SBASAW1A September   2023  – December 2023 AMC21C12

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information 
    5. 5.5 Package Characteristics
    6. 5.6 Electrical Characteristics
    7. 5.7 Switching Characteristics 
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Input
      2. 6.3.2 Reference Input
      3. 6.3.3 Isolation Channel Signal Transmission
      4. 6.3.4 Open-Drain Digital Output
        1. 6.3.4.1 Transparent Output Mode
        2. 6.3.4.2 Latch Output Mode
      5. 6.3.5 Power-Up and Power-Down Behavior
      6. 6.3.6 VDD1 Brownout and Power-Loss Behavior
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Overcurrent Detection
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Overvoltage Detection
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curves
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DEN|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.7 Switching Characteristics 

over operating ambient temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
LATCH INPUT
Deglitch time Falling edge 1.8 3.2 µs
OPEN-DRAIN OUTPUT
tpH Propagation delay time, |VIN| rising VDD2 = 3.3 V, VREF = 250 mV,
VOVERDRIVE = 10 mV, CL = 15 pF		 280 410 ns
VDD2 = 3.3 V, VREF = 2 V,
VOVERDRIVE = 50 mV, CL = 15 pF		 240 370
tpL Propagation delay time, |VIN| falling VDD2 = 3.3 V, VREF = 250 mV,
VOVERDRIVE = 10 mV, CL = 15 pF		 280 410 ns
VDD2 = 3.3 V, VREF = 2 V,
VOVERDRIVE = 50 mV, CL = 15 pF		 240 370
tf Output signal fall time RPULLUP = 4.7 kΩ, CL = 15 pF 2 ns
MODE SELECTION
tHSEL Comparator hysteresis selection deglitch time Cmp0, VREF rising or falling 10 µs
tDIS13 Comparator disable deglitch time Cmp1, VREF rising 10 µs
tEN13 Comparator enable deglitch time Cmp1, VREF falling 100 µs
START-UP TIMING
tLS,STA Low-side start-up time VDD2 step to 2.7 V, VDD1 ≥ 3.0 V 40 µs
tHS,STA High-side start-up time VDD1 step to 3.0 V, VDD2 ≥ 2.7 V 45 µs
tHS,BLK High-side blanking time 200 µs
tHS,FLT High-side-fault detection delay time 100 µs