SPRSP58B june   2022  – june 2023 AM620-Q1 , AM623 , AM625 , AM625-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Revision History
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      12
      2.      13
    3. 6.3 Signal Descriptions
      1.      15
      2. 6.3.1  CPSW3G
        1. 6.3.1.1 MAIN Domain
          1.        18
          2.        19
          3.        20
          4.        21
      3. 6.3.2  CPTS
        1. 6.3.2.1 MAIN Domain
          1.        24
      4. 6.3.3  CSI-2
        1. 6.3.3.1 MAIN Domain
          1.        27
      5. 6.3.4  DDRSS
        1. 6.3.4.1 MAIN Domain
          1.        30
      6. 6.3.5  DSS
        1. 6.3.5.1 MAIN Domain
          1.        33
      7. 6.3.6  ECAP
        1. 6.3.6.1 MAIN Domain
          1.        36
          2.        37
          3.        38
      8. 6.3.7  Emulation and Debug
        1. 6.3.7.1 MAIN Domain
          1.        41
        2. 6.3.7.2 MCU Domain
          1.        43
      9. 6.3.8  EPWM
        1. 6.3.8.1 MAIN Domain
          1.        46
          2.        47
          3.        48
          4.        49
      10. 6.3.9  EQEP
        1. 6.3.9.1 MAIN Domain
          1.        52
          2.        53
          3.        54
      11. 6.3.10 GPIO
        1. 6.3.10.1 MAIN Domain
          1.        57
          2.        58
        2. 6.3.10.2 MCU Domain
          1.        60
      12. 6.3.11 GPMC
        1. 6.3.11.1 MAIN Domain
          1.        63
      13. 6.3.12 I2C
        1. 6.3.12.1 MAIN Domain
          1.        66
          2.        67
          3.        68
          4.        69
        2. 6.3.12.2 MCU Domain
          1.        71
        3. 6.3.12.3 WKUP Domain
          1.        73
      14. 6.3.13 MCAN
        1. 6.3.13.1 MAIN Domain
          1.        76
        2. 6.3.13.2 MCU Domain
          1.        78
          2.        79
      15. 6.3.14 MCASP
        1. 6.3.14.1 MAIN Domain
          1.        82
          2.        83
          3.        84
      16. 6.3.15 MCSPI
        1. 6.3.15.1 MAIN Domain
          1.        87
          2.        88
          3.        89
        2. 6.3.15.2 MCU Domain
          1.        91
          2.        92
      17. 6.3.16 MDIO
        1. 6.3.16.1 MAIN Domain
          1.        95
      18. 6.3.17 MMC
        1. 6.3.17.1 MAIN Domain
          1.        98
          2.        99
          3.        100
      19. 6.3.18 OLDI
        1. 6.3.18.1 MAIN Domain
          1.        103
      20. 6.3.19 OSPI
        1. 6.3.19.1 MAIN Domain
          1.        106
      21. 6.3.20 Power Supply
        1.       108
      22. 6.3.21 PRUSS
        1. 6.3.21.1 MAIN Domain
          1.        111
          2.        112
      23. 6.3.22 Reserved
        1.       114
      24. 6.3.23 System and Miscellaneous
        1. 6.3.23.1 Boot Mode Configuration
          1. 6.3.23.1.1 MAIN Domain
            1.         118
        2. 6.3.23.2 Clock
          1. 6.3.23.2.1 MCU Domain
            1.         121
          2. 6.3.23.2.2 WKUP Domain
            1.         123
        3. 6.3.23.3 System
          1. 6.3.23.3.1 MAIN Domain
