SPRS961F August   2016  – November 2019 AM5706 , AM5708

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Pin Attributes
    3. 4.3 Signal Descriptions
      1. 4.3.1  VIP
      2. 4.3.2  DSS
      3. 4.3.3  HDMI
      4. 4.3.4  CSI2
      5. 4.3.5  EMIF
      6. 4.3.6  GPMC
      7. 4.3.7  Timers
      8. 4.3.8  I2C
      9. 4.3.9  HDQ1W
      10. 4.3.10 UART
      11. 4.3.11 McSPI
      12. 4.3.12 QSPI
      13. 4.3.13 McASP
      14. 4.3.14 USB
      15. 4.3.15 PCIe
      16. 4.3.16 DCAN
      17. 4.3.17 GMAC_SW
      18. 4.3.18 MLB
      19. 4.3.19 eMMC/SD/SDIO
      20. 4.3.20 GPIO
      21. 4.3.21 KBD
      22. 4.3.22 PWM
      23. 4.3.23 PRU-ICSS
      24. 4.3.24 Emulation and Debug Subsystem
      25. 4.3.25 System and Miscellaneous
        1. 4.3.25.1 Sysboot
        2. 4.3.25.2 Power, Reset, and Clock Management (PRCM)
        3. 4.3.25.3 System Direct Memory Access (SDMA)
        4. 4.3.25.4 Interrupt Controllers (INTC)
      26. 4.3.26 Power Supplies
    4. 4.4 Pin Multiplexing
    5. 4.5 Connections for Unused Pins
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Power on Hours (POH) Limits
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Operating Performance Points
      1. 5.5.1 AVS and ABB Requirements
      2. 5.5.2 Voltage And Core Clock Specifications
        1. Table 5-4 Voltage Domains Operating Performance Points
      3. 5.5.3 Maximum Supported Frequency
    6. 5.6  Power Consumption Summary
    7. 5.7  Electrical Characteristics
      1. Table 5-7  LVCMOS DDR DC Electrical Characteristics
      2. Table 5-8  Dual Voltage LVCMOS I2C DC Electrical Characteristics
      3. Table 5-9  IQ1833 Buffers DC Electrical Characteristics
      4. Table 5-10 IHHV1833 Buffers DC Electrical Characteristics
      5. Table 5-11 LVCMOS CSI2 DC Electrical Characteristics
      6. Table 5-12 BMLB18 Buffers DC Electrical Characteristics
      7. Table 5-13 Dual Voltage SDIO1833 DC Electrical Characteristics
      8. Table 5-14 Dual Voltage LVCMOS DC Electrical Characteristics
      9. 5.7.1      USBPHY DC Electrical Characteristics
      10. 5.7.2      HDMIPHY DC Electrical Characteristics
      11. 5.7.3      PCIEPHY DC Electrical Characteristics
    8. 5.8  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. Table 5-15 Recommended Operating Conditions for OTP eFuse Programming
      2. 5.8.1      Hardware Requirements
      3. 5.8.2      Programming Sequence
      4. 5.8.3      Impact to Your Hardware Warranty
    9. 5.9  Thermal Resistance Characteristics for CBD Package
      1. 5.9.1 Package Thermal Characteristics
    10. 5.10 Timing Requirements and Switching Characteristics
      1. 5.10.1 Timing Parameters and Information
        1. 5.10.1.1 Parameter Information
          1. 5.10.1.1.1 1.8 V and 3.3 V Signal Transition Levels
          2. 5.10.1.1.2 1.8 V and 3.3 V Signal Transition Rates
          3. 5.10.1.1.3 Timing Parameters and Board Routing Analysis
      2. 5.10.2 Interface Clock Specifications
        1. 5.10.2.1 Interface Clock Terminology
        2. 5.10.2.2 Interface Clock Frequency
      3. 5.10.3 Power Supply Sequences
