SPRS999 August   2017 AM5718-HIREL

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2 Revision History
  3. 3  Device Comparison
    1. 3.1 Device Comparison Table
  4. 4  Terminal Configuration and Functions
    1. 4.1 Terminal Assignment
      1. 4.1.1 Unused Balls Connection Requirements
    2. 4.2 Ball Characteristics
    3. 4.3 Multiplexing Characteristics
    4. 4.4 Signal Descriptions
      1. 4.4.1  Video Input Ports (VIP)
      2. 4.4.2  Display Subsystem - Video Output Ports
      3. 4.4.3  Display Subsystem - High-Definition Multimedia Interface (HDMI)
      4. 4.4.4  Camera Serial Interface 2 CAL bridge (CSI2)
      5. 4.4.5  External Memory Interface (EMIF)
      6. 4.4.6  General-Purpose Memory Controller (GPMC)
      7. 4.4.7  Timers
      8. 4.4.8  Inter-Integrated Circuit Interface (I2C)
      9. 4.4.9  HDQ / 1-Wire Interface (HDQ1W)
      10. 4.4.10 Universal Asynchronous Receiver Transmitter (UART)
      11. 4.4.11 Multichannel Serial Peripheral Interface (McSPI)
      12. 4.4.12 Quad Serial Peripheral Interface (QSPI)
      13. 4.4.13 Multichannel Audio Serial Port (McASP)
      14. 4.4.14 Universal Serial Bus (USB)
      15. 4.4.15 SATA
      16. 4.4.16 Peripheral Component Interconnect Express (PCIe)
      17. 4.4.17 Controller Area Network Interface (DCAN)
      18. 4.4.18 Ethernet Interface (GMAC_SW)
      19. 4.4.19 Media Local Bus (MLB) Interface
      20. 4.4.20 eMMC/SD/SDIO
      21. 4.4.21 General-Purpose Interface (GPIO)
      22. 4.4.22 Keyboard controller (KBD)
      23. 4.4.23 Pulse Width Modulation (PWM) Interface
      24. 4.4.24 Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-ICSS)
      25. 4.4.25 Test Interfaces
      26. 4.4.26 System and Miscellaneous
        1. 4.4.26.1 Sysboot
        2. 4.4.26.2 Power, Reset, and Clock Management (PRCM)
        3. 4.4.26.3 Real-Time Clock (RTC) Interface
        4. 4.4.26.4 System Direct Memory Access (SDMA)
        5. 4.4.26.5 Interrupt Controllers (INTC)
        6. 4.4.26.6 Observability
      27. 4.4.27 Power Supplies
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Power On Hours (POH) Limits
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Operating Performance Points
      1. 5.5.1 AVS and ABB Requirements
      2. 5.5.2 Voltage And Core Clock Specifications
      3. 5.5.3 Maximum Supported Frequency
    6. 5.6 Power Consumption Summary
    7. 5.7 Electrical Characteristics
      1. 5.7.1  LVCMOS DDR DC Electrical Characteristics
      2. 5.7.2  HDMIPHY DC Electrical Characteristics
      3. 5.7.3  Dual Voltage LVCMOS I2C DC Electrical Characteristics
      4. 5.7.4  IQ1833 Buffers DC Electrical Characteristics
      5. 5.7.5  IHHV1833 Buffers DC Electrical Characteristics
      6. 5.7.6  LVCMOS OSC Buffers DC Electrical Characteristics
      7. 5.7.7  LVCMOS CSI2 DC Electrical Characteristics
      8. 5.7.8  BMLB18 Buffers DC Electrical Characteristics
      9. 5.7.9  BC1833IHHV Buffers DC Electrical Characteristics
      10. 5.7.10 USBPHY DC Electrical Characteristics
      11. 5.7.11 Dual Voltage SDIO1833 DC Electrical Characteristics
      12. 5.7.12 Dual Voltage LVCMOS DC Electrical Characteristics
      13. 5.7.13 SATAPHY DC Electrical Characteristics
      14. 5.7.14 SERDES DC Electrical Characteristics
    8. 5.8 Thermal Characteristics
      1. 5.8.1 Package Thermal Characteristics
    9. 5.9 Power Supply Sequences
  6. 6 Clock Specifications
    1. 6.1 Input Clock Specifications
      1. 6.1.1 Input Clock Requirements
      2. 6.1.2 System Oscillator OSC0 Input Clock
        1. 6.1.2.1 OSC0 External Crystal
        2. 6.1.2.2 OSC0 Input Clock
      3. 6.1.3 Auxiliary Oscillator OSC1 Input Clock
        1. 6.1.3.1 OSC1 External Crystal
        2. 6.1.3.2 OSC1 Input Clock
      4. 6.1.4 RTC Oscillator Input Clock
        1. 6.1.4.1 RTC Oscillator External Crystal
        2. 6.1.4.2 RTC Oscillator Input Clock
    2. 6.2 DPLLs, DLLs Specifications
      1. 6.2.1 DPLL Characteristics
      2. 6.2.2 DLL Characteristics
  7. 7 Timing Requirements and Switching Characteristics
    1. 7.1  Timing Test Conditions
    2. 7.2  Interface Clock Specifications
      1. 7.2.1 Interface Clock Terminology
      2. 7.2.2 Interface Clock Frequency
    3. 7.3  Timing Parameters and Information
      1. 7.3.1 Parameter Information
        1. 7.3.1.1 1.8V and 3.3V Signal Transition Levels
        2. 7.3.1.2 1.8V and 3.3V Signal Transition Rates
        3. 7.3.1.3 Timing Parameters and Board Routing Analysis
    4. 7.4  Recommended Clock and Control Signal Transition Behavior
    5. 7.5  Virtual and Manual I/O Timing Modes
    6. 7.6  Video Input Ports (VIP)
    7. 7.7  Display Subsystem - Video Output Ports
    8. 7.8  Display Subsystem - High-Definition Multimedia Interface (HDMI)
    9. 7.9  Camera Serial Interface 2 CAL bridge (CSI2)
      1. 7.9.1 CSI-2 MIPI D-PHY-1.5 V and 1.8 V
    10. 7.10 External Memory Interface (EMIF)
    11. 7.11 General-Purpose Memory Controller (GPMC)
      1. 7.11.1 GPMC/NOR Flash Interface Synchronous Timing
      2. 7.11.2 GPMC/NOR Flash Interface Asynchronous Timing
      3. 7.11.3 GPMC/NAND Flash Interface Asynchronous Timing
    12. 7.12 Timers
    13. 7.13 Inter-Integrated Circuit Interface (I2C)
    14. 7.14 HDQ / 1-Wire Interface (HDQ1W)
      1. 7.14.1 HDQ / 1-Wire - HDQ Mode
      2. 7.14.2 HDQ/1-Wire-1-Wire Mode
    15. 7.15 Universal Asynchronous Receiver Transmitter (UART)
    16. 7.16 Multichannel Serial Peripheral Interface (McSPI)
