SPRSP58B june   2022  – june 2023 AM620-Q1 , AM623 , AM625 , AM625-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Revision History
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      12
      2.      13
    3. 6.3 Signal Descriptions
      1.      15
      2. 6.3.1  CPSW3G
        1. 6.3.1.1 MAIN Domain
          1.        18
          2.        19
          3.        20
          4.        21
      3. 6.3.2  CPTS
        1. 6.3.2.1 MAIN Domain
          1.        24
      4. 6.3.3  CSI-2
        1. 6.3.3.1 MAIN Domain
          1.        27
      5. 6.3.4  DDRSS
        1. 6.3.4.1 MAIN Domain
          1.        30
      6. 6.3.5  DSS
        1. 6.3.5.1 MAIN Domain
          1.        33
      7. 6.3.6  ECAP
        1. 6.3.6.1 MAIN Domain
          1.        36
          2.        37
          3.        38
      8. 6.3.7  Emulation and Debug
        1. 6.3.7.1 MAIN Domain
          1.        41
        2. 6.3.7.2 MCU Domain
          1.        43
      9. 6.3.8  EPWM
        1. 6.3.8.1 MAIN Domain
          1.        46
          2.        47
          3.        48
          4.        49
      10. 6.3.9  EQEP
        1. 6.3.9.1 MAIN Domain
          1.        52
          2.        53
          3.        54
      11. 6.3.10 GPIO
        1. 6.3.10.1 MAIN Domain
          1.        57
          2.        58
        2. 6.3.10.2 MCU Domain
          1.        60
      12. 6.3.11 GPMC
        1. 6.3.11.1 MAIN Domain
          1.        63
      13. 6.3.12 I2C
        1. 6.3.12.1 MAIN Domain
          1.        66
          2.        67
          3.        68
          4.        69
        2. 6.3.12.2 MCU Domain
          1.        71
        3. 6.3.12.3 WKUP Domain
          1.        73
      14. 6.3.13 MCAN
        1. 6.3.13.1 MAIN Domain
          1.        76
        2. 6.3.13.2 MCU Domain
          1.        78
          2.        79
      15. 6.3.14 MCASP
        1. 6.3.14.1 MAIN Domain
          1.        82
          2.        83
          3.        84
      16. 6.3.15 MCSPI
        1. 6.3.15.1 MAIN Domain
          1.        87
          2.        88
          3.        89
        2. 6.3.15.2 MCU Domain
          1.        91
          2.        92
      17. 6.3.16 MDIO
        1. 6.3.16.1 MAIN Domain
          1.        95
      18. 6.3.17 MMC
        1. 6.3.17.1 MAIN Domain
          1.        98
          2.        99
          3.        100
      19. 6.3.18 OLDI
        1. 6.3.18.1 MAIN Domain
          1.        103
      20. 6.3.19 OSPI
        1. 6.3.19.1 MAIN Domain
          1.        106
      21. 6.3.20 Power Supply
        1.       108
      22. 6.3.21 PRUSS
        1. 6.3.21.1 MAIN Domain
          1.        111
          2.        112
      23. 6.3.22 Reserved
        1.       114
      24. 6.3.23 System and Miscellaneous
        1. 6.3.23.1 Boot Mode Configuration
          1. 6.3.23.1.1 MAIN Domain
            1.         118
