SLUSFB0 August   2024 BQ25758S

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Power-On-Reset
      2. 7.3.2 Device Power-Up From Battery Without Input Source
      3. 7.3.3 Device Power Up from Input Source
        1. 7.3.3.1 VAC Operating Window Programming (ACUV and ACOV)
        2. 7.3.3.2 MODE Pin Configuration
        3. 7.3.3.3 REGN Regulator (REGN LDO)
        4. 7.3.3.4 Switching Frequency and Synchronization (FSW_SYNC)
        5. 7.3.3.5 Device HIZ Mode
      4. 7.3.4 Power Management
        1. 7.3.4.1 Output Voltage Programming (VOUT_REG)
        2. 7.3.4.2 Output Current Programming (IOUT pin and IOUT_REG)
        3. 7.3.4.3 Dynamic Power Management: Input Voltage and Input Current Regulation
          1. 7.3.4.3.1 Input Current Regulation
            1. 7.3.4.3.1.1 IIN Pin
            2. 7.3.4.3.1.2 Multi-Level Current Limit (Overload Mode)
          2. 7.3.4.3.2 Input Voltage Regulation
        4. 7.3.4.4 Bypass Mode
      5. 7.3.5 Bidirectional Power Flow and Programmability
      6. 7.3.6 Integrated 16-Bit ADC for Monitoring
      7. 7.3.7 Status Outputs (PG, STAT and INT)
        1. 7.3.7.1 Power Good Indicator (PG)
        2. 7.3.7.2 Interrupt to Host (INT)
      8. 7.3.8 Protections
        1. 7.3.8.1 Voltage and Current Monitoring
          1. 7.3.8.1.1 VAC Over-voltage Protection (VAC_OVP)
          2. 7.3.8.1.2 VAC Under-voltage Protection (VAC_UVP)
          3. 7.3.8.1.3 Reverse Mode Over-voltage Protection (REV_OVP)
          4. 7.3.8.1.4 Reverse Mode Under-voltage Protection (REV_UVP)
          5. 7.3.8.1.5 DRV_SUP Under-voltage and Over-voltage Protection (DRV_OKZ)
          6. 7.3.8.1.6 REGN Under-voltage Protection (REGN_OKZ)
        2. 7.3.8.2 Thermal Shutdown (TSHUT)
      9. 7.3.9 Serial Interface
        1. 7.3.9.1 Data Validity
        2. 7.3.9.2 START and STOP Conditions
        3. 7.3.9.3 Byte Format
        4. 7.3.9.4 Acknowledge (ACK) and Not Acknowledge (NACK)
        5. 7.3.9.5 Target Address and Data Direction Bit
        6. 7.3.9.6 Single Write and Read
        7. 7.3.9.7 Multi-Write and Multi-Read
    4. 7.4 Device Functional Modes
      1. 7.4.1 Host Mode and Default Mode
      2. 7.4.2 Register Bit Reset
    5. 7.5 BQ25758S Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Application (Buck-Boost configuration)
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 ACUV / ACOV Input Voltage Operating Window Programming
          2. 8.2.1.2.2 Switching Frequency Selection
          3. 8.2.1.2.3 Inductor Selection
          4. 8.2.1.2.4 Input (VAC) Capacitor
          5. 8.2.1.2.5 Output (VBAT) Capacitor
          6. 8.2.1.2.6 Sense Resistor (RAC_SNS and RBAT_SNS) and Current Programming
          7. 8.2.1.2.7 Converter Fast Transient Response
        3. 8.2.1.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Packaging Information
    2. 13.2 Tape and Reel Information
    3. 13.3 Mechanical Data

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RRV|36
Thermal pad, mechanical data (Package|Pins)

7.3.3.2 MODE Pin Configuration

The MODE pin can be used to configure the device as either a buck-boost or buck-only configuration. For a buck-only charger, typical inductor value used must be provided to appropriately compensate the converter. The closest inductor to the values presented below should be programmed via the MODE pin. In a buck-only charger configuration, the boost side MOSFETs have to be removed.

At POR, the device detects the MODE pin pull down resistance, then sets the device operating mode as shown below. The MODE pin resistance detection is only done one time at the device POR, after that, the converter will not sense the MODE pin voltage any more. Follow the resistance listed in the table below to set the desired operating mode. The surface mount resistor with ±1% or ±2% tolerance is recommended.

Table 7-1 MODE Pin Resistance Configuration Options
OPERATION L (nom) RDCR (min) RDCR (max) TYPICAL RESISTANCE AT MODE PIN
Buck-Boost, device detects inductance automatically 2.2 μH - 15 μH L/DCR = 1260 μs(1) 60 mΩ ≤3.0 kΩ
Buck-Only 3.3 μH 2.6 mΩ 60 mΩ 4.7 kΩ
Buck-Only 4.7 μH 3.7 mΩ 60 mΩ 6.04 kΩ
Buck-Only 5.6 μH 4.4 mΩ 60 mΩ 8.2 kΩ
Buck-Only 6.8 μH 5.4 mΩ 60 mΩ 10.5 kΩ
Buck-Only 8.2 μH 6.5 mΩ 60 mΩ 13.7 kΩ
Buck-Only 10 μH 7.9 mΩ 60 mΩ 17.4 kΩ
Buck-Only 15 μH 11.9 mΩ 60 mΩ ≥27.0 kΩ
(1) The minimum DCR varies as a function of selected inductor: for example, a 10-μH inductor supports 7.9 mΩ as the minimum DCR.