      4. 5.10.4 Clock Specifications
        1. 5.10.4.1 Input Clocks / Oscillators
          1. 5.10.4.1.1 OSC0 External Crystal
          2. 5.10.4.1.2 OSC0 Input Clock
          3. 5.10.4.1.3 Auxiliary Oscillator OSC1 Input Clock
            1. 5.10.4.1.3.1 OSC1 External Crystal
            2. 5.10.4.1.3.2 OSC1 Input Clock
          4. 5.10.4.1.4 RC On-die Oscillator Clock
        2. 5.10.4.2 Output Clocks
        3. 5.10.4.3 DPLLs, DLLs
          1. 5.10.4.3.1 DPLL Characteristics
          2. 5.10.4.3.2 DLL Characteristics
      5. 5.10.5 Recommended Clock and Control Signal Transition Behavior
      6. 5.10.6 Peripherals
        1. 5.10.6.1  Timing Test Conditions
        2. 5.10.6.2  Virtual and Manual I/O Timing Modes
        3. 5.10.6.3  VIP
        4. 5.10.6.4  DSS
        5. 5.10.6.5  HDMI
        6. 5.10.6.6  CSI2
          1. 5.10.6.6.1 CSI-2 MIPI D-PHY
        7. 5.10.6.7  EMIF
        8. 5.10.6.8  GPMC
          1. 5.10.6.8.1 GPMC/NOR Flash Interface Synchronous Timing
          2. 5.10.6.8.2 GPMC/NOR Flash Interface Asynchronous Timing
          3. 5.10.6.8.3 GPMC/NAND Flash Interface Asynchronous Timing
        9. 5.10.6.9  Timers
        10. 5.10.6.10 I2C
          1. Table 5-57 Timing Requirements for I2C Input Timings
          2. Table 5-58 Timing Requirements for I2C HS-Mode (I2C3/4/5 Only)
          3. Table 5-59 Switching Characteristics Over Recommended Operating Conditions for I2C Output Timings
        11. 5.10.6.11 HDQ1W
          1. 5.10.6.11.1 HDQ / 1-Wire — HDQ Mode
          2. 5.10.6.11.2 HDQ/1-Wire—1-Wire Mode
        12. 5.10.6.12 UART
          1. Table 5-64 Timing Requirements for UART
          2. Table 5-65 Switching Characteristics Over Recommended Operating Conditions for UART
        13. 5.10.6.13 McSPI
        14. 5.10.6.14 QSPI
        15. 5.10.6.15 McASP
          1. Table 5-72 Timing Requirements for McASP1
          2. Table 5-73 Timing Requirements for McASP2
          3. Table 5-74 Timing Requirements for McASP3/4/5/6/7/8
        16. 5.10.6.16 USB
          1. 5.10.6.16.1 USB1 DRD PHY
          2. 5.10.6.16.2 USB2 PHY
        17. 5.10.6.17 PCIe
        18. 5.10.6.18 DCAN
          1. Table 5-89 Timing Requirements for DCANx Receive
          2. Table 5-90 Switching Characteristics Over Recommended Operating Conditions for DCANx Transmit
        19. 5.10.6.19 GMAC_SW
          1. 5.10.6.19.1 GMAC MII Timings
            1. Table 5-91 Timing Requirements for miin_rxclk - MII Operation
            2. Table 5-92 Timing Requirements for miin_txclk - MII Operation
            3. Table 5-93 Timing Requirements for GMAC MIIn Receive 10/100 Mbit/s
            4. Table 5-94 Switching Characteristics Over Recommended Operating Conditions for GMAC MIIn Transmit 10/100 Mbits/s
          2. 5.10.6.19.2 GMAC MDIO Interface Timings
          3. 5.10.6.19.3 GMAC RMII Timings
            1. Table 5-99  Timing Requirements for GMAC REF_CLK - RMII Operation
            2. Table 5-100 Timing Requirements for GMAC RMIIn Receive
            3. Table 5-101 Switching Characteristics Over Recommended Operating Conditions for GMAC REF_CLK - RMII Operation
