SPRSP58B june   2022  – june 2023 AM620-Q1 , AM623 , AM625 , AM625-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Revision History
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      12
      2.      13
    3. 6.3 Signal Descriptions
      1.      15
      2. 6.3.1  CPSW3G
        1. 6.3.1.1 MAIN Domain
          1.        18
          2.        19
          3.        20
          4.        21
      3. 6.3.2  CPTS
        1. 6.3.2.1 MAIN Domain
          1.        24
      4. 6.3.3  CSI-2
        1. 6.3.3.1 MAIN Domain
          1.        27
      5. 6.3.4  DDRSS
        1. 6.3.4.1 MAIN Domain
          1.        30
      6. 6.3.5  DSS
        1. 6.3.5.1 MAIN Domain
          1.        33
      7. 6.3.6  ECAP
        1. 6.3.6.1 MAIN Domain
          1.        36
          2.        37
          3.        38
      8. 6.3.7  Emulation and Debug
        1. 6.3.7.1 MAIN Domain
          1.        41
        2. 6.3.7.2 MCU Domain
          1.        43
      9. 6.3.8  EPWM
        1. 6.3.8.1 MAIN Domain
          1.        46
          2.        47
          3.        48
          4.        49
      10. 6.3.9  EQEP
        1. 6.3.9.1 MAIN Domain
          1.        52
          2.        53
          3.        54
      11. 6.3.10 GPIO
        1. 6.3.10.1 MAIN Domain
          1.        57
          2.        58
        2. 6.3.10.2 MCU Domain
          1.        60
      12. 6.3.11 GPMC
        1. 6.3.11.1 MAIN Domain
          1.        63
      13. 6.3.12 I2C
        1. 6.3.12.1 MAIN Domain
          1.        66
          2.        67
          3.        68
          4.        69
        2. 6.3.12.2 MCU Domain
          1.        71
        3. 6.3.12.3 WKUP Domain
          1.        73
      14. 6.3.13 MCAN
        1. 6.3.13.1 MAIN Domain
          1.        76
        2. 6.3.13.2 MCU Domain
          1.        78
          2.        79
      15. 6.3.14 MCASP
        1. 6.3.14.1 MAIN Domain
          1.        82
          2.        83
          3.        84
      16. 6.3.15 MCSPI
        1. 6.3.15.1 MAIN Domain
          1.        87
          2.        88
          3.        89
        2. 6.3.15.2 MCU Domain
          1.        91
          2.        92
      17. 6.3.16 MDIO
        1. 6.3.16.1 MAIN Domain
          1.        95
      18. 6.3.17 MMC
        1. 6.3.17.1 MAIN Domain
          1.        98
          2.        99
          3.        100
      19. 6.3.18 OLDI
        1. 6.3.18.1 MAIN Domain
          1.        103
      20. 6.3.19 OSPI
        1. 6.3.19.1 MAIN Domain
          1.        106
      21. 6.3.20 Power Supply
        1.       108
      22. 6.3.21 PRUSS
        1. 6.3.21.1 MAIN Domain
          1.        111
          2.        112
      23. 6.3.22 Reserved
        1.       114
      24. 6.3.23 System and Miscellaneous
        1. 6.3.23.1 Boot Mode Configuration
          1. 6.3.23.1.1 MAIN Domain
            1.         118
        2. 6.3.23.2 Clock
          1. 6.3.23.2.1 MCU Domain
            1.         121
          2. 6.3.23.2.2 WKUP Domain
            1.         123
        3. 6.3.23.3 System
          1. 6.3.23.3.1 MAIN Domain
            1.         126
          2. 6.3.23.3.2 MCU Domain
            1.         128
          3. 6.3.23.3.3 WKUP Domain
            1.         130
        4. 6.3.23.4 VMON
          1.        132
      25. 6.3.24 TIMER
        1. 6.3.24.1 MAIN Domain
          1.        135
        2. 6.3.24.2 MCU Domain
          1.        137
        3. 6.3.24.3 WKUP Domain
          1.        139
      26. 6.3.25 UART
        1. 6.3.25.1 MAIN Domain
          1.        142
          2.        143
          3.        144
          4.        145
