SWRS248D April   2020  – January 2022 AWR6443 , AWR6843

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagram
    1.     Revision History
  5. 5 Device Comparison
    1. 5.1 Related Products
  6. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagram
    2. 6.2 Signal Descriptions
      1. 6.2.1 Signal Descriptions - Digital
      2. 6.2.2 Signal Descriptions - Analog
    3. 6.3 Pin Attributes
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Power Supply Specifications
    6. 7.6  Power Consumption Summary
    7. 7.7  RF Specification
    8. 7.8  CPU Specifications
    9. 7.9  Thermal Resistance Characteristics for FCBGA Package [ABL0161]
    10. 7.10 Timing and Switching Characteristics
      1. 7.10.1  Power Supply Sequencing and Reset Timing
      2. 7.10.2  Input Clocks and Oscillators
        1. 7.10.2.1 Clock Specifications
      3. 7.10.3  Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 7.10.3.1 Peripheral Description
        2. 7.10.3.2 MibSPI Transmit and Receive RAM Organization
          1. 7.10.3.2.1 SPI Timing Conditions
          2. 7.10.3.2.2 SPI Controller Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input)
          3. 7.10.3.2.3 SPI Controller Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input)
        3. 7.10.3.3 SPI Peripheral Mode I/O Timings
          1. 7.10.3.3.1 SPI Peripheral Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output) (1) (1) (1)
        4. 7.10.3.4 Typical Interface Protocol Diagram (Peripheral Mode)
      4. 7.10.4  LVDS Interface Configuration
        1. 7.10.4.1 LVDS Interface Timings
      5. 7.10.5  General-Purpose Input/Output
        1. 7.10.5.1 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      6. 7.10.6  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. 7.10.6.1 Dynamic Characteristics for the CANx TX and RX Pins
      7. 7.10.7  Serial Communication Interface (SCI)
        1. 7.10.7.1 SCI Timing Requirements
      8. 7.10.8  Inter-Integrated Circuit Interface (I2C)
        1. 7.10.8.1 I2C Timing Requirements
      9. 7.10.9  Quad Serial Peripheral Interface (QSPI)
        1. 7.10.9.1 QSPI Timing Conditions
        2. 7.10.9.2 Timing Requirements for QSPI Input (Read) Timings
        3. 7.10.9.3 QSPI Switching Characteristics
      10. 7.10.10 ETM Trace Interface
        1. 7.10.10.1 ETMTRACE Timing Conditions
        2. 7.10.10.2 ETM TRACE Switching Characteristics
      11. 7.10.11 Data Modification Module (DMM)
        1. 7.10.11.1 DMM Timing Requirements
      12. 7.10.12 JTAG Interface
        1. 7.10.12.1 JTAG Timing Conditions
        2. 7.10.12.2 Timing Requirements for IEEE 1149.1 JTAG
        3. 7.10.12.3 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Subsystems
      1. 8.3.1 RF and Analog Subsystem
        1. 8.3.1.1 Clock Subsystem
        2. 8.3.1.2 Transmit Subsystem
        3. 8.3.1.3 Receive Subsystem
      2. 8.3.2 Processor Subsystem
      3. 8.3.3 Automotive Interface
      4. 8.3.4 Host Interface
      5. 8.3.5 Main Subsystem Cortex-R4F
      6. 8.3.6 DSP Subsystem
      7. 8.3.7 Hardware Accelerator
    4. 8.4 Other Subsystems
      1. 8.4.1 ADC Channels (Service) for User Application
        1. 8.4.1.1 GP-ADC Parameter
  9. 9 Monitoring and Diagnostics
    1. 9.1 Monitoring and Diagnostic Mechanisms
      1. 9.1.1 Error Signaling Module
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 Reference Schematic
  11. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
    3. 11.3 Documentation Support
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information
    2. 12.2 Tray Information for ABL, 10.4 × 10.4 mm

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ABL|161
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.6 DSP Subsystem

The DSP subsystem includes TI’s standard TMS320C674x megamodule and several blocks of internal memory (L1P, L1D, and L2). For complete information including memory map, please refer to Technical Reference Manual.