        2. 6.3.23.2 Clock
          1. 6.3.23.2.1 MCU Domain
            1.         121
          2. 6.3.23.2.2 WKUP Domain
            1.         123
        3. 6.3.23.3 System
          1. 6.3.23.3.1 MAIN Domain
            1.         126
          2. 6.3.23.3.2 MCU Domain
            1.         128
          3. 6.3.23.3.3 WKUP Domain
            1.         130
        4. 6.3.23.4 VMON
          1.        132
      25. 6.3.24 TIMER
        1. 6.3.24.1 MAIN Domain
          1.        135
        2. 6.3.24.2 MCU Domain
          1.        137
        3. 6.3.24.3 WKUP Domain
          1.        139
      26. 6.3.25 UART
        1. 6.3.25.1 MAIN Domain
          1.        142
          2.        143
          3.        144
          4.        145
          5.        146
          6.        147
          7.        148
        2. 6.3.25.2 MCU Domain
          1.        150
        3. 6.3.25.3 WKUP Domain
          1.        152
      27. 6.3.26 USB
        1. 6.3.26.1 MAIN Domain
          1.        155
          2.        156
    4. 6.4 Pin Connectivity Requirements
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings for Devices which are not AEC - Q100 Qualified
    3. 7.3  ESD Ratings for AEC - Q100 Qualified Devices in the AMC Package
    4. 7.4  Power-On Hours (POH)
    5. 7.5  Recommended Operating Conditions
    6. 7.6  Operating Performance Points
    7. 7.7  Power Consumption Summary
    8. 7.8  Electrical Characteristics
      1. 7.8.1  I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 7.8.2  Fail-Safe Reset (FS RESET) Electrical Characteristics
      3. 7.8.3  High-Frequency Oscillator (HFOSC) Electrical Characteristics
      4. 7.8.4  Low-Frequency Oscillator (LFXOSC) Electrical Characteristics
      5. 7.8.5  SDIO Electrical Characteristics
      6. 7.8.6  LVCMOS Electrical Characteristics
      7. 7.8.7  OLDI LVDS (OLDI) Electrical Characteristics
      8. 7.8.8  CSI-2 (D-PHY) Electrical Characteristics
      9. 7.8.9  USB2PHY Electrical Characteristics
      10. 7.8.10 DDR Electrical Characteristics
    9. 7.9  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.9.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.9.2 Hardware Requirements
      3. 7.9.3 Programming Sequence
      4. 7.9.4 Impact to Your Hardware Warranty
    10. 7.10 Thermal Resistance Characteristics
      1. 7.10.1 Thermal Resistance Characteristics for ALW and AMC Packages
    11. 7.11 Timing and Switching Characteristics
      1. 7.11.1 Timing Parameters and Information
      2. 7.11.2 Power Supply Requirements
        1. 7.11.2.1 Power Supply Slew Rate Requirement
        2. 7.11.2.2 Power Supply Sequencing
          1. 7.11.2.2.1 Power-Up Sequencing
          2. 7.11.2.2.2 Power-Down Sequencing
          3. 7.11.2.2.3 Partial IO Power Sequencing
      3. 7.11.3 System Timing
        1. 7.11.3.1 Reset Timing
        2. 7.11.3.2 Error Signal Timing
