SLUS940D September   2009  – May 2021 BQ24050 , BQ24052

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings (1)
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions (1)
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
      1. 6.8.1 Power Up, Down, OVP, Disable and Enable Waveforms
      2. 6.8.2 Protection Circuits Waveforms
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Power Down, or Undervoltage Lockout (UVLO)
      2. 7.3.2  Power Up
      3. 7.3.3  D+, D– Detection
      4. 7.3.4  New Charge Cycle
      5. 7.3.5  Overvoltage Protection (OVP) – Continuously Monitored
      6. 7.3.6  CHG Pin Indication
      7. 7.3.7  CHG LED Pullup Source
      8. 7.3.8  Input DPM Mode (VIN-DPM or IN-DPM)
      9. 7.3.9  OUT
      10. 7.3.10 ISET
      11. 7.3.11 TS
      12. 7.3.12 Termination and Timer Disable Mode (TTDM) -TS Pin High
      13. 7.3.13 Timers
      14. 7.3.14 Termination
      15. 7.3.15 Battery Detect Routine
      16. 7.3.16 Refresh Threshold
      17. 7.3.17 Starting a Charge on a Full Battery
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode
    5. 7.5 Programming
      1. 7.5.1 PRE_TERM – Precharge and Termination Programmable Threshold
      2. 7.5.2 ISET2
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 BQ2405x Charger Application Design Example
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Program the Fast Charge Current, ISET
          2. 8.2.1.2.2 Program the Termination Current Threshold, ITERM
          3. 8.2.1.2.3 TS Function
          4. 8.2.1.2.4 CHG
          5. 8.2.1.2.5 Selecting IN and OUT Pin Capacitors
        3. 8.2.1.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Leakage Current Effects on Battery Capacity
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.6 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.