          5.        146
          6.        147
          7.        148
        2. 6.3.25.2 MCU Domain
          1.        150
        3. 6.3.25.3 WKUP Domain
          1.        152
      27. 6.3.26 USB
        1. 6.3.26.1 MAIN Domain
          1.        155
          2.        156
    4. 6.4 Pin Connectivity Requirements
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings for Devices which are not AEC - Q100 Qualified
    3. 7.3  ESD Ratings for AEC - Q100 Qualified Devices in the AMC Package
    4. 7.4  Power-On Hours (POH)
    5. 7.5  Recommended Operating Conditions
    6. 7.6  Operating Performance Points
    7. 7.7  Power Consumption Summary
    8. 7.8  Electrical Characteristics
      1. 7.8.1  I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 7.8.2  Fail-Safe Reset (FS RESET) Electrical Characteristics
      3. 7.8.3  High-Frequency Oscillator (HFOSC) Electrical Characteristics
      4. 7.8.4  Low-Frequency Oscillator (LFXOSC) Electrical Characteristics
      5. 7.8.5  SDIO Electrical Characteristics
      6. 7.8.6  LVCMOS Electrical Characteristics
      7. 7.8.7  OLDI LVDS (OLDI) Electrical Characteristics
      8. 7.8.8  CSI-2 (D-PHY) Electrical Characteristics
      9. 7.8.9  USB2PHY Electrical Characteristics
      10. 7.8.10 DDR Electrical Characteristics
    9. 7.9  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.9.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.9.2 Hardware Requirements
      3. 7.9.3 Programming Sequence
      4. 7.9.4 Impact to Your Hardware Warranty
    10. 7.10 Thermal Resistance Characteristics
      1. 7.10.1 Thermal Resistance Characteristics for ALW and AMC Packages
    11. 7.11 Timing and Switching Characteristics
      1. 7.11.1 Timing Parameters and Information
      2. 7.11.2 Power Supply Requirements
        1. 7.11.2.1 Power Supply Slew Rate Requirement
        2. 7.11.2.2 Power Supply Sequencing
          1. 7.11.2.2.1 Power-Up Sequencing
          2. 7.11.2.2.2 Power-Down Sequencing
          3. 7.11.2.2.3 Partial IO Power Sequencing
      3. 7.11.3 System Timing
        1. 7.11.3.1 Reset Timing
        2. 7.11.3.2 Error Signal Timing
        3. 7.11.3.3 Clock Timing
      4. 7.11.4 Clock Specifications
        1. 7.11.4.1 Input Clocks / Oscillators
          1. 7.11.4.1.1 MCU_OSC0 Internal Oscillator Clock Source
            1. 7.11.4.1.1.1 Load Capacitance
            2. 7.11.4.1.1.2 Shunt Capacitance
          2. 7.11.4.1.2 MCU_OSC0 LVCMOS Digital Clock Source
          3. 7.11.4.1.3 WKUP_LFOSC0 Internal Oscillator Clock Source
          4. 7.11.4.1.4 WKUP_LFOSC0 LVCMOS Digital Clock Source
          5. 7.11.4.1.5 WKUP_LFOSC0 Not Used
        2. 7.11.4.2 Output Clocks
        3. 7.11.4.3 PLLs
        4. 7.11.4.4 Recommended System Precautions for Clock and Control Signal Transitions
      5. 7.11.5 Peripherals
        1. 7.11.5.1  CPSW3G
          1. 7.11.5.1.1 CPSW3G MDIO Timing
          2. 7.11.5.1.2 CPSW3G RMII Timing
          3. 7.11.5.1.3 CPSW3G RGMII Timing
        2. 7.11.5.2  CPTS
        3. 7.11.5.3  CSI-2
        4. 7.11.5.4  DDRSS
        5. 7.11.5.5  DSS
        6. 7.11.5.6  ECAP
        7. 7.11.5.7  Emulation and Debug
          1. 7.11.5.7.1 Trace
          2. 7.11.5.7.2 JTAG
        8. 7.11.5.8  EPWM
        9. 7.11.5.9  EQEP
        10. 7.11.5.10 GPIO
        11. 7.11.5.11 GPMC
          1. 7.11.5.11.1 GPMC and NOR Flash — Synchronous Mode
          2. 7.11.5.11.2 GPMC and NOR Flash — Asynchronous Mode
          3. 7.11.5.11.3 GPMC and NAND Flash — Asynchronous Mode
        12. 7.11.5.12 I2C
        13. 7.11.5.13 MCAN
        14. 7.11.5.14 MCASP
        15. 7.11.5.15 MCSPI
          1. 7.11.5.15.1 MCSPI — Controller Mode