        3. 7.11.3.3 Clock Timing
      4. 7.11.4 Clock Specifications
        1. 7.11.4.1 Input Clocks / Oscillators
          1. 7.11.4.1.1 MCU_OSC0 Internal Oscillator Clock Source
            1. 7.11.4.1.1.1 Load Capacitance
            2. 7.11.4.1.1.2 Shunt Capacitance
          2. 7.11.4.1.2 MCU_OSC0 LVCMOS Digital Clock Source
          3. 7.11.4.1.3 WKUP_LFOSC0 Internal Oscillator Clock Source
          4. 7.11.4.1.4 WKUP_LFOSC0 LVCMOS Digital Clock Source
          5. 7.11.4.1.5 WKUP_LFOSC0 Not Used
        2. 7.11.4.2 Output Clocks
        3. 7.11.4.3 PLLs
        4. 7.11.4.4 Recommended System Precautions for Clock and Control Signal Transitions
      5. 7.11.5 Peripherals
        1. 7.11.5.1  CPSW3G
          1. 7.11.5.1.1 CPSW3G MDIO Timing
          2. 7.11.5.1.2 CPSW3G RMII Timing
          3. 7.11.5.1.3 CPSW3G RGMII Timing
        2. 7.11.5.2  CPTS
        3. 7.11.5.3  CSI-2
        4. 7.11.5.4  DDRSS
        5. 7.11.5.5  DSS
        6. 7.11.5.6  ECAP
        7. 7.11.5.7  Emulation and Debug
          1. 7.11.5.7.1 Trace
          2. 7.11.5.7.2 JTAG
        8. 7.11.5.8  EPWM
        9. 7.11.5.9  EQEP
        10. 7.11.5.10 GPIO
        11. 7.11.5.11 GPMC
          1. 7.11.5.11.1 GPMC and NOR Flash — Synchronous Mode
          2. 7.11.5.11.2 GPMC and NOR Flash — Asynchronous Mode
          3. 7.11.5.11.3 GPMC and NAND Flash — Asynchronous Mode
        12. 7.11.5.12 I2C
        13. 7.11.5.13 MCAN
        14. 7.11.5.14 MCASP
        15. 7.11.5.15 MCSPI
          1. 7.11.5.15.1 MCSPI — Controller Mode
          2. 7.11.5.15.2 MCSPI — Peripheral Mode
        16. 7.11.5.16 MMCSD
          1. 7.11.5.16.1 MMC0 - eMMC/SD/SDIO Interface
            1. 7.11.5.16.1.1  Legacy SDR Mode
            2. 7.11.5.16.1.2  High Speed SDR Mode
            3. 7.11.5.16.1.3  HS200 Mode
            4. 7.11.5.16.1.4  Default Speed Mode
            5. 7.11.5.16.1.5  High Speed Mode
            6. 7.11.5.16.1.6  UHS–I SDR12 Mode
            7. 7.11.5.16.1.7  UHS–I SDR25 Mode
            8. 7.11.5.16.1.8  UHS–I SDR50 Mode
            9. 7.11.5.16.1.9  UHS–I DDR50 Mode
            10. 7.11.5.16.1.10 UHS–I SDR104 Mode
          2. 7.11.5.16.2 MMC1/MMC2 - SD/SDIO Interface
            1. 7.11.5.16.2.1 Default Speed Mode
            2. 7.11.5.16.2.2 High Speed Mode
            3. 7.11.5.16.2.3 UHS–I SDR12 Mode
            4. 7.11.5.16.2.4 UHS–I SDR25 Mode
            5. 7.11.5.16.2.5 UHS–I SDR50 Mode
            6. 7.11.5.16.2.6 UHS–I DDR50 Mode
            7. 7.11.5.16.2.7 UHS–I SDR104 Mode
        17. 7.11.5.17 OLDI
          1. 7.11.5.17.1 OLDI0 Switching Characteristics
        18. 7.11.5.18 OSPI
          1. 7.11.5.18.1 OSPI0 PHY Mode
            1. 7.11.5.18.1.1 OSPI0 With PHY Data Training
            2. 7.11.5.18.1.2 OSPI0 Without Data Training
              1. 7.11.5.18.1.2.1 OSPI0 PHY SDR Timing
              2. 7.11.5.18.1.2.2 OSPI0 PHY DDR Timing
          2. 7.11.5.18.2 OSPI0 Tap Mode