    17. 7.17 Quad Serial Peripheral Interface (QSPI)
    18. 7.18 Multichannel Audio Serial Port (McASP)
    19. 7.19 Universal Serial Bus (USB)
      1. 7.19.1 USB1 DRD PHY
      2. 7.19.2 USB2 PHY
    20. 7.20 Serial Advanced Technology Attachment (SATA)
    21. 7.21 Peripheral Component Interconnect Express (PCIe)
    22. 7.22 Controller Area Network Interface (DCAN)
    23. 7.23 Ethernet Interface (GMAC_SW)
      1. 7.23.1 GMAC MII Timings
      2. 7.23.2 GMAC MDIO Interface Timings
      3. 7.23.3 GMAC RMII Timings
      4. 7.23.4 GMAC RGMII Timings
    24. 7.24 eMMC/SD/SDIO
      1. 7.24.1 MMC1-SD Card Interface
        1. 7.24.1.1 Default speed, 4-bit data, SDR, half-cycle
        2. 7.24.1.2 High speed, 4-bit data, SDR, half-cycle
        3. 7.24.1.3 SDR12, 4-bit data, half-cycle
        4. 7.24.1.4 SDR25, 4-bit data, half-cycle
        5. 7.24.1.5 UHS-I SDR50, 4-bit data, half-cycle
        6. 7.24.1.6 UHS-I SDR104, 4-bit data, half-cycle
        7. 7.24.1.7 UHS-I DDR50, 4-bit data
      2. 7.24.2 MMC2 - eMMC
        1. 7.24.2.1 Standard JC64 SDR, 8-bit data, half cycle
        2. 7.24.2.2 High-speed JC64 SDR, 8-bit data, half cycle
        3. 7.24.2.3 High-speed HS200 JEDS84, 8-bit data, half cycle
        4. 7.24.2.4 High-speed JC64 DDR, 8-bit data
      3. 7.24.3 MMC3 and MMC4-SDIO/SD
        1. 7.24.3.1 MMC3 and MMC4, SD Default Speed
        2. 7.24.3.2 MMC3 and MMC4, SD High Speed
        3. 7.24.3.3 MMC3 and MMC4, SD and SDIO SDR12 Mode
        4. 7.24.3.4 MMC3 and MMC4, SD SDR25 Mode
        5. 7.24.3.5 MMC3 SDIO High-Speed UHS-I SDR50 Mode, Half Cycle
    25. 7.25 General-Purpose Interface (GPIO)
    26. 7.26 PRU-ICSS Interfaces
      1. 7.26.1 Programmable Real-Time Unit (PRU-ICSS PRU)
        1. 7.26.1.1 PRU-ICSS PRU Direct Input/Output Mode Electrical Data and Timing
        2. 7.26.1.2 PRU-ICSS PRU Parallel Capture Mode Electrical Data and Timing
        3. 7.26.1.3 PRU-ICSS PRU Shift Mode Electrical Data and Timing
        4. 7.26.1.4 PRU-ICSS PRU Sigma Delta and EnDAT Modes
      2. 7.26.2 PRU-ICSS EtherCAT (PRU-ICSS ECAT)
        1. 7.26.2.1 PRU-ICSS ECAT Electrical Data and Timing
      3. 7.26.3 PRU-ICSS MII_RT and Switch
        1. 7.26.3.1 PRU-ICSS MDIO Electrical Data and Timing
        2. 7.26.3.2 PRU-ICSS MII_RT Electrical Data and Timing
      4. 7.26.4 PRU-ICSS Universal Asynchronous Receiver Transmitter (PRU-ICSS UART)
      5. 7.26.5 PRU-ICSS Manual Functional Mapping
    27. 7.27 System and Miscellaneous interfaces
    28. 7.28 Test Interfaces
      1. 7.28.1 IEEE 1149.1 Standard-Test-Access Port (JTAG)
        1. 7.28.1.1 JTAG Electrical Data/Timing
      2. 7.28.2 Trace Port Interface Unit (TPIU)
        1. 7.28.2.1 TPIU PLL DDR Mode
  8. 8 Applications, Implementation, and Layout
    1. 8.1 Power Supply Mapping
    2. 8.2 DDR3 Board Design and Layout Guidelines
      1. 8.2.1 DDR3 General Board Layout Guidelines
      2. 8.2.2 DDR3 Board Design and Layout Guidelines
        1. 8.2.2.1  Board Designs
        2. 8.2.2.2  DDR3 EMIF
        3. 8.2.2.3  DDR3 Device Combinations
        4. 8.2.2.4  DDR3 Interface Schematic
          1. 8.2.2.4.1 32-Bit DDR3 Interface
          2. 8.2.2.4.2 16-Bit DDR3 Interface
        5. 8.2.2.5  Compatible JEDEC DDR3 Devices
        6. 8.2.2.6  PCB Stackup
        7. 8.2.2.7  Placement
        8. 8.2.2.8  DDR3 Keepout Region
        9. 8.2.2.9  Bulk Bypass Capacitors
        10. 8.2.2.10 High-Speed Bypass Capacitors
          1. 8.2.2.10.1 Return Current Bypass Capacitors
        11. 8.2.2.11 Net Classes
        12. 8.2.2.12 DDR3 Signal Termination
        13. 8.2.2.13 VREF_DDR Routing
        14. 8.2.2.14 VTT
        15. 8.2.2.15 CK and ADDR_CTRL Topologies and Routing Definition
          1. 8.2.2.15.1 Four DDR3 Devices
            1. 8.2.2.15.1.1 CK and ADDR_CTRL Topologies, Four DDR3 Devices
            2. 8.2.2.15.1.2 CK and ADDR_CTRL Routing, Four DDR3 Devices
          2. 8.2.2.15.2 Two DDR3 Devices
            1. 8.2.2.15.2.1 CK and ADDR_CTRL Topologies, Two DDR3 Devices
            2. 8.2.2.15.2.2 CK and ADDR_CTRL Routing, Two DDR3 Devices
          3. 8.2.2.15.3 One DDR3 Device
            1. 8.2.2.15.3.1 CK and ADDR_CTRL Topologies, One DDR3 Device
            2. 8.2.2.15.3.2 CK and ADDR/CTRL Routing, One DDR3 Device
        16. 8.2.2.16 Data Topologies and Routing Definition
          1. 8.2.2.16.1 DQS and DQ/DM Topologies, Any Number of Allowed DDR3 Devices
          2. 8.2.2.16.2 DQS and DQ/DM Routing, Any Number of Allowed DDR3 Devices
        17. 8.2.2.17 Routing Specification
          1. 8.2.2.17.1 CK and ADDR_CTRL Routing Specification
          2. 8.2.2.17.2 DQS and DQ Routing Specification
    3. 8.3 High Speed Differential Signal Routing Guidance
    4. 8.4 Power Distribution Network Implementation Guidance
    5. 8.5 Single-Ended Interfaces
      1. 8.5.1 General Routing Guidelines
      2. 8.5.2 QSPI Board Design and Layout Guidelines
    6. 8.6 Clock Routing Guidelines
      1. 8.6.1 32-kHz Oscillator Routing
      2. 8.6.2 Oscillator Ground Connection
  9. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Receiving Notification of Documentation Updates
    5. 9.5 Community Resources
    6. 9.6 Trademarks
    7. 9.7 Electrostatic Discharge Caution
    8. 9.8 Glossary
  10. 10Mechanical Packaging and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZBO|760
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Clock Specifications