          2. 7.11.5.15.2 MCSPI — Peripheral Mode
        16. 7.11.5.16 MMCSD
          1. 7.11.5.16.1 MMC0 - eMMC/SD/SDIO Interface
            1. 7.11.5.16.1.1  Legacy SDR Mode
            2. 7.11.5.16.1.2  High Speed SDR Mode
            3. 7.11.5.16.1.3  HS200 Mode
            4. 7.11.5.16.1.4  Default Speed Mode
            5. 7.11.5.16.1.5  High Speed Mode
            6. 7.11.5.16.1.6  UHS–I SDR12 Mode
            7. 7.11.5.16.1.7  UHS–I SDR25 Mode
            8. 7.11.5.16.1.8  UHS–I SDR50 Mode
            9. 7.11.5.16.1.9  UHS–I DDR50 Mode
            10. 7.11.5.16.1.10 UHS–I SDR104 Mode
          2. 7.11.5.16.2 MMC1/MMC2 - SD/SDIO Interface
            1. 7.11.5.16.2.1 Default Speed Mode
            2. 7.11.5.16.2.2 High Speed Mode
            3. 7.11.5.16.2.3 UHS–I SDR12 Mode
            4. 7.11.5.16.2.4 UHS–I SDR25 Mode
            5. 7.11.5.16.2.5 UHS–I SDR50 Mode
            6. 7.11.5.16.2.6 UHS–I DDR50 Mode
            7. 7.11.5.16.2.7 UHS–I SDR104 Mode
        17. 7.11.5.17 OLDI
          1. 7.11.5.17.1 OLDI0 Switching Characteristics
        18. 7.11.5.18 OSPI
          1. 7.11.5.18.1 OSPI0 PHY Mode
            1. 7.11.5.18.1.1 OSPI0 With PHY Data Training
            2. 7.11.5.18.1.2 OSPI0 Without Data Training
              1. 7.11.5.18.1.2.1 OSPI0 PHY SDR Timing
              2. 7.11.5.18.1.2.2 OSPI0 PHY DDR Timing
          2. 7.11.5.18.2 OSPI0 Tap Mode
            1. 7.11.5.18.2.1 OSPI0 Tap SDR Timing
            2. 7.11.5.18.2.2 OSPI0 Tap DDR Timing
        19. 7.11.5.19 PRUSS
          1. 7.11.5.19.1 PRUSS Programmable Real-Time Unit (PRU)
            1. 7.11.5.19.1.1 PRUSS PRU Direct Output Mode Timing
            2. 7.11.5.19.1.2 PRUSS PRU Parallel Capture Mode Timing
            3. 7.11.5.19.1.3 PRUSS PRU Shift Mode Timing
          2. 7.11.5.19.2 PRUSS Industrial Ethernet Peripheral (IEP)
            1. 7.11.5.19.2.1 PRUSS IEP Timing
          3. 7.11.5.19.3 PRUSS Universal Asynchronous Receiver Transmitter (UART)
            1. 7.11.5.19.3.1 PRUSS UART Timing
          4. 7.11.5.19.4 PRUSS Enhanced Capture Peripheral (ECAP)
            1. 7.11.5.19.4.1 PRUSS ECAP Timing
        20. 7.11.5.20 Timers
        21. 7.11.5.21 UART
        22. 7.11.5.22 USB
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Processor Subsystems
      1. 8.2.1 Arm Cortex-A53 Subsystem
      2. 8.2.2 Device/Power Manager
      3. 8.2.3 Arm Cortex-M4F
    3. 8.3 Accelerators and Coprocessors
      1. 8.3.1 Graphics Processing Unit (GPU)
      2. 8.3.2 Programmable Real-Time Unit Subsystem (PRUSS)
    4. 8.4 Other Subsystems
      1. 8.4.1 Dual Clock Comparator (DCC)
      2. 8.4.2 Data Movement Subsystem (DMSS)
      3. 8.4.3 Memory Cyclic Redundancy Check (MCRC)
      4. 8.4.4 Peripheral DMA Controller (PDMA)
      5. 8.4.5 Real-Time Clock (RTC)
    5. 8.5 Peripherals
      1. 8.5.1  Gigabit Ethernet Switch (CPSW3G)
      2. 8.5.2  Camera Streaming Interface Receiver (CSI_RX_IF)
      3. 8.5.3  DDR Subsystem (DDRSS)
      4. 8.5.4  Display Subsystem (DSS)
      5. 8.5.5  Enhanced Capture (ECAP)
      6. 8.5.6  Error Location Module (ELM)
      7. 8.5.7  Enhanced Pulse Width Modulation (EPWM)
      8. 8.5.8  Error Signaling Module (ESM)
      9. 8.5.9  Enhanced Quadrature Encoder Pulse (EQEP)
      10. 8.5.10 General-Purpose Interface (GPIO)
      11. 8.5.11 General-Purpose Memory Controller (GPMC)
      12. 8.5.12 Global Timebase Counter (GTC)
      13. 8.5.13 Inter-Integrated Circuit (I2C)
      14. 8.5.14 Modular Controller Area Network (MCAN)
      15. 8.5.15 Multichannel Audio Serial Port (MCASP)
      16. 8.5.16 Multichannel Serial Peripheral Interface (MCSPI)