            1. 7.11.5.18.2.1 OSPI0 Tap SDR Timing
            2. 7.11.5.18.2.2 OSPI0 Tap DDR Timing
        19. 7.11.5.19 PRUSS
          1. 7.11.5.19.1 PRUSS Programmable Real-Time Unit (PRU)
            1. 7.11.5.19.1.1 PRUSS PRU Direct Output Mode Timing
            2. 7.11.5.19.1.2 PRUSS PRU Parallel Capture Mode Timing
            3. 7.11.5.19.1.3 PRUSS PRU Shift Mode Timing
          2. 7.11.5.19.2 PRUSS Industrial Ethernet Peripheral (IEP)
            1. 7.11.5.19.2.1 PRUSS IEP Timing
          3. 7.11.5.19.3 PRUSS Universal Asynchronous Receiver Transmitter (UART)
            1. 7.11.5.19.3.1 PRUSS UART Timing
          4. 7.11.5.19.4 PRUSS Enhanced Capture Peripheral (ECAP)
            1. 7.11.5.19.4.1 PRUSS ECAP Timing
        20. 7.11.5.20 Timers
        21. 7.11.5.21 UART
        22. 7.11.5.22 USB
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Processor Subsystems
      1. 8.2.1 Arm Cortex-A53 Subsystem
      2. 8.2.2 Device/Power Manager
      3. 8.2.3 Arm Cortex-M4F
    3. 8.3 Accelerators and Coprocessors
      1. 8.3.1 Graphics Processing Unit (GPU)
      2. 8.3.2 Programmable Real-Time Unit Subsystem (PRUSS)
    4. 8.4 Other Subsystems
      1. 8.4.1 Dual Clock Comparator (DCC)
      2. 8.4.2 Data Movement Subsystem (DMSS)
      3. 8.4.3 Memory Cyclic Redundancy Check (MCRC)
      4. 8.4.4 Peripheral DMA Controller (PDMA)
      5. 8.4.5 Real-Time Clock (RTC)
    5. 8.5 Peripherals
      1. 8.5.1  Gigabit Ethernet Switch (CPSW3G)
      2. 8.5.2  Camera Streaming Interface Receiver (CSI_RX_IF)
      3. 8.5.3  DDR Subsystem (DDRSS)
      4. 8.5.4  Display Subsystem (DSS)
      5. 8.5.5  Enhanced Capture (ECAP)
      6. 8.5.6  Error Location Module (ELM)
      7. 8.5.7  Enhanced Pulse Width Modulation (EPWM)
      8. 8.5.8  Error Signaling Module (ESM)
      9. 8.5.9  Enhanced Quadrature Encoder Pulse (EQEP)
      10. 8.5.10 General-Purpose Interface (GPIO)
      11. 8.5.11 General-Purpose Memory Controller (GPMC)
      12. 8.5.12 Global Timebase Counter (GTC)
      13. 8.5.13 Inter-Integrated Circuit (I2C)
      14. 8.5.14 Modular Controller Area Network (MCAN)
      15. 8.5.15 Multichannel Audio Serial Port (MCASP)
      16. 8.5.16 Multichannel Serial Peripheral Interface (MCSPI)
      17. 8.5.17 Multi-Media Card Secure Digital (MMCSD)
      18. 8.5.18 Octal Serial Peripheral Interface (OSPI)
      19. 8.5.19 Timers
      20. 8.5.20 Universal Asynchronous Receiver/Transmitter (UART)
      21. 8.5.21 Universal Serial Bus Subsystem (USBSS)
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Device Connection and Layout Fundamentals
      1. 9.1.1 Power Supply
        1. 9.1.1.1 Power Supply Designs
        2. 9.1.1.2 Power Distribution Network Implementation Guidance
      2. 9.1.2 External Oscillator
      3. 9.1.3 JTAG, EMU, and TRACE
      4. 9.1.4 Reset
      5. 9.1.5 Unused Pins
    2. 9.2 Peripheral- and Interface-Specific Design Information
