SBASAC9A February   2022  – July 2022 AMC23C11

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information 
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications 
    8. 6.8  Safety Limiting Values 
    9. 6.9  Electrical Characteristics 
    10. 6.10 Switching Characteristics 
    11. 6.11 Timing Diagrams
    12. 6.12 Insulation Characteristics Curves
    13. 6.13 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
      2. 7.3.2 Reference Input
      3. 7.3.3 Isolation Channel Signal Transmission
      4. 7.3.4 Open-Drain Digital Output
        1. 7.3.4.1 Transparent Output Mode
        2. 7.3.4.2 Latch Output Mode
      5. 7.3.5 Power-Up and Power-Down Behavior
      6. 7.3.6 VDD1 Brownout and Power-Loss Behavior
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 DC Link Overcurrent Detection
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
    3. 8.3 Application Curves
    4. 8.4 Best Design Practices
    5. 8.5 Power Supply Recommendations
    6. 8.6 Layout
      1. 8.6.1 Layout Guidelines
      2. 8.6.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

Figure 5-1 DWV Package,8-Pin SOIC(Top View)
Table 5-1 Pin Functions
PINTYPEDESCRIPTION
NO.NAME
1VDD1High-side powerHigh-side power supply.(1)
2INAnalog inputAnalog input pin to the comparator.
3REFAnalog inputReference pin that defines the trip threshold. The voltage on this pin also affects the hysteresis of the comparator, as explained in the Section 7.3.2 section. This pin is internally connected to a 100-μA current source. Connect a resistor from REF to GND1 to define the trip threshold, and a capacitor from REF to GND1 to filter the reference voltage. For best transient noise immunity, place the capacitor as closely to the pin as possible. This pin can also be driven by an external voltage source.
4GND1High-side groundHigh-side analog ground.
5GND2Low-side groundLow-side analog ground.
6OUTDigital outputOpen-drain output of the comparator. Connect to an external pullup resistor.
7LATCHDigital inputDigital input to select latch mode (high) or transparent mode (low) of the open-drain output. Do not leave the input pin unconnected (floating). Connect to GND2 when not used.
8VDD2Low-side powerLow-side power supply.(1)
(1) See the Section 8.5 section for power-supply decoupling recommendations.