SLUS940D September   2009  – May 2021 BQ24050 , BQ24052

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings (1)
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions (1)
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
      1. 6.8.1 Power Up, Down, OVP, Disable and Enable Waveforms
      2. 6.8.2 Protection Circuits Waveforms
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Power Down, or Undervoltage Lockout (UVLO)
      2. 7.3.2  Power Up
      3. 7.3.3  D+, D– Detection
      4. 7.3.4  New Charge Cycle
      5. 7.3.5  Overvoltage Protection (OVP) – Continuously Monitored
      6. 7.3.6  CHG Pin Indication
      7. 7.3.7  CHG LED Pullup Source
      8. 7.3.8  Input DPM Mode (VIN-DPM or IN-DPM)
      9. 7.3.9  OUT
      10. 7.3.10 ISET
      11. 7.3.11 TS
      12. 7.3.12 Termination and Timer Disable Mode (TTDM) -TS Pin High
      13. 7.3.13 Timers
      14. 7.3.14 Termination
      15. 7.3.15 Battery Detect Routine
      16. 7.3.16 Refresh Threshold
      17. 7.3.17 Starting a Charge on a Full Battery
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode
    5. 7.5 Programming
      1. 7.5.1 PRE_TERM – Precharge and Termination Programmable Threshold
      2. 7.5.2 ISET2
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 BQ2405x Charger Application Design Example
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Program the Fast Charge Current, ISET
          2. 8.2.1.2.2 Program the Termination Current Threshold, ITERM
          3. 8.2.1.2.3 TS Function
          4. 8.2.1.2.4 CHG
          5. 8.2.1.2.5 Selecting IN and OUT Pin Capacitors
        3. 8.2.1.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Leakage Current Effects on Battery Capacity
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

To obtain optimal performance, the decoupling capacitor from IN to GND (thermal pad) and the output filter capacitors from OUT to GND (thermal pad) should be placed as close as possible to the BQ2405x, with short trace runs to both IN, OUT and GND (thermal pad).

  • All low-current GND connections should be kept separate from the high-current charge or discharge paths from the battery. Use a single-point ground technique incorporating both the small signal ground path and the power ground path.
  • The high current charge paths into IN pin and from the OUT pin must be sized appropriately for the maximum charge current in order to avoid voltage drops in these traces
  • The BQ2405x family is packaged in a thermally enhanced MLP package. The package includes a thermal pad to provide an effective thermal contact between the IC and the printed circuit board (PCB); this thermal pad is also the main ground connection for the device. Connect the thermal pad to the PCB ground connection. It is best to use multiple 10-mill vias in the power pad of the IC and in close proximity to conduct the heat to the bottom ground plane. The bottom ground place should avoid traces that “cut off” the thermal path. The thinner the PCB the less temperature rise. The EVM PCB has a thickness of 0.031 inches and uses 2 oz. (2.8-mill thick) copper on top and bottom, and is a good example of optimal thermal performance.