SBASAD0B March   2022  – December 2024 AMC23C10

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information 
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications (Reinforced Isolation)
    7. 5.7  Safety-Related Certifications 
    8. 5.8  Safety Limiting Values 
    9. 5.9  Electrical Characteristics 
    10. 5.10 Switching Characteristics 
    11. 5.11 Timing Diagrams
    12. 5.12 Insulation Characteristics Curves
    13. 5.13 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Input
      2. 6.3.2 Isolation Channel Signal Transmission
      3. 6.3.3 Digital Outputs
      4. 6.3.4 Power-Up and Power-Down Behavior
      5. 6.3.5 VDD1 Brownout and Power-Loss Behavior
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Voltage Zero-Crossing Detection
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
      4. 7.2.4 Application Curves
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.10 Switching Characteristics 

over operating ambient temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
PUSH-PULL OUTPUT
tpH Propagation delay time, |VINP| rising VDD2 = 3.3 V, INN = GND1,
VOVERDRIVE = 50 mV, CL = 15 pF		 230 320 ns
tpL Propagation delay time, |VINP| falling VDD2 = 3.3 V, INN = GND1,
VOVERDRIVE = 50 mV, CL = 15 pF		 230 320 ns
tr Output signal rise time VDD2 = 3.3 V, CL = 15 pF 2 ns
tf Output signal fall time VDD2 = 3.3 V, CL = 15 pF 2 ns
OPEN-DRAIN OUTPUT
tpH Propagation delay time, |VINP| rising VDD2 = 3.3 V, INN = GND1,
VOVERDRIVE = 50 mV, CL = 15 pF		 230 320 ns
tpL Propagation delay time, |VINP| falling VDD2 = 3.3 V, INN = GND1,
VOVERDRIVE = 50 mV, CL = 15 pF		 230 320 ns
tf Output signal fall time RPULLUP = 4.7 kΩ, CL = 15 pF 2 ns
START-UP TIMING
tLS,STA Low-side start-up time VDD2 step to 2.7 V, VDD1 ≥ 3.0 V 40 µs
tHS,STA High-side start-up time VDD1 step to 3.0 V, VDD2 ≥ 2.7 V 45 µs
tHS,BLK High-side blanking time 200 µs
tHS,FLT High-side-fault detection delay time 100 µs