      17. 8.5.17 Multi-Media Card Secure Digital (MMCSD)
      18. 8.5.18 Octal Serial Peripheral Interface (OSPI)
      19. 8.5.19 Timers
      20. 8.5.20 Universal Asynchronous Receiver/Transmitter (UART)
      21. 8.5.21 Universal Serial Bus Subsystem (USBSS)
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Device Connection and Layout Fundamentals
      1. 9.1.1 Power Supply
        1. 9.1.1.1 Power Supply Designs
        2. 9.1.1.2 Power Distribution Network Implementation Guidance
      2. 9.1.2 External Oscillator
      3. 9.1.3 JTAG, EMU, and TRACE
      4. 9.1.4 Reset
      5. 9.1.5 Unused Pins
    2. 9.2 Peripheral- and Interface-Specific Design Information
      1. 9.2.1 DDR Board Design and Layout Guidelines
      2. 9.2.2 OSPI/QSPI/SPI Board Design and Layout Guidelines
        1. 9.2.2.1 No Loopback, Internal PHY Loopback, and Internal Pad Loopback
        2. 9.2.2.2 External Board Loopback
        3. 9.2.2.3 DQS (only available in Octal SPI devices)
      3. 9.2.3 USB VBUS Design Guidelines
      4. 9.2.4 System Power Supply Monitor Design Guidelines
      5. 9.2.5 High Speed Differential Signal Routing Guidance
      6. 9.2.6 Thermal Solution Guidance
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
      1. 10.1.1 Standard Package Symbolization
      2. 10.1.2 Device Naming Convention
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • AMC|441
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.11.5.14 MCASP

Note: McASP has one or more signals which can be multiplexed to more than one pin. Timing requirements and switching characteristics defined in this section are only valid for specific pin combinations known as IOSETs. Valid pin combinations or IOSETs for this interface are defined in the SysConfig-PinMux Tool.

Table 7-71, Table 7-72, Figure 7-61, Table 7-73, and Figure 7-62 present timing conditions, requirements, and switching characteristics for MCASP.

Table 7-71 MCASP Timing Conditions
PARAMETER MIN MAX UNIT
INPUT CONDITIONS
SRI Input slew rate 0.7 5 V/ns
OUTPUT CONDITIONS
CL Output load capacitance 1 10 pF
PCB CONNECTIVITY REQUIREMENTS
td(Trace Delay) Propagation delay of each trace 100 1100 ps
td(Trace Mismatch Delay) Propagation delay mismatch across all traces 100 ps
Table 7-72 MCASP Timing Requirements see Figure 7-61
NO. MODE(1) MIN MAX UNIT
ASP1 tc(AHCLKRX) Cycle time, MCASP[x]_AHCLKR/X(4) 20 ns
ASP2 tw(AHCLKRX) Pulse duration, MCASP[x]_AHCLKR/X(4) high or low 0.5P(2) - 1.53 ns
ASP3 tc(ACLKRX) Cycle time, MCASP[x]_ACLKR/X(4) 20 ns
ASP4 tw(ACLKRX) Pulse duration, MCASP[x]_ACLKR/X(4) high or low 0.5R(3) - 1.53 ns
ASP5 tsu(AFSRX-ACLKRX) Setup time, MCASP[x]_AFSR/X(4) input valid before MCASP[x]_ACLKR/X(4) ACLKR/X int 9.29 ns
ACLKR/X ext in/out 4
ASP6 th(ACLKRX-AFSRX) Hold time, MCASP[x]_AFSR/X(4) input valid after MCASP[x]_ACLKR/X(4) ACLKR/X int -1 ns
ACLKR/X ext in/out 1.6
ASP7 tsu(AXR-ACLKRX) Setup time, MCASP[x]_AXR(4) input valid before MCASP[x]_ACLKR/X(4) ACLKR/X int 9.29 ns
ACLKR/X ext in/out 4
ASP8 th(ACLKRX-AXR) Hold time, MCASP[x]_AXR(4) input valid after MCASP[x]_ACLKR/X(4) ACLKR/X int -1 ns
ACLKR/X ext in/out 1.6
(1) ACLKR internal: ACLKRCTL.CLKRM=1, PDIR.ACLKR = 1
ACLKR external input: ACLKRCTL.CLKRM=0, PDIR.ACLKR=0
ACLKR external output: ACLKRCTL.CLKRM=0, PDIR.ACLKR=1
ACLKX internal: ACLKXCTL.CLKXM=1, PDIR.ACLKX = 1
ACLKX external input: ACLKXCTL.CLKXM=0, PDIR.ACLKX=0
ACLKX external output: ACLKXCTL.CLKXM=0, PDIR.ACLKX=1
(2) P = AHCLKR/X period in ns. For details on AHCLKR/X clock source options, see the McASP Clocks table in the Multichannel Audio Serial Port (MCASP) section of the Module Integration chapter found in the Technical Reference Manual.
