SBASAC9A February   2022  – July 2022 AMC23C11

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information 
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications 
    8. 6.8  Safety Limiting Values 
    9. 6.9  Electrical Characteristics 
    10. 6.10 Switching Characteristics 
    11. 6.11 Timing Diagrams
    12. 6.12 Insulation Characteristics Curves
    13. 6.13 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
      2. 7.3.2 Reference Input
      3. 7.3.3 Isolation Channel Signal Transmission
      4. 7.3.4 Open-Drain Digital Output
        1. 7.3.4.1 Transparent Output Mode
        2. 7.3.4.2 Latch Output Mode
      5. 7.3.5 Power-Up and Power-Down Behavior
      6. 7.3.6 VDD1 Brownout and Power-Loss Behavior
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 DC Link Overcurrent Detection
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
    3. 8.3 Application Curves
    4. 8.4 Best Design Practices
    5. 8.5 Power Supply Recommendations
    6. 8.6 Layout
      1. 8.6.1 Layout Guidelines
      2. 8.6.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.9 Electrical Characteristics 

minimum and maximum specifications apply from TA = –40°C to 125°C, VDD1 = 3.0 V to 27 V, VDD2 = 2.7 V to 5.5 V, VREF = 20 mV to 2.7 V(1), and VIN = –400 mV to 4 V(3); typical specifications are at TA = 25°C, VDD1 = 5 V, VDD2 = 3.3 V, and VREF = 250 mV  (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ANALOG INPUT
RIN Input resistance IN pin, 0 ≤ VIN ≤ 4 V 1 GΩ
IBIAS Input bias current IN pin, 0 ≤ VIN ≤ 4 V(3) 0.1 25 nA
IN pin, –400 mV ≤ VIN ≤ 0 V(4) –310 –0.5
CIN Input capacitance IN pin 4 pF
REFERENCE PIN
IREF Reference current REF to GND1, 20 mV < VREF ≤ 2.7 V 99 100 101 μA
VMSEL Mode selection threshold VREF rising 500 550 600 mV
VREF falling 450 500 550
Mode selection threshold hysteresis 50 mV
COMPARATOR
VIT+ Positive-going trip threshold VREF + VHYS mV
EIT+ Positive-going trip threshold error (VIT+ – VREF – VHYS),
VREF = 20 mV, VHYS = 4 mV		 –2 2 mV
(VIT+ – VREF – VHYS),
VREF = 250 mV, VHYS = 4 mV		 –2 2
(VIT+ – VREF – VHYS),
VREF = 2 V, VHYS = 25 mV		 –5 5
VIT– Negative-going trip threshold VREF mV
EIT– Negative-going trip threshold error (VIT– – VREF), VREF = 20 mV –2.5 2.5
mV
(VIT– – VREF), VREF = 250 mV –2.5 2.5
(VIT– – VREF), VREF = 2 V –5 5
VIT– Negative-going trip threshold –VREF – VHYS mV
EIT– Negative-going trip threshold error (VIT– + VREF + VHYS),
VREF = 20 mV, VHYS = 4 mV		 –3 3
mV
(VIT– + VREF + VHYS),
VREF = 250 mV, VHYS = 4 mV		 –3 3
VIT+ Positive-going trip threshold –VREF mV
EIT+ Positive-going trip threshold error (VIT+ + VREF), VREF = 20 mV –3.5 3.5 mV
(VIT+ + VREF), VREF = 250 mV –3.5 3.5
VHYS Trip threshold hysteresis (VIT+ – VIT–), VREF ≤ 450 mV 4 mV
(VIT+ – VIT–), VREF ≥ 600 mV 25
DIGITAL I/O
VIH High-level input voltage LATCH pin 0.7 x VDD2 VDD2 + 0.3 V
VIL Low-level input voltage LATCH pin –0.3 0.3 x VDD2 V
CIN Input capacitance LATCH pin 4 pF
VOL Low-level output voltage ISINK = 4 mA 80 250 mV
ILKG Open-drain output leakage current VDD2 = 5 V, VOUT = 5 V 5 100 nA
CMTI Common-mode transient immunity |VIN – VREF| ≥ 4 mV, RPULLUP = 10 kΩ 55 110 V/ns
POWER SUPPLY
VDD1UV VDD1 undervoltage detection threshold VDD1 rising 3 V
VDD1 falling 2.9
VDD1POR VDD1 power-on reset threshold VDD1 falling 2.3 V
VDD2UV VDD2 undervoltage detection threshold VDD2 rising 2.7 V
VDD2 falling 2.1
IDD1 High-side supply current 2.7 3.7 mA
IDD2 Low-side supply current 1.8 2.2 mA
(1) Reference voltages >1.6 V require VDD1 > VDD1MIN. See the Recommended Operating Conditions table for details.
(2) But not exceeding the maximum input voltage specified in the Recommended Operating Conditions table.
(3) The typical value is measured at VIN = 0.4 V.
(4) The typical value is measured at VIN = –400 mV.