NOTE

For more information, see Power, Reset, and Clock Management / PRCM Environment / External Clock Signal and Power Reset / PRCM Functional Description / PRCM Clock Manager Functional Description section of the Device TRM.

NOTE

Audio Back End (ABE) module is not supported for this family of devices, but “ABE” name is still present in some clock or DPLL names.

The device operation requires the following clocks:

  • The 32 kHz frequency is used for low frequency operation. It supplies the wake-up domain for operation in lowest power mode. This is an optional clock and will be supplied by on chip divider + mux (FUNC_32K_CLK) incase it is not available on external pin.
  • The system clocks, SYS_CLKIN1(Mandatory) and SYS_CLKIN2(Optional) are the main clock sources of the device. They supply the reference clock to the DPLLs as well as functional clock to several modules.

The Device also embeds an internal free-running 32-kHz oscillator that is always active as long as the the wake-up (WKUP) domain is supplied.

Figure 6-1 shows the external input clock sources and the output clocks to peripherals.

AM5718-HIREL SPRS906_CLK_01.gif Figure 6-1 Clock Interface

6.1 Input Clock Specifications

6.1.1 Input Clock Requirements

  • The source of the internal system clock (SYS_CLK1) could be either:
    • A CMOS clock that enters on the xi_osc0 ball (with xo_osc0 left unconnected on the CMOS clock case).
    • A crystal oscillator clock managed by xi_osc0 and xo_osc0.
  • The source of the internal system clock (SYS_CLK2) could be either:
    • A CMOS clock that enters on the xi_osc1 ball (with xo_osc1 left unconnected on the CMOS clock case).
    • A crystal oscillator clock managed by xi_osc1 and xo_osc1.
  • The source of the internal system clock (SYS_32K) could be either:
    • A CMOS clock that enters on the rtc_osc_xi_clkin32 ball and supports external LVCMOS clock generators
    • A crystal oscillator clock managed by rtc_osc_xi_clkin32 and rtc_osc_xo.