            4. Table 5-102 Switching Characteristics Over Recommended Operating Conditions for GMAC RMIIn Transmit 10/100 Mbits/s
          4. 5.10.6.19.4 GMAC RGMII Timings
            1. Table 5-106 Timing Requirements for rgmiin_rxc - RGMIIn Operation
            2. Table 5-107 Timing Requirements for GMAC RGMIIn Input Receive for 10/100/1000 Mbps
            3. Table 5-108 Switching Characteristics Over Recommended Operating Conditions for rgmiin_txctl - RGMIIn Operation for 10/100/1000 Mbit/s
            4. Table 5-109 Switching Characteristics for GMAC RGMIIn Output Transmit for 10/100/1000 Mbps
        20. 5.10.6.20 eMMC/SD/SDIO
          1. 5.10.6.20.1 MMC1—SD Card Interface
            1. 5.10.6.20.1.1 Default speed, 4-bit data, SDR, half-cycle
            2. 5.10.6.20.1.2 High speed, 4-bit data, SDR, half-cycle
            3. 5.10.6.20.1.3 SDR12, 4-bit data, half-cycle
            4. 5.10.6.20.1.4 SDR25, 4-bit data, half-cycle
            5. 5.10.6.20.1.5 UHS-I SDR50, 4-bit data, half-cycle
            6. 5.10.6.20.1.6 UHS-I SDR104, 4-bit data, half-cycle
            7. 5.10.6.20.1.7 UHS-I DDR50, 4-bit data
          2. 5.10.6.20.2 MMC2 — eMMC
            1. 5.10.6.20.2.1 Standard JC64 SDR, 8-bit data, half cycle
            2. 5.10.6.20.2.2 High-speed JC64 SDR, 8-bit data, half cycle
            3. 5.10.6.20.2.3 High-speed HS200 JEDS84 SDR, 8-bit data, half cycle
            4. 5.10.6.20.2.4 High-speed JC64 DDR, 8-bit data
              1. Table 5-134 Switching Characteristics for MMC2 - JC64 High Speed DDR Mode
          3. 5.10.6.20.3 MMC3 and MMC4—SDIO/SD
            1. 5.10.6.20.3.1 MMC3 and MMC4, SD Default Speed
            2. 5.10.6.20.3.2 MMC3 and MMC4, SD High Speed
            3. 5.10.6.20.3.3 MMC3 and MMC4, SD and SDIO SDR12 Mode
            4. 5.10.6.20.3.4 MMC3 and MMC4, SD SDR25 Mode
            5. 5.10.6.20.3.5 MMC3 SDIO High-Speed UHS-I SDR50 Mode, Half Cycle
        21. 5.10.6.21 GPIO
        22. 5.10.6.22 PRU-ICSS
          1. 5.10.6.22.1 Programmable Real-Time Unit (PRU-ICSS PRU)
            1. 5.10.6.22.1.1 PRU-ICSS PRU Direct Input/Output Mode Electrical Data and Timing
              1. Table 5-156 PRU-ICSS PRU Timing Requirements - Direct Input Mode
              2. Table 5-157 PRU-ICSS PRU Switching Requirements – Direct Output Mode
            2. 5.10.6.22.1.2 PRU-ICSS PRU Parallel Capture Mode Electrical Data and Timing
              1. Table 5-158 PRU-ICSS PRU Timing Requirements - Parallel Capture Mode
            3. 5.10.6.22.1.3 PRU-ICSS PRU Shift Mode Electrical Data and Timing
              1. Table 5-159 PRU-ICSS PRU Timing Requirements – Shift In Mode
              2. Table 5-160 PRU-ICSS PRU Switching Requirements - Shift Out Mode
            4. 5.10.6.22.1.4 PRU-ICSS PRU Sigma Delta and EnDAT Modes
              1. Table 5-161 PRU-ICSS PRU Timing Requirements - Sigma Delta Mode
              2. Table 5-162 PRU-ICSS PRU Timing Requirements - EnDAT Mode
              3. Table 5-163 PRU-ICSS PRU Switching Requirements - EnDAT Mode
          2. 5.10.6.22.2 PRU-ICSS EtherCAT (PRU-ICSS ECAT)
            1. 5.10.6.22.2.1 PRU-ICSS ECAT Electrical Data and Timing
