SLUSFB0 August 2024 BQ25758S
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | BQ25758S | UNIT | |
---|---|---|---|
RRV | |||
36 PINS | |||
RθJA | Junction-to-ambient thermal resistance (JEDEC(1)) | 29.4 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 18.8 | °C/W |
RθJB | Junction-to-board thermal resistance | 9.9 | °C/W |
ΨJT | Junction-to-top characterization parameter | 0.2 | °C/W |
ΨJB | Junction-to-board characterization parameter | 9.8 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.5 | °C/W |