6.1.2 System Oscillator OSC0 Input Clock

SYS_CLKIN1 is received directly from oscillator OSC0. For more information about SYS_CLKIN1 see Device TRM, Chapter: Power, Reset, and Clock Management.

6.1.2.1 OSC0 External Crystal

An external crystal is connected to the device pins. Figure 6-2 describes the crystal implementation.

AM5718-HIREL clock_adas_abc_003.gif Figure 6-2 Crystal Implementation

NOTE

The load capacitors,Cf1 and Cf2 in Figure 6-2, should be chosen such that the below equation is satisfied. CL in the equation is the load specified by the crystal manufacturer. All discrete components used to implement the oscillator circuit should be placed as close as possible to the associated oscillator xi_osc0, xo_osc0, and vssa_osc0 pins.
AM5718-HIREL clock_adas_equation.gif Figure 6-3 Load Capacitance Equation

The crystal must be in the fundamental mode of operation and parallel resonant. Table 6-1 summarizes the required electrical constraints.

Table 6-1 OSC0 Crystal Electrical Characteristics

NAME DESCRIPTION MIN TYP MAX UNIT
fp Parallel resonance crystal frequency 19.2, 20, 27 MHz
Cf1 Cf1 load capacitance for crystal parallel resonance with Cf1 = Cf2 12 24 pF
Cf2 Cf2 load capacitance for crystal parallel resonance with Cf1 = Cf2 12 24 pF
ESR(Cf1,Cf2) (1) Crystal ESR 100 Ω
CO Crystal shunt capacitance ESR = 30 Ω
ESR = 40 Ω		 19.2 MHz, 20 MHz, 27 MHz 7 pF
ESR = 50 Ω 19.2 MHz, 20 MHz 7 pF
27 MHz 5 pF
ESR = 60 Ω 19.2 MHz, 20 MHz 7 pF
27 MHz Not Supported -
ESR = 80 Ω 19.2 MHz, 20 MHz 5 pF
27 MHz Not Supported -
ESR = 100 Ω 19.2 MHz, 20 MHz 3 pF
27 MHz Not Supported -
LM Crystal motional inductance for fp = 20 MHz 10.16 mH
CM Crystal motional capacitance 3.42 fF
tj(xiosc0) Frequency accuracy (1), xi_osc0 Ethernet not used ±200 ppm
Ethernet RGMII and RMII using derived clock ±50
Ethernet MII using derived clock ±100
  1. Crystal characteristics should account for tolerance+stability+aging.

When selecting a crystal, the system design must take into account the temperature and aging characteristics of a crystal versus the user environment and expected lifetime of the system.

Table 6-2 details the switching characteristics of the oscillator and the requirements of the input clock.

Table 6-2 Oscillator Switching Characteristics—Crystal Mode

NAME DESCRIPTION MIN TYP MAX UNIT
fp Oscillation frequency 19.2, 20, 27 MHz MHz
tsX Start-up time 4 ms

6.1.2.2 OSC0 Input Clock

A 1.8-V LVCMOS-Compatible Clock Input can be used instead of the internal oscillator to provide the SYS_CLKIN1 clock input to the system. The external connections to support this are shown in Figure 6-4. The xi_osc0 pin is connected to the 1.8-V LVCMOS-Compatible clock source. The xi_osc0 pin is left unconnected. The vssa_osc0 pin is connected to board ground (VSS).

AM5718-HIREL SPRS906_CLK_04.gif Figure 6-4 1.8-V LVCMOS-Compatible Clock Input

Table 6-3 summarizes the OSC0 input clock electrical characteristics.

Table 6-3 OSC0 Input Clock Electrical Characteristics—Bypass Mode

NAME DESCRIPTION MIN TYP MAX UNIT
f Frequency 19.2, 20, 27 MHz
CIN Input capacitance 2.184 2.384 2.584 pF
IIN Input current (3.3V mode) 4 6 10 µA

Table 6-4 details the OSC0 input clock timing requirements.

Table 6-4 OSC0 Input Clock Timing Requirements

NAME DESCRIPTION MIN TYP MAX UNIT
CK0 1 / tc(xiosc0) Frequency, xi_osc0 19.2, 20, 27 MHz
CK1 tw(xiosc0) Pulse duration, xi_osc0 low or high

0.45 * tc(xiosc0)

0.55 * tc(xiosc0) ns
tj(xiosc0) Period jitter(1), xi_osc0 0.01 × tc(xiosc0) ns
tR(xiosc0) Rise time, xi_osc0 5 ns
tF(xiosc0) Fall time, xi_osc0 5 ns
tj(xiosc0) Frequency accuracy(4), xi_osc0 Ethernet not used ±200 ppm
Ethernet RGMII and RMII using derived clock ±50
Ethernet MII using derived clock ±100
  1. Period jitter is meant here as follows:

    2. – The maximum value is the difference between the longest measured clock period and the expected clock period

    – The minimum value is the difference between the shortest measured clock period and the expected clock period

  2. Crystal characteristics should account for tolerance+stability+aging.
AM5718-HIREL SPRS906_CLK_05.gif Figure 6-5 xi_osc0 Input Clock

6.1.3 Auxiliary Oscillator OSC1 Input Clock

SYS_CLKIN2 is received directly from oscillator OSC1. For more information about SYS_CLKIN2 see Device TRM, Chapter: Power, Reset, and Clock Management.