              1. Table 5-164 PRU-ICSS ECAT Timing Requirements – Input Validated With LATCH_IN
              2. Table 5-165 PRU-ICSS ECAT Timing Requirements – Input Validated With SYNCx
              3. Table 5-166 PRU-ICSS ECAT Timing Requirements – Input Validated With Start of Frame (SOF)
              4. Table 5-167 PRU-ICSS ECAT Timing Requirements - LATCHx_IN
              5. Table 5-168 PRU-ICSS ECAT Switching Requirements - Digital IOs
          3. 5.10.6.22.3 PRU-ICSS MII_RT and Switch
            1. 5.10.6.22.3.1 PRU-ICSS MDIO Electrical Data and Timing
              1. Table 5-169 PRU-ICSS MDIO Timing Requirements – MDIO_DATA
              2. Table 5-170 PRU-ICSS MDIO Switching Characteristics - MDIO_CLK
              3. Table 5-171 PRU-ICSS MDIO Switching Characteristics – MDIO_DATA
            2. 5.10.6.22.3.2 PRU-ICSS MII_RT Electrical Data and Timing
              1. Table 5-172 PRU-ICSS MII_RT Timing Requirements – MII[x]_RXCLK
              2. Table 5-173 PRU-ICSS MII_RT Timing Requirements - MII[x]_TXCLK
              3. Table 5-174 PRU-ICSS MII_RT Timing Requirements - MII_RXD[3:0], MII_RXDV, and MII_RXER
              4. Table 5-175 PRU-ICSS MII_RT Switching Characteristics - MII_TXD[3:0] and MII_TXEN
          4. 5.10.6.22.4 PRU-ICSS Universal Asynchronous Receiver Transmitter (PRU-ICSS UART)
            1. Table 5-176 Timing Requirements for PRU-ICSS UART Receive
            2. Table 5-177 Switching Characteristics Over Recommended Operating Conditions for PRU-ICSS UART Transmit
          5. 5.10.6.22.5 PRU-ICSS IOSETs
          6. 5.10.6.22.6 PRU-ICSS Manual Functional Mapping
        23. 5.10.6.23 System and Miscellaneous interfaces
      7. 5.10.7 Emulation and Debug Subsystem
        1. 5.10.7.1 IEEE 1149.1 Standard-Test-Access Port (JTAG)
          1. 5.10.7.1.1 JTAG Electrical Data/Timing
            1. Table 5-194 Timing Requirements for IEEE 1149.1 JTAG
            2. Table 5-195 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
            3. Table 5-196 Timing Requirements for IEEE 1149.1 JTAG With RTCK
            4. Table 5-197 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG With RTCK
        2. 5.10.7.2 Trace Port Interface Unit (TPIU)
          1. 5.10.7.2.1 TPIU PLL DDR Mode
  6. 6Detailed Description
    1. 6.1  Description
    2. 6.2  Functional Block Diagram
    3. 6.3  MPU
    4. 6.4  DSP Subsystem
    5. 6.5  PRU-ICSS
    6. 6.6  Memory Subsystem
      1. 6.6.1 EMIF
      2. 6.6.2 GPMC
      3. 6.6.3 ELM
      4. 6.6.4 OCMC
    7. 6.7  Interprocessor Communication
      1. 6.7.1 MailBox
      2. 6.7.2 Spinlock
    8. 6.8  Interrupt Controller
    9. 6.9  EDMA
    10. 6.10 Peripherals
      1. 6.10.1  VIP
      2. 6.10.2  DSS
      3. 6.10.3  Timers
        1. 6.10.3.1 General-Purpose Timers
        2. 6.10.3.2 32-kHz Synchronized Timer (COUNTER_32K)
        3. 6.10.3.3 Watchdog Timer
      4. 6.10.4  I2C
      5. 6.10.5  UART
        1. 6.10.5.1 UART Features
        2. 6.10.5.2 IrDA Features
        3. 6.10.5.3 CIR Features
      6. 6.10.6  McSPI
      7. 6.10.7  QSPI
      8. 6.10.8  McASP