(3) R = ACLKR/X period in ns.
(4) x in MCASP[x]_* is 0, 1 or 2
GUID-B94D2349-8A3D-44D4-83F1-B192BC1AF1EB-low.svg
A. For CLKRP = CLKXP = 0, the MCASP transmitter is configured for rising edge (to shift data out) and the MCASP receiver is configured for falling edge (to shift data in).
B. For CLKRP = CLKXP = 1, the MCASP transmitter is configured for falling edge (to shift data out) and the MCASP receiver is configured for rising edge (to shift data in).
Figure 7-61 MCASP Timing Requirements
Table 7-73 MCASP Switching Characteristics see Figure 7-62
NO. PARAMETER DESCRIPTION MODE(1) MIN MAX UNIT
ASP9 tc(AHCLKRX) Cycle time, MCASP[x]_AHCLKR/X(4) 20 ns
ASP10 tw(AHCLKRX) Pulse duration, MCASP[x]_AHCLKR/X(4) high or low 0.5P(2) - 2 ns
ASP11 tc(ACLKRX) Cycle time, MCASP[x]_ACLKR/X(4) 20 ns
ASP12 tw(ACLKRX) Pulse duration, MCASP[x]_ACLKR/X(4) high or low 0.5R(3) - 2 ns
ASP13 td(ACLKRX-AFSRX) Delay time, MCASP[x]_ACLKR/X(4) transmit edge to MCASP[x]_AFSR/X(4) output valid ACLKR/X int -1 7.25 ns
ACLKR/X ext in/out -15.29 12.84
ASP14 td(ACLKX-AXR) Delay time, MCASP[x]_ACLKX(4) transmit edge to MCASP[x]_AXR(4) output valid ACLKR/X int -1 7.25 ns
ACLKR/X ext in/out -15.29 12.84
ASP15 tdis(ACLKX-AXR) Disable time, MCASP[x]_ACLKX(4) transmit edge to MCASP[x]_AXR(4) output high impedance ACLKR/X int -1 7.25 ns
ACLKR/X ext in/out -14.9 14
(1) ACLKR internal: ACLKRCTL.CLKRM=1, PDIR.ACLKR = 1
ACLKR external input: ACLKRCTL.CLKRM=0, PDIR.ACLKR=0
ACLKR external output: ACLKRCTL.CLKRM=0, PDIR.ACLKR=1
ACLKX internal: ACLKXCTL.CLKXM=1, PDIR.ACLKX = 1
ACLKX external input: ACLKXCTL.CLKXM=0, PDIR.ACLKX=0
ACLKX external output: ACLKXCTL.CLKXM=0, PDIR.ACLKX=1
(2) P = AHCLKR/X period in ns. For details on AHCLKR/X clock source options, see the McASP Clocks table in the Multichannel Audio Serial Port (MCASP) section of the Module Integration chapter found in the Technical Reference Manual.
(3) R = ACLKR/X period in ns.
(4) x in MCASP[x]_* is 0, 1 or 2
GUID-D63F6191-00E3-432B-A3E8-24E4A862ACB8-low.svg
A. For CLKRP = CLKXP = 1, the MCASP transmitter is configured for falling edge (to shift data out) and the MCASP receiver is configured for rising edge (to shift data in).
B. For CLKRP = CLKXP = 0, the MCASP transmitter is configured for rising edge (to shift data out) and the MCASP receiver is configured for falling edge (to shift data in).
Figure 7-62 MCASP Switching Characteristics

For more information, see Multichannel Audio Serial Port (MCASP) section in Peripherals chapter in the device TRM.