SBASAD0B March 2022 – December 2024 AMC23C10
PRODUCTION DATA
THERMAL METRIC(1) | DWV (SOIC) | UNIT | |
---|---|---|---|
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 102.8 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 45.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 63.0 | °C/W |
ΨJT | Junction-to-top characterization parameter | 14.3 | °C/W |
ΨJB | Junction-to-board characterization parameter | 61.1 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W |