      9. 6.10.9  USB
      10. 6.10.10 PCIe
      11. 6.10.11 DCAN
      12. 6.10.12 GMAC_SW
      13. 6.10.13 eMMC/SD/SDIO
      14. 6.10.14 GPIO
      15. 6.10.15 ePWM
      16. 6.10.16 eCAP
      17. 6.10.17 eQEP
    11. 6.11 On-chip Debug
  7. 7Applications, Implementation, and Layout
    1. 7.1 Power Supply Mapping
    2. 7.2 DDR3 Board Design and Layout Guidelines
      1. 7.2.1 DDR3 General Board Layout Guidelines
      2. 7.2.2 DDR3 Board Design and Layout Guidelines
        1. 7.2.2.1  Board Designs
        2. 7.2.2.2  DDR3 EMIF
        3. 7.2.2.3  DDR3 Device Combinations
        4. 7.2.2.4  DDR3 Interface Schematic
          1. 7.2.2.4.1 32-Bit DDR3 Interface
          2. 7.2.2.4.2 16-Bit DDR3 Interface
        5. 7.2.2.5  Compatible JEDEC DDR3 Devices
        6. 7.2.2.6  PCB Stackup
        7. 7.2.2.7  Placement
        8. 7.2.2.8  DDR3 Keepout Region
        9. 7.2.2.9  Bulk Bypass Capacitors
        10. 7.2.2.10 High-Speed Bypass Capacitors
          1. 7.2.2.10.1 Return Current Bypass Capacitors
        11. 7.2.2.11 Net Classes
        12. 7.2.2.12 DDR3 Signal Termination
        13. 7.2.2.13 VREF_DDR Routing
        14. 7.2.2.14 VTT
        15. 7.2.2.15 CK and ADDR_CTRL Topologies and Routing Definition
          1. 7.2.2.15.1 Four DDR3 Devices
            1. 7.2.2.15.1.1 CK and ADDR_CTRL Topologies, Four DDR3 Devices
            2. 7.2.2.15.1.2 CK and ADDR_CTRL Routing, Four DDR3 Devices
          2. 7.2.2.15.2 Two DDR3 Devices
            1. 7.2.2.15.2.1 CK and ADDR_CTRL Topologies, Two DDR3 Devices
            2. 7.2.2.15.2.2 CK and ADDR_CTRL Routing, Two DDR3 Devices
          3. 7.2.2.15.3 One DDR3 Device
            1. 7.2.2.15.3.1 CK and ADDR_CTRL Topologies, One DDR3 Device
            2. 7.2.2.15.3.2 CK and ADDR/CTRL Routing, One DDR3 Device
        16. 7.2.2.16 Data Topologies and Routing Definition
          1. 7.2.2.16.1 DQS and DQ/DM Topologies, Any Number of Allowed DDR3 Devices
          2. 7.2.2.16.2 DQS and DQ/DM Routing, Any Number of Allowed DDR3 Devices
        17. 7.2.2.17 Routing Specification
          1. 7.2.2.17.1 CK and ADDR_CTRL Routing Specification
          2. 7.2.2.17.2 DQS and DQ Routing Specification
    3. 7.3 High Speed Differential Signal Routing Guidance
    4. 7.4 Power Distribution Network Implementation Guidance
    5. 7.5 Thermal Solution Guidance
    6. 7.6 Single-Ended Interfaces
      1. 7.6.1 General Routing Guidelines
      2. 7.6.2 QSPI Board Design and Layout Guidelines
    7. 7.7 LJCB_REFN/P Connections
    8. 7.8 Clock Routing Guidelines
      1. 7.8.1 Oscillator Ground Connection
  8. 8Device and Documentation Support
    1. 8.1 Device Nomenclature
      1. 8.1.1 Standard Package Symbolization
      2. 8.1.2 Device Naming Convention
    2. 8.2 Tools and Software
    3. 8.3 Documentation Support
    4. 8.4 Related Links
    5. 8.5 Support Resources
    6. 8.6 Trademarks
    7. 8.7 Electrostatic Discharge Caution
    8. 8.8 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • CBD|538
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.10.6.8.3 GPMC/NAND Flash Interface Asynchronous Timing