6.1.3.1 OSC1 External Crystal

An external crystal is connected to the device pins. Figure 6-6 describes the crystal implementation.

AM5718-HIREL clock_adas_abc_005.gif Figure 6-6 Crystal Implementation

NOTE

The load capacitors, Cf1 and Cf2 in Figure 6-6, should be chosen such that the below equation is satisfied. CL in the equation is the load specified by the crystal manufacturer. All discrete components used to implement the oscillator circuit should be placed as close as possible to the associated oscillator xi_osc1, xo_osc1, and vssa_osc1 pins.
AM5718-HIREL clock_adas_equation.gif Figure 6-7 Load Capacitance Equation

The crystal must be in the fundamental mode of operation and parallel resonant. Table 6-5 summarizes the required electrical constraints.

Table 6-5 OSC1 Crystal Electrical Characteristics

NAME DESCRIPTION MIN TYP MAX UNIT
fp Parallel resonance crystal frequency Range from 19.2 to 32 MHz
Cf1 Cf1 load capacitance for crystal parallel resonance with Cf1 = Cf2 12 24 pF
Cf2 Cf2 load capacitance for crystal parallel resonance with Cf1 = Cf2 12 24 pF
ESR(Cf1,Cf2) Crystal ESR 100 Ω
CO Crystal shunt capacitance ESR = 30 Ω 19.2 MHz ≤ fp ≤ 32 MHz 7 pF
ESR = 40 Ω 19.2 MHz ≤ fp ≤ 32 MHz 5 pF
ESR = 50 Ω 19.2 MHz ≤ fp ≤ 25 MHz 7 pF
25 MHz < fp ≤ 27 MHz 5 pF
27 MHz < fp ≤ 32 MHz Not Supported -
ESR = 60 Ω 19.2 MHz ≤ fp ≤ 23 MHz 7 pF
23 MHz < fp ≤ 25 MHz 5 pF
25 MHz < fp ≤ 32 MHz Not Supported -
ESR = 80 Ω 19.2 MHz ≤ fp ≤ 23 MHz 5 pF
23 MHz ≤ fp ≤ 25 MHz 3 pF
25 MHz < fp ≤ 32 MHz Not Supported -
ESR = 100 Ω 19.2 MHz ≤ fp ≤ 20 MHz 3 pF
20 MHz < fp ≤ 32 MHz Not Supported -
LM Crystal motional inductance for fp = 20 MHz 10.16 mH
CM Crystal motional capacitance 3.42 fF
tj(xiosc1) Frequency accuracy(1), xi_osc1 Ethernet not used ±200 ppm
Ethernet RGMII and RMII using derived clock ±50
Ethernet MII using derived clock ±100
  1. Crystal characteristics should account for tolerance+stability+aging.

When selecting a crystal, the system design must take into account the temperature and aging characteristics of a crystal versus the user environment and expected lifetime of the system.

Table 6-6 details the switching characteristics of the oscillator and the requirements of the input clock.

Table 6-6 Oscillator Switching Characteristics—Crystal Mode

NAME DESCRIPTION MIN TYP MAX UNIT
fp Oscillation frequency Range from 19.2 to 32 MHz
tsX Start-up time 4 ms

6.1.3.2 OSC1 Input Clock

A 1.8-V LVCMOS-Compatible Clock Input can be used instead of the internal oscillator to provide the SYS_CLKIN2 clock input to the system. The external connections to support this are shown in, Figure 6-8. The xi_osc1 pin is connected to the 1.8-V LVCMOS-Compatible clock sources. The xo_osc1 pin is left unconnected. The vssa_osc1 pin is connected to board ground (vss).

AM5718-HIREL SPRS906_CLK_07.gif Figure 6-8 1.8-V LVCMOS-Compatible Clock Input

Table 6-7 summarizes the OSC1 input clock electrical characteristics.

Table 6-7 OSC1 Input Clock Electrical Characteristics—Bypass Mode

NAME DESCRIPTION MIN TYP MAX UNIT
f Frequency Range from 12 to 38.4 MHz
CIN Input capacitance 2.819 3.019 3.219 pF
IIN Input current (3.3V mode) 4 6 10 µA
tsX Start-up time(1) See(2) ms
  1. To switch from bypass mode to crystal or from crystal mode to bypass mode, there is a waiting time about 100 μs; however, if the chip comes from bypass mode to crystal mode the crystal will start-up after time mentioned in Table 6-6, tsX parameter.
  2. Before the processor boots up and the oscillator is set to bypass mode, there is a waiting time when the internal oscillator is in application mode and receives a wave. The switching time in this case is about 100 μs.

Table 6-8 details the OSC1 input clock timing requirements.