      1. 9.2.1 DDR Board Design and Layout Guidelines
      2. 9.2.2 OSPI/QSPI/SPI Board Design and Layout Guidelines
        1. 9.2.2.1 No Loopback, Internal PHY Loopback, and Internal Pad Loopback
        2. 9.2.2.2 External Board Loopback
        3. 9.2.2.3 DQS (only available in Octal SPI devices)
      3. 9.2.3 USB VBUS Design Guidelines
      4. 9.2.4 System Power Supply Monitor Design Guidelines
      5. 9.2.5 High Speed Differential Signal Routing Guidance
      6. 9.2.6 Thermal Solution Guidance
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
      1. 10.1.1 Standard Package Symbolization
      2. 10.1.2 Device Naming Convention
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • AMC|441
Thermal pad, mechanical data (Package|Pins)
Orderable Information
Table 6-8 DDRSS0 Signal Descriptions
SIGNAL NAME [1]PIN TYPE [2]DESCRIPTION [3]ALW PIN [4]AMC PIN [4]
DDR0_ACT_nODDRSS Activation CommandN6M1
DDR0_ALERT_nIODDRSS AlertR3N1
DDR0_CAS_nODDRSS Column Address StrobeM4J3
DDR0_PARODDRSS Command and Address ParityT1M2
DDR0_RAS_nODDRSS Row Address StrobeM5K5
DDR0_WE_nODDRSS Write EnableN3J2
DDR0_A0ODDRSS Address BusJ1F5
DDR0_A1ODDRSS Address BusJ2G5
DDR0_A2ODDRSS Address BusK3G4
DDR0_A3ODDRSS Address BusL5H4
DDR0_A4ODDRSS Address BusK4J5
DDR0_A5ODDRSS Address BusK1H5
DDR0_A6ODDRSS Address BusR2P4
DDR0_A7ODDRSS Address BusP2N2
DDR0_A8ODDRSS Address BusP1P2
DDR0_A9ODDRSS Address BusP4N4
DDR0_A10ODDRSS Address BusR5N3
DDR0_A11ODDRSS Address BusP5M3
DDR0_A12ODDRSS Address BusR6P5
DDR0_A13ODDRSS Address BusR1N5
DDR0_BA0ODDRSS Bank AddressM1L5
DDR0_BA1ODDRSS Bank AddressN1L3
DDR0_BG0ODDRSS Bank GroupT4L4
DDR0_BG1ODDRSS Bank GroupN2L2
DDR0_CAL0 (1)AIO Pad Calibration ResistorM2K4
DDR0_CK0ODDRSS ClockL1J1
DDR0_CK0_nODDRSS Negative ClockL2K1
DDR0_CKE0ODDRSS Clock EnableH2G3
DDR0_CKE1ODDRSS Clock EnableJ4H2
DDR0_CS0_nODDRSS Chip SelectL6H3
DDR0_CS1_nODDRSS Chip SelectK2G1
DDR0_DM0IODDRSS Data MaskH5E3
DDR0_DM1IODDRSS Data MaskW5R4
DDR0_DQ0IODDRSS Data F4C2
DDR0_DQ1IODDRSS Data G5E4
DDR0_DQ2IODDRSS Data F3D3
DDR0_DQ3IODDRSS Data H6E5
DDR0_DQ4IODDRSS Data E3D2
DDR0_DQ5IODDRSS Data G2F3
DDR0_DQ6IODDRSS Data F2F1
DDR0_DQ7IODDRSS Data F1F2
DDR0_DQ8IODDRSS Data U1R3
DDR0_DQ9IODDRSS Data U3R2
DDR0_DQ10IODDRSS Data U2T2
DDR0_DQ11IODDRSS Data V5U2
DDR0_DQ12IODDRSS Data W2U3
DDR0_DQ13IODDRSS Data V6U4
DDR0_DQ14IODDRSS Data Y1T4
DDR0_DQ15IODDRSS Data W1T5
DDR0_DQS0IODDRSS Data StrobeE1D1
DDR0_DQS0_nIODDRSS Complimentary Data StrobeE2E1
DDR0_DQS1IODDRSS Data StrobeV1T1
DDR0_DQS1_nIODDRSS Complimentary Data StrobeV2R1
DDR0_ODT0ODDRSS On-Die Termination for Chip Select 0H1J4
DDR0_ODT1ODDRSS On-Die Termination for Chip Select 1J3K2
DDR0_RESET0_nODDRSS Reset G1G2
(1) An external 240 Ω ±1% resistor must be connected between this pin and VSS. The maximum power dissipation for the resistor is 5.2mW. No external voltage should be applied to this pin.