SLUSFN3 July   2024 BQ25820

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics (BQ25820)
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Power-On-Reset
      2. 7.3.2 Device Power-Up From Battery Without Input Source
      3. 7.3.3 Device Power Up from Input Source
        1. 7.3.3.1 VAC Operating Window Programming (ACUV and ACOV)
        2. 7.3.3.2 MODE Pin Configuration
        3. 7.3.3.3 REGN Regulator (REGN LDO)
        4. 7.3.3.4 Switching Frequency and Synchronization (FSW_SYNC)
        5. 7.3.3.5 Device HIZ Mode
      4. 7.3.4 Battery Charging Management
        1. 7.3.4.1 Autonomous Charging Cycle
          1. 7.3.4.1.1 Charge Current Programming (ICHG pin and ICHG_REG)
        2. 7.3.4.2 Li-Ion Battery Charging Profile
        3. 7.3.4.3 LiFePO4 Battery Charging Profile
        4. 7.3.4.4 Charging Termination for Li-ion and LiFePO4
        5. 7.3.4.5 Charging Safety Timer
        6. 7.3.4.6 Thermistor Qualification
          1. 7.3.4.6.1 JEITA Guideline Compliance in Charge Mode
          2. 7.3.4.6.2 Cold/Hot Temperature Window in Reverse Mode
      5. 7.3.5 Power Path Management
        1. 7.3.5.1 Dynamic Power Management: Input Voltage and Input Current Regulation
          1. 7.3.5.1.1 Input Current Regulation
            1. 7.3.5.1.1.1 ILIM_HIZ Pin
          2. 7.3.5.1.2 Input Voltage Regulation
            1. 7.3.5.1.2.1 Max Power Point Tracking (MPPT) for Solar PV Panel
      6. 7.3.6 Reverse Mode Power Direction
      7. 7.3.7 Integrated 16-Bit ADC for Monitoring
      8. 7.3.8 Status Outputs (PG, STAT1, STAT2, and INT)
        1. 7.3.8.1 Power Good Indicator (PG)
        2. 7.3.8.2 Charging Status Indicator (STAT1, STAT2 Pins)
        3. 7.3.8.3 Interrupt to Host (INT)
      9. 7.3.9 Serial Interface
        1. 7.3.9.1 Data Validity
        2. 7.3.9.2 START and STOP Conditions
        3. 7.3.9.3 Byte Format
        4. 7.3.9.4 Acknowledge (ACK) and Not Acknowledge (NACK)
        5. 7.3.9.5 Target Address and Data Direction Bit
        6. 7.3.9.6 Single Write and Read
        7. 7.3.9.7 Multi-Write and Multi-Read
    4. 7.4 Device Functional Modes
      1. 7.4.1 Host Mode and Default Mode
      2. 7.4.2 Register Bit Reset
    5. 7.5 BQ25820 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 ACUV / ACOV Input Voltage Operating Window Programming
          2. 8.2.1.2.2 Charge Voltage Selection
          3. 8.2.1.2.3 Switching Frequency Selection
          4. 8.2.1.2.4 Inductor Selection
          5. 8.2.1.2.5 Input (VAC / SYS) Capacitor
          6. 8.2.1.2.6 Output (VBAT) Capacitor
          7. 8.2.1.2.7 Sense Resistor (RAC_SNS and RBAT_SNS) and Current Programming
          8. 8.2.1.2.8 Power MOSFETs Selection
          9. 8.2.1.2.9 ACFETs and BATFETs Selection
        3. 8.2.1.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RRV|36
Thermal pad, mechanical data (Package|Pins)
Orderable Information
8.2.1.2.9 ACFETs and BATFETs Selection

External N-channel MOSFETs are used for power path transfer. Those on the VAC side are called ACFETs and those on the VBAT side are called BATFETs.

The proper trade off for selecting these MOSFETs depends on the SOA characteristics. All FETs follow the same trend hence the same FET can be used at all places. It is essential to select a MOSFET that offers close to 10A Drain Current at 30V VDS at DC and also has the capability to offer 100A Drain Current at 30V VDS at 10 μs without breaking. Furthermore, the SOA characteristics should be such that the maximum junction temperature should be at least 125°C. The FETs selected for this application are AONS6276 and can withstand a voltage swing of up-to 30V from VAC to VBAT and vice-versa.

Even though rugged high SOA MOSFETs are being used, it is still essential to limit the maximum amount of current that is allowed to flow from the battery to the system load. This is done by setting the power path overcurrent protection to a limit of 8A. This means that the maximum load for which we can achieve a successful power path transfer from VAC to VBAT is 8A. Furthermore, it should be noted that in cases where VAC > VBAT, the ACUV should be set to a value between VAC and VBAT. For cases where VBAT > VAC, the ACUV should be set just below VAC.