad Loopback
        2. 8.2.1.2 External Board Loopback
        3. 8.2.1.3 DQS (only available in Octal SPI devices)
      2. 8.2.2 High Speed Differential Signal Routing Guidance
      3. 8.2.3 Thermal Solution Guidance
    3. 8.3 Clock Routing Guidelines
      1. 8.3.1 Oscillator Routing
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
  • ANJ|361
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (for example, AM275xTBD). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMDX) through fully qualified production devices and tools (TMDS).

Device development evolutionary flow:

    X Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    null Production version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

    TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDS Fully-qualified development-support product.

X and P devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

For orderable part numbers of AM275 devices in the ANJ package type, see the Package Option Addendum of this document, the TI website (ti.com), or contact your TI sales representative.