CAUTION

The I/O Timings provided in this section are valid only for some GPMC usage modes when the corresponding Virtual I/O Timings or Manual I/O Timings are configured as described in the tables found in this section.

Table 5-54 and Table 5-55 assume testing over the recommended operating conditions and electrical characteristic conditions below (see Figure 5-32, Figure 5-33, Figure 5-34 and Figure 5-35).

Table 5-54 GPMC/NAND Flash Interface Timing Requirements

NO. PARAMETER DESCRIPTION MIN MAX UNIT
GNF12 tacc(DAT) Data maximum access time (GPMC_FCLK Cycles) J (1) cycles
- tsu(DV-OEH) Setup time, read gpmc_ad[15:0] valid before gpmc_oen_ren high 1.9 ns
- th(OEH-DV) Hold time, read gpmc_ad[15:0] valid after gpmc_oen_ren high 1 ns
  1. J = AccessTime × (TimeParaGranularity + 1)

Table 5-55 GPMC/NAND Flash Interface Switching Characteristics

NO. PARAMETER DESCRIPTION MIN MAX UNIT
- tr(DO) Rising time, gpmc_ad[15:0] output data 0.447 4.067 ns
- tf(DO) Fallling time, gpmc_ad[15:0] output data 0.43 4.463 ns
GNF0 tw(nWEV) Pulse duration, gpmc_wen valid time A (1) ns
GNF1 td(nCSV-nWEV) Delay time, gpmc_cs[7:0] valid to gpmc_wen valid B - 2 (2) B + 4 (2) ns
GNF2 td(CLEH-nWEV) Delay time, gpmc_ben[1:0] high to gpmc_wen valid C - 2 (3) C + 4 (3) ns
GNF3 td(nWEV-DV) Delay time, gpmc_ad[15:0] valid to gpmc_wen valid D - 2 (4) D + 4 (4) ns
GNF4 td(nWEIV-DIV) Delay time, gpmc_wen invalid to gpmc_ad[15:0] invalid E - 2 (5) E + 4 (5) ns
GNF5 td(nWEIV-CLEIV) Delay time, gpmc_wen invalid to gpmc_ben[1:0] invalid F - 2 (6) F + 4 (6) ns
GNF6 td(nWEIV-nCSIV) Delay time, gpmc_wen invalid to gpmc_cs[7:0] invalid G - 2 (7) G + 4 (7) ns
GNF7 td(ALEH-nWEV) Delay time, gpmc_advn_ale high to gpmc_wen valid C - 2 (3) C + 4 (3) ns
GNF8 td(nWEIV-ALEIV) Delay time, gpmc_wen invalid to gpmc_advn_ale invalid F - 2 (6) F + 4 (6) ns
GNF9 tc(nWE) Cycle time, write cycle time H (8) ns
GNF10 td(nCSV-nOEV) Delay time, gpmc_cs[7:0] valid to gpmc_oen_ren valid I - 2 (9) I + 4 (9) ns
GNF13 tw(nOEV) Pulse duration, gpmc_oen_ren valid time K (10) ns
GNF14 tc(nOE) Cycle time, read cycle time L (11) ns
GNF15 td(nOEIV-nCSIV) Delay time, gpmc_oen_ren invalid to gpmc_cs[7:0] invalid M - 2 (12) M + 4 (12) ns
  1. A = (WEOffTime – WEOnTime) × (TimeParaGranularity + 1) × GPMC_FCLK
  2. B = ((WEOnTime – CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (WEExtraDelay – CSExtraDelay)) × GPMC_FCLK
  3. C = ((WEOnTime – ADVOnTime) × (TimeParaGranularity + 1) + 0.5 × (WEExtraDelay – ADVExtraDelay)) × GPMC_FCLK
