SBASA35B June   2020  – September 2024 AMC3330-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications 
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Timing Diagram
    12. 5.12 Insulation Characteristics Curves
    13. 5.13 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Input
      2. 6.3.2 Isolation Channel Signal Transmission
      3. 6.3.3 Analog Output
      4. 6.3.4 Isolated DC/DC Converter
      5. 6.3.5 Diagnostic Output and Fail-Safe Behavior
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Filter Design
        2. 7.2.2.2 Differential to Single-Ended Output Conversion
      3. 7.2.3 Application Curve
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

AMC3330-Q1 DWE Package,16-Pin SOIC(Top View) Figure 4-1 DWE Package,16-Pin SOIC(Top View)
Table 4-1 Pin Functions
PIN TYPE DESCRIPTION
NO. NAME
1 DCDC_OUT Power High-side output of the isolated DC/DC converter; connect this pin to the HLDO_IN pin.(1)
2 DCDC_HGND Power Ground High-side ground reference for the isolated DC/DC converter; connect this pin to the HGND pin.
3 HLDO_IN Power Input of the high-side low-dropout (LDO) regulator; connect this pin to the DCDC_OUT pin.(1)
4 NC — No internal connection. Connect this pin to the high-side ground or leave this pin unconnected (floating).
5 HLDO_OUT Power Output of the high-side LDO.(1)
6 INP Analog Input Noninverting analog input.
7 INN Analog Input Inverting analog input. Connect this pin to HGND.
8 HGND Signal Ground High-side analog ground; connect this pin to the DCDC_HGND pin.
9 GND Signal Ground Low-side analog ground; connect this pin to the DCDC_GND pin.
10 OUTN Analog Output Inverting analog output.
11 OUTP Analog Output Noninverting analog output.
12 VDD Power Low-side power supply.(1)
13 LDO_OUT Power Output of the low-side LDO; connect this pin to the DCDC_IN pin.(1)
14 DIAG Digital Output Active-low, open-drain status indicator output; connect this pin to the pullup supply (for example, VDD) using a resistor or leave this pin floating if not used.
15 DCDC_GND Power Ground Low-side ground reference for the isolated DC/DC converter; connect this pin to the GND pin.
16 DCDC_IN Power Low-side input of the isolated DC/DC converter; connect this pin to the LDO_OUT pin.(1)
(1) See the Power Supply Recommendations section for power-supply decouplng recommendations.