            1.         126
          2. 6.3.23.3.2 MCU Domain
            1.         128
          3. 6.3.23.3.3 WKUP Domain
            1.         130
        4. 6.3.23.4 VMON
          1.        132
      25. 6.3.24 TIMER
        1. 6.3.24.1 MAIN Domain
          1.        135
        2. 6.3.24.2 MCU Domain
          1.        137
        3. 6.3.24.3 WKUP Domain
          1.        139
      26. 6.3.25 UART
        1. 6.3.25.1 MAIN Domain
          1.        142
          2.        143
          3.        144
          4.        145
          5.        146
          6.        147
          7.        148
        2. 6.3.25.2 MCU Domain
          1.        150
        3. 6.3.25.3 WKUP Domain
          1.        152
      27. 6.3.26 USB
        1. 6.3.26.1 MAIN Domain
          1.        155
          2.        156
    4. 6.4 Pin Connectivity Requirements
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings for Devices which are not AEC - Q100 Qualified
    3. 7.3  ESD Ratings for AEC - Q100 Qualified Devices in the AMC Package
    4. 7.4  Power-On Hours (POH)
    5. 7.5  Recommended Operating Conditions
    6. 7.6  Operating Performance Points
    7. 7.7  Power Consumption Summary
    8. 7.8  Electrical Characteristics
      1. 7.8.1  I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 7.8.2  Fail-Safe Reset (FS RESET) Electrical Characteristics
      3. 7.8.3  High-Frequency Oscillator (HFOSC) Electrical Characteristics
      4. 7.8.4  Low-Frequency Oscillator (LFXOSC) Electrical Characteristics
      5. 7.8.5  SDIO Electrical Characteristics
      6. 7.8.6  LVCMOS Electrical Characteristics
      7. 7.8.7  OLDI LVDS (OLDI) Electrical Characteristics
      8. 7.8.8  CSI-2 (D-PHY) Electrical Characteristics
      9. 7.8.9  USB2PHY Electrical Characteristics
      10. 7.8.10 DDR Electrical Characteristics
    9. 7.9  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.9.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.9.2 Hardware Requirements
      3. 7.9.3 Programming Sequence
      4. 7.9.4 Impact to Your Hardware Warranty
    10. 7.10 Thermal Resistance Characteristics
      1. 7.10.1 Thermal Resistance Characteristics for ALW and AMC Packages
    11. 7.11 Timing and Switching Characteristics
      1. 7.11.1 Timing Parameters and Information
      2. 7.11.2 Power Supply Requirements
        1. 7.11.2.1 Power Supply Slew Rate Requirement
        2. 7.11.2.2 Power Supply Sequencing
          1. 7.11.2.2.1 Power-Up Sequencing
          2. 7.11.2.2.2 Power-Down Sequencing
          3. 7.11.2.2.3 Partial IO Power Sequencing
      3. 7.11.3 System Timing
        1. 7.11.3.1 Reset Timing
        2. 7.11.3.2 Error Signal Timing
        3. 7.11.3.3 Clock Timing
      4. 7.11.4 Clock Specifications
        1. 7.11.4.1 Input Clocks / Oscillators
          1. 7.11.4.1.1 MCU_OSC0 Internal Oscillator Clock Source
            1. 7.11.4.1.1.1 Load Capacitance
            2. 7.11.4.1.1.2 Shunt Capacitance
          2. 7.11.4.1.2 MCU_OSC0 LVCMOS Digital Clock Source
          3. 7.11.4.1.3 WKUP_LFOSC0 Internal Oscillator Clock Source