  4. D = (WEOnTime × (TimeParaGranularity + 1) + 0.5 × WEExtraDelay ) × GPMC_FCLK
  5. E = (WrCycleTime – WEOffTime × (TimeParaGranularity + 1) – 0.5 × WEExtraDelay ) × GPMC_FCLK
  6. F = (ADVWrOffTime – WEOffTime × (TimeParaGranularity + 1) + 0.5 × (ADVExtraDelay – WEExtraDelay ) × GPMC_FCLK
  7. G = (CSWrOffTime – WEOffTime × (TimeParaGranularity + 1) + 0.5 × (CSExtraDelay – WEExtraDelay ) × GPMC_FCLK
  8. H = WrCycleTime × (1 + TimeParaGranularity) × GPMC_FCLK
  9. I = ((OEOffTime + (n – 1) × PageBurstAccessTime – CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (OEExtraDelay – CSExtraDelay)) × GPMC_FCLK
  10. K = (OEOffTime – OEOnTime) × (1 + TimeParaGranularity) × GPMC_FCLK
  11. L = RdCycleTime × (1 + TimeParaGranularity) × GPMC_FCLK
  12. M = (CSRdOffTime – OEOffTime × (TimeParaGranularity + 1) + 0.5 × (CSExtraDelay – OEExtraDelay ) × GPMC_FCLK
AM5706 AM5708 SPRS906_TIMING_GPMC_13.gifFigure 5-32 GPMC / NAND Flash - Command Latch Cycle Timing(1)
  1. In gpmc_csi, i = 0 to 7.
AM5706 AM5708 SPRS906_TIMING_GPMC_14.gifFigure 5-33 GPMC / NAND Flash - Address Latch Cycle Timing(1)
  1. In gpmc_csi, i = 0 to 7.
AM5706 AM5708 SPRS906_TIMING_GPMC_15.gifFigure 5-34 GPMC / NAND Flash - Data Read Cycle Timing(1)(2)(3)
  1. GNF12 parameter illustrates amount of time required to internally sample input Data. It is expressed in number of GPMC functional clock cycles. From start of read cycle and after GNF12 functional clock cycles, input data will be internally sampled by active functional clock edge. GNF12 value must be stored inside AccessTime register bits field.
  2. GPMC_FCLK is an internal clock (GPMC functional clock) not provided externally.
  3. In gpmc_csi, i = 0 to 7. In gpmc_waitj, j = 0 to 1.
AM5706 AM5708 SPRS906_TIMING_GPMC_16.gifFigure 5-35 GPMC / NAND Flash - Data Write Cycle Timing(1)
  1. In gpmc_csi, i = 0 to 7.

NOTE

To configure the desired virtual mode the user must set MODESELECT bit and DELAYMODE bitfield for each corresponding pad control register.

The pad control registers are presented in Table 4-31 and described in Device TRM, Control Module Chapter.

Virtual IO Timings Modes must be used to ensure some IO timings for GPMC. See Table 5-30Modes Summary for a list of IO timings requiring the use of Virtual IO Timings Modes. See Table 5-56Virtual Functions Mapping for GPMC for a definition of the Virtual modes.

Table 5-56 presents the values for DELAYMODE bitfield.