Table 6-8 OSC1 Input Clock Timing Requirements

NAME DESCRIPTION MIN TYP MAX UNIT
CK0 1 / tc(xiosc1) Frequency, xi_osc1 Range from 12 to 38.4 MHz
CK1 tw(xiosc1) Pulse duration, xi_osc1 low or high 0.45 * tc(xiosc1) 0.55 * tc(xiosc1) ns
tj(xiosc1) Period jitter(1), xi_osc1 0.01 × tc(xiosc1) (3) ns
tR(xiosc1) Rise time, xi_osc1 5 ns
tF(xiosc1) Fall time, xi_osc1 5 ns
tj(xiosc1) Frequency accuracy(2), xi_osc1 Ethernet not used ±200 ppm
Ethernet RGMII and RMII using derived clock ±50
Ethernet MII using derived clock ±100
  1. Period jitter is meant here as follows:
    • The maximum value is the difference between the longest measured clock period and the expected clock period
    • The minimum value is the difference between the shortest measured clock period and the expected clock period
  2. Crystal characteristics should account for tolerance+stability+aging.
  3. The Period jitter requirement for osc1 can be relaxed to 0.02*tc(xiosc1) under the following constraints:
    a.The osc1/SYS_CLK2 clock bypasses all device PLLs
    b.The osc1/SYS_CLK2 clock is only used to source the DSS pixel clock outputs
AM5718-HIREL SPRS906_CLK_08.gif Figure 6-9 xi_osc1 Input Clock

6.1.4 RTC Oscillator Input Clock

SYS_32K is received directly from RTC Oscillator. For more information about SYS_32K see the Device TRM, Power, Reset, and Clock Management chapter.

NOTE

RTC only mode is not supported feature.

6.1.4.1 RTC Oscillator External Crystal

An external crystal is connected to the device pins. Figure 6-2 describes the crystal implementation.

AM5718-HIREL SPRS906_CLK_09.gif Figure 6-10 Crystal Implementation

NOTE

The load capacitors, Cf1 and Cf2 in Figure 6-10, should be chosen such that the below equation is satisfied. CL in the equation is the load specified by the crystal manufacturer. All discrete components used to implement the oscillator circuit should be placed as close as possible to the associated oscillator rtc_osc_xi_clkin32 and rtc_osc_xo pins.
AM5718-HIREL clock_adas_equation.gif Figure 6-11 Load Capacitance Equation

The crystal must be in the fundamental mode of operation and parallel resonant. Table 6-9 summarizes the required electrical constraints.

Table 6-9 RTC Crystal Electrical Characteristics

NAME DESCRIPTION MIN TYP MAX UNIT
fp Parallel resonance crystal frequency 32.768 kHz
Cf1 Cf1 load capacitance for crystal parallel resonance with Cf1 = Cf2 12 24 pF
Cf2 Cf2 load capacitance for crystal parallel resonance with Cf1 = Cf2 12 24 pF
ESR(Cf1,Cf2) Crystal ESR 80 kΩ
CO Crystal shunt capacitance 5 pF
LM Crystal motional inductance for fp = 32.768 kHz 10.7 mH
CM Crystal motional capacitance 2.2 fF
tj(rtc_osc_xi_clkin32) Frequency accuracy, rtc_osc_xi_clkin32 ±200 ppm

When selecting a crystal, the system design must take into account the temperature and aging characteristics of a crystal versus the user environment and expected lifetime of the system.

Table 6-10 details the switching characteristics of the oscillator and the requirements of the input clock.

Table 6-10 Oscillator Switching Characteristics—Crystal Mode

NAME DESCRIPTION MIN TYP MAX UNIT
fp Oscillation frequency 32.768 kHz
tsX Start-up time 4 ms

6.1.4.2 RTC Oscillator Input Clock

A 1.8-V LVCMOS-Compatible Clock Input can be used instead of the internal oscillator to provide the SYS_32K clock input to the system. The external connections to support this are shown in Figure 6-12. The rtc_osc_xi_clkin32 pin is connected to the 1.8-V LVCMOS-Compatible clock sources. The rtc_osc_xo pin is left unconnected.

AM5718-HIREL SPRS906_CLK_10.gif Figure 6-12 LVCMOS-Compatible Clock Input

Table 6-11 summarizes the RTC Oscillator input clock electrical characteristics.

Table 6-11 RTC Oscillator Input Clock Electrical Characteristics—Bypass Mode

NAME DESCRIPTION MIN TYP MAX UNIT
CK0 1/tc(rtc_osc_xi_clkin32) Frequency, rtc_osc_xi_clkin32 32.768 kHz
CK1 tw(rtc_osc_xi_clkin32) Pulse duration, rtc_osc_xi_clkin32 low or high 0.45 * tc(rtc_osc_xi_clkin32) 0.55 * tc(rtc_osc_xi_clkin32) ns
CIN Input capacitance 2.178 2.378 2.578 pF
IIN Input current (3.3V mode) 4 6 10 µA
tsX Start-up time See (1) ms
  1. Before the processor boots up and the oscillator is set to bypass mode, there is a waiting time when the internal oscillator is inapplication mode and receives a wave. The switching time in this case is about 100 μs.
AM5718-HIREL SPRS906_CLK_11.gif Figure 6-13 rtc_osc_xi_clkin32 Input Clock

6.2 DPLLs, DLLs Specifications

NOTE

For more information, see:

  • Power, Reset, and Clock Management / Clock Management Functional / Internal Clock Sources / Generators / Generic DPLL Overview Section

    • and

  • Display Subsystem / Display Subsystem Overview section of the Device TRM.