          4. 7.11.4.1.4 WKUP_LFOSC0 LVCMOS Digital Clock Source
          5. 7.11.4.1.5 WKUP_LFOSC0 Not Used
        2. 7.11.4.2 Output Clocks
        3. 7.11.4.3 PLLs
        4. 7.11.4.4 Recommended System Precautions for Clock and Control Signal Transitions
      5. 7.11.5 Peripherals
        1. 7.11.5.1  CPSW3G
          1. 7.11.5.1.1 CPSW3G MDIO Timing
          2. 7.11.5.1.2 CPSW3G RMII Timing
          3. 7.11.5.1.3 CPSW3G RGMII Timing
        2. 7.11.5.2  CPTS
        3. 7.11.5.3  CSI-2
        4. 7.11.5.4  DDRSS
        5. 7.11.5.5  DSS
        6. 7.11.5.6  ECAP
        7. 7.11.5.7  Emulation and Debug
          1. 7.11.5.7.1 Trace
          2. 7.11.5.7.2 JTAG
        8. 7.11.5.8  EPWM
        9. 7.11.5.9  EQEP
        10. 7.11.5.10 GPIO
        11. 7.11.5.11 GPMC
          1. 7.11.5.11.1 GPMC and NOR Flash — Synchronous Mode
          2. 7.11.5.11.2 GPMC and NOR Flash — Asynchronous Mode
          3. 7.11.5.11.3 GPMC and NAND Flash — Asynchronous Mode
        12. 7.11.5.12 I2C
        13. 7.11.5.13 MCAN
        14. 7.11.5.14 MCASP
        15. 7.11.5.15 MCSPI
          1. 7.11.5.15.1 MCSPI — Controller Mode
          2. 7.11.5.15.2 MCSPI — Peripheral Mode
        16. 7.11.5.16 MMCSD
          1. 7.11.5.16.1 MMC0 - eMMC/SD/SDIO Interface
            1. 7.11.5.16.1.1  Legacy SDR Mode
            2. 7.11.5.16.1.2  High Speed SDR Mode
            3. 7.11.5.16.1.3  HS200 Mode
            4. 7.11.5.16.1.4  Default Speed Mode
            5. 7.11.5.16.1.5  High Speed Mode
            6. 7.11.5.16.1.6  UHS–I SDR12 Mode
            7. 7.11.5.16.1.7  UHS–I SDR25 Mode
            8. 7.11.5.16.1.8  UHS–I SDR50 Mode
            9. 7.11.5.16.1.9  UHS–I DDR50 Mode
            10. 7.11.5.16.1.10 UHS–I SDR104 Mode
          2. 7.11.5.16.2 MMC1/MMC2 - SD/SDIO Interface
            1. 7.11.5.16.2.1 Default Speed Mode
            2. 7.11.5.16.2.2 High Speed Mode
            3. 7.11.5.16.2.3 UHS–I SDR12 Mode
            4. 7.11.5.16.2.4 UHS–I SDR25 Mode
            5. 7.11.5.16.2.5 UHS–I SDR50 Mode
            6. 7.11.5.16.2.6 UHS–I DDR50 Mode
            7. 7.11.5.16.2.7 UHS–I SDR104 Mode
        17. 7.11.5.17 OLDI
          1. 7.11.5.17.1 OLDI0 Switching Characteristics
        18. 7.11.5.18 OSPI
          1. 7.11.5.18.1 OSPI0 PHY Mode
            1. 7.11.5.18.1.1 OSPI0 With PHY Data Training
            2. 7.11.5.18.1.2 OSPI0 Without Data Training
              1. 7.11.5.18.1.2.1 OSPI0 PHY SDR Timing
              2. 7.11.5.18.1.2.2 OSPI0 PHY DDR Timing
          2. 7.11.5.18.2 OSPI0 Tap Mode
            1. 7.11.5.18.2.1 OSPI0 Tap SDR Timing
            2. 7.11.5.18.2.2 OSPI0 Tap DDR Timing
        19. 7.11.5.19 PRUSS
          1. 7.11.5.19.1 PRUSS Programmable Real-Time Unit (PRU)
            1. 7.11.5.19.1.1 PRUSS PRU Direct Output Mode Timing
            2. 7.11.5.19.1.2 PRUSS PRU Parallel Capture Mode Timing
            3. 7.11.5.19.1.3 PRUSS PRU Shift Mode Timing
          2. 7.11.5.19.2 PRUSS Industrial Ethernet Peripheral (IEP)
            1. 7.11.5.19.2.1 PRUSS IEP Timing
          3. 7.11.5.19.3 PRUSS Universal Asynchronous Receiver Transmitter (UART)