Table 5-56 Virtual Functions Mapping for GPMC

BALL BALL NAME Delay Mode Value MUXMODE
GPMC_VIRTUAL1 0 1 2 3 5 6 14(1) 14(1)
H5 gpmc_advn_ale 15 gpmc_advn_ale gpmc_cs6 gpmc_wait1 gpmc_a2 gpmc_a23
B4 gpmc_ad15 13 gpmc_ad15
B1 gpmc_ad6 13 gpmc_ad6
E1 gpmc_ad2 13 gpmc_ad2
E10 vin2a_d9 9 gpmc_a25
G6 gpmc_wen 15 gpmc_wen
A3 gpmc_ad14 13 gpmc_ad14
H3 gpmc_a13 15 gpmc_a13
K4 gpmc_a8 14 gpmc_a8
H4 gpmc_a14 15 gpmc_a14
D1 gpmc_ad4 13 gpmc_ad4
A5 gpmc_a26 15 gpmc_a26 gpmc_a20
F1 gpmc_ad0 13 gpmc_ad0
F6 gpmc_wait0 15 gpmc_wait0
C10 vin2a_d11 9 gpmc_a23
E2 gpmc_ad1 13 gpmc_ad1
C4 gpmc_ad13 13 gpmc_ad13
L2 gpmc_a2 14 gpmc_a2
D2 gpmc_ad5 13 gpmc_ad5
B10 vin2a_d8 9 gpmc_a26
F3 gpmc_cs0 15 gpmc_cs0
E8 vin2a_hsync0 9 gpmc_a27
K3 gpmc_a4 14 gpmc_a4
H2 gpmc_ben0 15 gpmc_ben0 gpmc_cs4
J1 gpmc_a6 14 gpmc_a6
K6 gpmc_a15 15 gpmc_a15
B3 gpmc_ad11 13 gpmc_ad11
K5 gpmc_a16 15 gpmc_a16
M2 gpmc_a1 14 gpmc_a1
D7 gpmc_a24 15 gpmc_a24 gpmc_a18
B5 gpmc_a23 15 gpmc_a23 gpmc_a17
C2 gpmc_ad8 13 gpmc_ad8
A2 gpmc_ad10 13 gpmc_ad10
C3 gpmc_ad12 13 gpmc_ad12
E7 gpmc_a20 15 gpmc_a20 gpmc_a14
D10 vin2a_d10 9 gpmc_a24
G3 gpmc_cs3 14 gpmc_cs3 gpmc_a1
G5 gpmc_oen_ren 15 gpmc_oen_ren
H1 gpmc_a9 14 gpmc_a9
A6 gpmc_cs1 15 gpmc_cs1 gpmc_a22
C1 gpmc_ad3 13 gpmc_ad3
B2 gpmc_ad7 13 gpmc_ad7
K1 gpmc_a7 14 gpmc_a7
L1 gpmc_a3 14 gpmc_a3
H6 gpmc_ben1 15 gpmc_ben1 gpmc_cs5 gpmc_a3
L4 gpmc_clk 15 gpmc_clk gpmc_cs7 gpmc_wait1
C5 gpmc_a22 15 gpmc_a22 gpmc_a16
G4 gpmc_cs2 15 gpmc_cs2
C7 vin2a_fld0 11 gpmc_a27 gpmc_a18
J2 gpmc_a10 14 gpmc_a10
G1 gpmc_a12 15 gpmc_a12 gpmc_a0
G2 gpmc_a17 15 gpmc_a17
K2 gpmc_a5 14 gpmc_a5
D6 gpmc_a21 15 gpmc_a21 gpmc_a15
B6 gpmc_a27 15 gpmc_a27 gpmc_a21
D3 gpmc_ad9 13 gpmc_ad9
A4 gpmc_a19 15 gpmc_a19 gpmc_a13
C6 gpmc_a25 15 gpmc_a25 gpmc_a19
M1 gpmc_a0 14 gpmc_a0
D8 vin2a_clk0 11 gpmc_a27 gpmc_a17
F2 gpmc_a18 15 gpmc_a18
L3 gpmc_a11 14 gpmc_a11
  1. Some signals listed are virtual functions that present alternate multiplexing options. These virtual functions are controlled via CTRL_CORE_ALT_SELECT_MUX or CTRL_CORE_VIP_MUX_SELECT registers. For more information on how to use these options, please refer to Device TRM, Chapter Control Module, Section Pad Configuration Registers.