To generate high-frequency clocks, the device supports multiple on-chip DPLLs controlled directly by the PRCM module. They are of two types: type A and type B DPLLs.

  • They have their own independent power domain (each one embeds its own switch and can be controlled as an independent functional power domain)
  • They are fed with ALWAYS ON system clock, with independent control per DPLL.

The different DPLLs managed by the PRCM are listed below:

  • DPLL_MPU: It supplies the MPU subsystem clocking internally.
  • DPLL_IVA: It feeds the IVA subsystem clocking.
  • DPLL_CORE: It supplies all interface clocks and also few module functional clocks.
  • DPLL_PER: It supplies several clock sources: a 192-MHz clock for the display functional clock, a 96-MHz functional clock to subsystems and peripherals.
  • DPLL_ABE: It provides clocks to various modules within the device.
  • DPLL_USB: It provides 960M clock for USB modules (USB1/2/3/4).
  • DPLL_GMAC: It supplies several clocks for the Gigabit Ethernet Switch (GMAC_SW).
  • DPLL_DSP: It feeds the DSP Subsystem clocking.
  • DPLL_GPU: It supplies clock for the GPU Subsystem.
  • DPLL_DDR: It generates clocks for the two External Memory Interface (EMIF) controllers and their associated EMIF PHYs.
  • DPLL_PCIE_REF: It provides reference clock for the APLL_PCIE in PCIE Subsystem.
  • APLL_PCIE: It feeds clocks for the device Peripheral Component Interconnect Express (PCIe) controllers.

NOTE

The following DPLLs are controlled by the clock manager located in the always-on Core power domain (CM_CORE_AON):

  • DPLL_MPU, DPLL_IVA, DPLL_CORE, DPLL_ABE, DPLL_DDR, DPLL_GMAC, DPLL_PCIE_REF, DPLL_PER, DPLL_USB, DPLL_DSP, DPLL_GPU, APLL_PCIE_REF.

For more information on CM_CORE_AON and CM_CORE or PRCM DPLLs, see the Power, Reset, and Clock Management (PRCM) chapter of the Device TRM.

The following DPLLs are not managed by the PRCM:

  • DPLL_VIDEO1; (It is controlled from DSS)
  • DPLL_HDMI; (It is controlled from DSS)
  • DPLL_SATA; (It is controlled from SATA)
  • DPLL_DEBUG; (It is controlled from DEBUGSS)
  • DPLL_USB_OTG_SS; (It is controlled from OCP2SCP1)

NOTE

For more information for not controlled from PRCM DPLL’s see the related chapters in TRM.

6.2.1 DPLL Characteristics

The DPLL has three relevant input clocks. One of them is the reference clock (CLKINP) used to generated the synthesized clock but can also be used as the bypass clock whenever the DPLL enters a bypass mode. It is therefore mandatory. The second one is a fast bypass clock (CLKINPULOW) used when selected as the bypass clock and is optional. The third clock (CLKINPHIF) is explained in the next paragraph.

The DPLL has three output clocks (namely CLKOUT, CLKOUTX2, and CLKOUTHIF). CLKOUT and CLKOUTX2 run at the bypass frequency whenever the DPLL enters a bypass mode. Both of them are generated from the lock frequency divided by a post-divider (namely M2 post-divider). The third clock, CLKOUTHIF, has no automatic bypass capability. It is an output of a post-divider (M3 post-divider) with the input clock selectable between the internal lock clock (Fdpll) and CLKINPHIF input of the PLL through an asynchronous multplexing.

For more information, see the Power Reset Controller Management chapter of the Device TRM.

Table 6-12 summarizes DPLL type described in Section 6.2, DPLLs, DLLs Specifications introduction.

Table 6-12 DPLL Control Type

DPLL NAME TYPE CONTROLLED BY PRCM
DPLL_ABE Table 6-13 (Type A) Yes(1)
DPLL_CORE Table 6-13 (Type A) Yes(1)
DPLL_DEBUGSS Table 6-13 (Type A) No(2)
DPLL_DSP Table 6-13 (Type A) Yes(1)
DPLL_GMAC Table 6-13 (Type A) Yes(1)
DPLL_HDMI Table 6-14 (Type B) No(2)
DPLL_IVA Table 6-13 (Type A) Yes(1)
DPLL_MPU Table 6-13 (Type A) Yes(1)
DPLL_PER Table 6-13 (Type A) Yes(1)
APLL_PCIE Table 6-13 (Type A) Yes(1)
DPLL_PCIE_REF Table 6-14 (Type B) Yes(1)
DPLL_SATA Table 6-14 (Type B) No(2)
DPLL_USB Table 6-14 (Type B) Yes(1)
DPLL_USB_OTG_SS Table 6-14 (Type B) No(2)
DPLL_VIDEO1 Table 6-13 (Type A) No(2)
DPLL_DDR Table 6-13 (Type A) Yes(1)
DPLL_GPU Table 6-13 (Type A) Yes(1)
  1. DPLL is in the always-on domain.
  2. DPLL is not controlled by the PRCM.

Table 6-13 and Table 6-14 summarize the DPLL characteristics and assume testing over recommended operating conditions.