            1. 7.11.5.19.3.1 PRUSS UART Timing
          4. 7.11.5.19.4 PRUSS Enhanced Capture Peripheral (ECAP)
            1. 7.11.5.19.4.1 PRUSS ECAP Timing
        20. 7.11.5.20 Timers
        21. 7.11.5.21 UART
        22. 7.11.5.22 USB
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Processor Subsystems
      1. 8.2.1 Arm Cortex-A53 Subsystem
      2. 8.2.2 Device/Power Manager
      3. 8.2.3 Arm Cortex-M4F
    3. 8.3 Accelerators and Coprocessors
      1. 8.3.1 Graphics Processing Unit (GPU)
      2. 8.3.2 Programmable Real-Time Unit Subsystem (PRUSS)
    4. 8.4 Other Subsystems
      1. 8.4.1 Dual Clock Comparator (DCC)
      2. 8.4.2 Data Movement Subsystem (DMSS)
      3. 8.4.3 Memory Cyclic Redundancy Check (MCRC)
      4. 8.4.4 Peripheral DMA Controller (PDMA)
      5. 8.4.5 Real-Time Clock (RTC)
    5. 8.5 Peripherals
      1. 8.5.1  Gigabit Ethernet Switch (CPSW3G)
      2. 8.5.2  Camera Streaming Interface Receiver (CSI_RX_IF)
      3. 8.5.3  DDR Subsystem (DDRSS)
      4. 8.5.4  Display Subsystem (DSS)
      5. 8.5.5  Enhanced Capture (ECAP)
      6. 8.5.6  Error Location Module (ELM)
      7. 8.5.7  Enhanced Pulse Width Modulation (EPWM)
      8. 8.5.8  Error Signaling Module (ESM)
      9. 8.5.9  Enhanced Quadrature Encoder Pulse (EQEP)
      10. 8.5.10 General-Purpose Interface (GPIO)
      11. 8.5.11 General-Purpose Memory Controller (GPMC)
      12. 8.5.12 Global Timebase Counter (GTC)
      13. 8.5.13 Inter-Integrated Circuit (I2C)
      14. 8.5.14 Modular Controller Area Network (MCAN)
      15. 8.5.15 Multichannel Audio Serial Port (MCASP)
      16. 8.5.16 Multichannel Serial Peripheral Interface (MCSPI)
      17. 8.5.17 Multi-Media Card Secure Digital (MMCSD)
      18. 8.5.18 Octal Serial Peripheral Interface (OSPI)
      19. 8.5.19 Timers
      20. 8.5.20 Universal Asynchronous Receiver/Transmitter (UART)
      21. 8.5.21 Universal Serial Bus Subsystem (USBSS)
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Device Connection and Layout Fundamentals
      1. 9.1.1 Power Supply
        1. 9.1.1.1 Power Supply Designs
        2. 9.1.1.2 Power Distribution Network Implementation Guidance
      2. 9.1.2 External Oscillator
      3. 9.1.3 JTAG, EMU, and TRACE
      4. 9.1.4 Reset
      5. 9.1.5 Unused Pins
    2. 9.2 Peripheral- and Interface-Specific Design Information
      1. 9.2.1 DDR Board Design and Layout Guidelines
      2. 9.2.2 OSPI/QSPI/SPI Board Design and Layout Guidelines
        1. 9.2.2.1 No Loopback, Internal PHY Loopback, and Internal Pad Loopback
        2. 9.2.2.2 External Board Loopback
        3. 9.2.2.3 DQS (only available in Octal SPI devices)
      3. 9.2.3 USB VBUS Design Guidelines
      4. 9.2.4 System Power Supply Monitor Design Guidelines
      5. 9.2.5 High Speed Differential Signal Routing Guidance
      6. 9.2.6 Thermal Solution Guidance
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
      1. 10.1.1 Standard Package Symbolization
      2. 10.1.2 Device Naming Convention
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • AMC|441
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

Processor Cores:

  • Up to Quad 64-bit Arm® Cortex®-A53 microprocessor subsystem at up to 1.4 GHz
    • Quad-core Cortex-A53 cluster with 512KB L2 shared cache with SECDED ECC
    • Each A53 Core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection
  • Single-core Arm® Cortex®-M4F MCU at up to 400 MHz
    • 256KB SRAM with SECDED ECC
  • Dedicated Device/Power Manager

Multimedia:

  • Display subsystem
    • Dual display support
    • 1920x1080 @ 60fps for each display
    • 1x 2048x1080 + 1x 1280x720
    • Up to 165 MHz pixel clock support with Independent PLL for each display
    • OLDI (4 lanes LVDS - 2x) and DPI (24-bit RGB LVCMOS)
    • Support safety feature such as freeze frame detection and MISR data check
  • 3D Graphics Processing Unit
    • 1 pixel per clock or higher
    • Fillrate greater than 500 Mpixels/sec
    • >500 MTexels/s, >8 GFLOPs
    • Supports at least 2 composition layers
    • Supports up to 2048x1080 @60fps
    • Supports ARGB32, RGB565 and YUV formats
    • 2D graphics capable
    • OpenGL ES 3.1, Vulkan 1.2
  • One Camera Serial interface (CSI-Rx) - 4 Lane with DPHY
    • MIPI® CSI-2 v1.3 Compliant + MIPI D-PHY 1.2
    • Support for 1,2,3 or 4 data lane mode up to 1.5Gbps
    • ECC verification/correction with CRC check + ECC on RAM
    • Virtual Channel support (up to 16)
    • Ability to write stream data directly to DDR via DMA

Memory Subsystem:

  • Up to 816KB of On-chip RAM
    • 64KB of On-chip RAM (OCSRAM) with SECDED ECC , Can be divided into smaller banks in increments of 32KB for as many as 2 separate memory banks
    • 256KB of On-chip RAM with SECDED ECC in SMS Subsystem
    • 176KB of On-chip RAM with SECDED ECC in SMS Subsystem for TI security firmware
    • 256KB of On-chip RAM with SECDED ECC in Cortex-M4F MCU subsystem
    • 64KB of On-chip RAM with SECDED ECC in Device/Power Manager Subsystem
  • DDR Subsystem (DDRSS)
    • Supports LPDDR4, DDR4 memory types
    • 16-Bit data bus with inline ECC
    • Supports speeds up to 1600 MT/s
    • Max addressable range
      • 8GBytes with DDR4
      • 4GBytes with LPDDR4

Functional Safety:

  • Functional Safety-Compliant targeted [Industrial]
    • Developed for functional safety applications
    • Documentation will be available to aid IEC 61508 functional safety system design
    • Systematic capability up to SIL 3 targeted
    • Hardware Integrity up to SIL 2 targeted
    • Safety-related certification
      • IEC 61508 by TUV SUD planned
  • Functional Safety-Compliant targeted [Automotive]
    • Developed for functional safety applications
    • Documentation will be available to aid ISO 26262 functional safety system design
    • Systematic capability up to ASIL D targeted
    • Hardware integrity up to ASIL B targeted
    • Safety-related certification
      • ISO 26262 by TUV SUD planned
  • AEC - Q100 qualified

Security:

  • Secure boot supported
    • Hardware-enforced Root-of-Trust (RoT)
    • Support to switch RoT via backup key
    • Support for takeover protection, IP protection, and anti-roll back protection
  • Trusted Execution Environment (TEE) supported
    • Arm TrustZone® based TEE
    • Extensive firewall support for isolation
    • Secure watchdog/timer/IPC
    • Secure storage support
    • Replay Protected Memory Block (RPMB) support
  • Dedicated Security Controller with user programmable HSM core and dedicated security DMA & IPC subsystem for isolated processing
  • Cryptographic acceleration supported
    • Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
      • Supports cryptographic cores
    • AES – 128-/192-/256-Bit key sizes
    • SHA2 – 224-/256-/384-/512-Bit key sizes
    • DRBG with true random number generator
    • PKA (Public Key Accelerator) to Assist in RSA/ECC processing for secure boot
  • Debugging security
    • Secure software controlled debug access
    • Security aware debugging

PRU Subsystem:

  • Dual-core Programmable Real-Time Unit Subystem (PRUSS) running up to 333 MHz
  • Intended for driving GPIO for cycle accurate protocols such as additional:
    • General Purpose Input/Output (GPIO)
    • UARTs
    • I2C
    • External ADC
  • 16KByte program memory per PRU with SECDED ECC
  • 8KB data memory per PRU with SECDED ECC
  • 32KB general purpose memory with SECDED ECC
  • CRC32/16 HW accelerator
  • Scratch PAD memory with 3 banks of 30 x 32-bit registers
  • 1 Industrial 64-bit timer with 9 capture and 16 compare events, along with slow and fast compensation
  • 1 interrupt controller (INTC), minimum of 64 input events supported