Table 6-13 DPLL Type A Characteristics

NAME DESCRIPTION MIN TYP MAX UNIT COMMENTS
finput CLKINP input frequency 0.032 52 MHz FINP
finternal Internal reference frequency 0.15 52 MHz REFCLK
fCLKINPHIF CLKINPHIF input frequency 10 1400 MHz FINPHIF
fCLKINPULOW CLKINPULOW input frequency 0.001 600 MHz Bypass mode: fCLKOUT = fCLKINPULOW / (M1 + 1) if ulowclken = 1(7)
fCLKOUT CLKOUT output frequency 20(1) 1400(3) MHz [M / (N + 1)] × FINP × [1 / M2] (in locked condition)
fCLKOUTx2 CLKOUTx2 output frequency 40(1) 2200(3) MHz 2 × [M / (N + 1)] × FINP × [1 / M2] (in locked condition)
fCLKOUTHIF CLKOUTHIF output frequency 20(4) 1400(5) MHz FINPHIF / M3 if clkinphifsel = 1
40(4) 2200(5) MHz 2 × [M / (N + 1)] × FINP × [1 / M3] if clkinphifsel = 0
fCLKDCOLDO DCOCLKLDO output frequency 40 2800 MHz 2 × [M / (N + 1)] × FINP (in locked condition)
tlock Frequency lock time 6 + 350 × REFCLK µs
plock Phase lock time 6 + 500 × REFCLK µs
trelock-L Relock time—Frequency lock(6) (LP relock time from bypass) 6 + 70 × REFCLK µs DPLL in LP relock time: lowcurrstdby = 1
prelock-L Relock time—Phase lock(6) (LP relock time from bypass) 6 + 120 × REFCLK µs DPLL in LP relock time: lowcurrstdby = 1
trelock-F Relock time—Frequency lock(6) (fast relock time from bypass) 3.55 + 70 × REFCLK µs DPLL in fast relock time: lowcurrstdby = 0
prelock-F Relock time—Phase lock(6) (fast relock time from bypass) 3.55 + 120 × REFCLK µs DPLL in fast relock time: lowcurrstdby = 0
  1. The minimum frequencies on CLKOUT and CLKOUTX2 are assuming M2 = 1.

    2. For M2 > 1, the minimum frequency on these clocks will further scale down by factor of M2.

  2. The maximum frequencies on CLKOUT and CLKOUTX2 are assuming M2 = 1.
  3. The minimum frequency on CLKOUTHIF is assuming M3 = 1. For M3 > 1, the minimum frequency on this clock will further scale down by factor of M3.
  4. The maximum frequency on CLKOUTHIF is assuming M3 = 1.
  5. Relock time assumes typical operating conditions, 10°C maximum temperature drift.
  6. Bypass mode: fCLKOUT = FINP if ulowclken = 0. For more information, see the Device TRM.

Table 6-14 DPLL Type B Characteristics

NAME DESCRIPTION MIN TYP MAX UNIT COMMENTS
finput CLKINP input clock frequency 0.62 60 MHz FINP
finternal REFCLK internal reference clock frequency 0.62 2.5 MHz [1 / (N + 1)] × FINP
fCLKINPULOW CLKINPULOW bypass input clock frequency 0.001 600 MHz Bypass mode: fCLKOUT = fCLKINPULOW / (M1 + 1) If ulowclken = 1(5)
fCLKLDOOUT CLKOUTLDO output clock frequency 20(1)(6) 2500(3)(6) MHz M / (N + 1)] × FINP × [1 / M2] (in locked condition)
fCLKOUT CLKOUT output clock frequency 20(1)(6) 1450(3)(6) MHz [M / (N + 1)] × FINP × [1 / M2] (in locked condition)
fCLKDCOLDO Internal oscillator (DCO) output clock frequency 750(6) 1500(6) MHz [M / (N + 1)] × FINP (in locked condition)
1250(6) 2500(6) MHz
tJ CLKOUTLDO period jitter –2.5% 2.5% The period jitter at the output clocks is ± 2.5% peak to peak
CLKOUT period jitter
CLKDCOLDO period jitter
tlock Frequency lock time 350 × REFCLKs µs
plock Phase lock time 500 × REFCLKs µs
trelock-L Relock time—Frequency lock(4) (LP relock time from bypass) 9 + 30 × REFCLKs µs
prelock-L Relock time—Phase lock(4) (LP relock time from bypass) 9 + 125 × REFCLKs µs
  1. The minimum frequency on CLKOUT is assuming M2 = 1.

    2. For M2 > 1, the minimum frequency on this clock will further scale down by factor of M2.

  2. The maximum frequency on CLKOUT is assuming M2 = 1.
  3. Relock time assumes typical operating conditions, 10°C maximum temperature drift.
  4. Bypass mode: fCLKOUT = FINP if ULOWCLKEN = 0. For more information, see the Device TRM.
  5. For output clocks, there are two frequency ranges according to the SELFREQDCO setting. For more information, see the Device TRM.

6.2.2 DLL Characteristics

Table 6-15 summarizes the DLL characteristics and assumes testing over recommended operating conditions.

Table 6-15 DLL Characteristics

NAME DESCRIPTION MIN TYP MAX UNIT
finput Input clock frequency (EMIF_DLL_FCLK) 266 MHz
tlock Lock time 50k cycles
trelock Relock time (a change of the DLL frequency implies that DLL must relock) 50k cycles