High-Speed Interfaces:

  • Integrated Ethernet switch supporting (total 2 external ports)
    • RMII(10/100) or RGMII (10/100/1000)
    • IEEE1588 (Annex D, Annex E, Annex F with 802.1AS PTP)
    • Clause 45 MDIO PHY management
    • Packet Classifier based on ALE engine with 512 classifiers
    • Priority based flow control
    • Time sensitive networking (TSN) support
    • Four CPU H/W interrupt Pacing
    • IP/UDP/TCP checksum offload in hardware
  • Two USB2.0 Ports
    • Port configurable as USB host, USB peripheral, or USB Dual-Role Device (DRD mode)
    • Integrated USB VBUS detection
    • Trace over USB supported

General Connectivity:

  • 9x Universal Asynchronous Receiver-Transmitters (UART)
  • 5x Serial Peripheral Interface (SPI) controllers
  • 6x Inter-Integrated Circuit (I2C) ports
  • 3x Multichannel Audio Serial Ports (McASP)
    • Transmit and Receive Clocks up to 50 MHz
    • Up to 16/10/6 Serial Data Pins across 3x McASP with Independent TX and RX Clocks
    • Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and Similar Formats
    • Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
    • FIFO Buffers for Transmit and Receive (256 Bytes)
    • Support for audio reference output clock
  • 3x enhanced PWM modules (ePWM)
  • 3x enhanced Quadrature Encoder Pulse modules (eQEP)
  • 3x enhanced Capture modules (eCAP)
  • General-Purpose I/O (GPIO), All LVCMOS I/O can be configured as GPIO
  • 3x Controller Area Network (CAN) modules with CAN-FD support
    • Conforms w/ CAN Protocol 2.0 A, B and ISO 11898-1
    • Full CAN FD support (up to 64 data bytes)
    • Parity/ECC check for Message RAM
    • Speed up to 8Mbps

Media and Data Storage:

  • 3x Multi-Media Card/Secure Digital® (MMC/SD®) interface
    • 1x 8-bit eMMC interface up to HS200 speed
    • 2x 4-bit SD/SDIO interface up to UHS-I
    • Compliant with eMMC 5.1, SD 3.0 and SDIO Version 3.0
  • 1× General-Purpose Memory Controller (GPMC) up to 133 MHz
    • Flexible 8- and 16-Bit Asynchronous Memory Interface With up to four Chip (22-bit address) Selects (NAND, NOR, Muxed-NOR, and SRAM)
    • Uses BCH Code to Support 4-, 8-, or 16-Bit ECC
    • Uses Hamming Code to Support 1-Bit ECC
    • Error Locator Module (ELM)
      • Used With the GPMC to Locate Addresses of Data Errors From Syndrome Polynomials Generated Using a BCH Algorithm
      • Supports 4-, 8-, and 16-Bit Per 512-Byte Block Error Location Based on BCH Algorithms
  • OSPI/QSPI with DDR / SDR support
    • Support for Serial NAND and Serial NOR flash devices
    • 4GBytes memory address support
    • XIP mode with optional on-the-fly encryption

Power Management:

  • Low power modes supported by Device/Power Manager
    • Partial IO support for CAN/GPIO/UART wakeup
    • DeepSleep
    • MCU Only
    • Standby
    • Dynamic frequency scaling for Cortex-A53

Optimal Power Management Solution:

  • Recommended TPS65219 Power Management ICs (PMIC)
    • Companion PMIC specially designed to meet device power supply requirements
    • Flexible mapping and factory programmed configurations to support different use cases

Boot Options:

  • UART
  • I2C EEPROM
  • OSPI/QSPI Flash
  • GPMC NOR/NAND Flash
  • Serial NAND Flash
  • SD Card
  • eMMC
  • USB (host) boot from Mass Storage device
  • USB (device) boot from external host (DFU mode)
  • Ethernet

Technology / Package:

  • 16-nm technology
  • 13 mm x 13 mm, 0.5-mm pitch, 425-pin FCCSP BGA (ALW)
  • 17.2 mm x 17.2 mm, 0.8-mm pitch, 441-pin FCBGA (AMC)