SLUSFU9 October   2024 BQ51013C

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Description (continued)
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Details of a Qi Wireless Power System and BQ51013C Power Transfer Flow Diagrams
      2. 8.3.2  Dynamic Rectifier Control
      3. 8.3.3  Dynamic Efficiency Scaling
      4. 8.3.4  RILIM Calculations
      5. 8.3.5  Input Overvoltage
      6. 8.3.6  Adapter Enable Functionality and EN1/EN2 Control
      7. 8.3.7  End Power Transfer Packet (WPC Header 0x02)
      8. 8.3.8  Status Outputs
      9. 8.3.9  WPC Communication Scheme
      10. 8.3.10 Communication Modulator
      11. 8.3.11 Adaptive Communication Limit
      12. 8.3.12 Synchronous Rectification
      13. 8.3.13 Temperature Sense Resistor Network (TS)
      14. 8.3.14 3-State Driver Recommendations for the TS/CTRL Pin
      15. 8.3.15 Thermal Protection
      16. 8.3.16 WPC v2.0 Compliance – Foreign Object Detection
      17. 8.3.17 Receiver Coil Load-Line Analysis
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 BQ51013C Wireless Power Receiver Used as a Power Supply
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Using The BQ51013C as a Wireless Power Supply: (See Figure 1-1 )
          2. 9.2.1.2.2 Series and Parallel Resonant Capacitor Selection
          3. 9.2.1.2.3 Recommended RX Coils
          4. 9.2.1.2.4 COMM, CLAMP, and BOOT Capacitors
          5. 9.2.1.2.5 Control Pins and CHG
          6. 9.2.1.2.6 Current Limit and FOD
          7. 9.2.1.2.7 RECT and OUT Capacitance
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Dual Power Path: Wireless Power and DC Input
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Wireless and Direct Charging of a Li-Ion Battery at 800 mA
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHL|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

BQ51013C RHL Package20-Pin VQFNTop View
A. The exposed thermal pad should be connected to ground.
Figure 6-1 RHL Package20-Pin VQFNTop View
Table 6-1 Pin Functions
PINI/ODESCRIPTION
NAMENO.
AC12IAC input from receiver coil.
AC219I
AD9IIf AD functionality is used, connect this pin to the wired adapter input. When VAD-Pres is applied to this pin wireless charging is disabled and AD_EN is driven low. Connect a 1-µF capacitor from AD to PGND. If unused, the capacitor is not required and AD should be connected directly to PGND.
AD-EN8OPush-pull driver for external PFET when wired charging is active. Float if not used.
BOOT13OBootstrap capacitors for driving the high-side FETs of the synchronous rectifier. Connect a 10-nF ceramic capacitor from BOOT1 to AC1 and from BOOT2 to AC2.
BOOT217O
CHG7OOpen-drain output – active when OUT is enabled. Float or tie to PGND if unused.
CLAMP216OOpen-drain FETs which are used for a non-power dissipative overvoltage AC clamp protection. When the RECT voltage goes above 15 V, both switches will be turned on and the capacitors will act as a low impedance to protect the device from damage. If used, capacitors are used to connect CLAMP1 to AC1 and CLAMP2 to AC2. Recommended connections are 0.47-µF capacitors.
CLAMP15O
COMM16OOpen-drain outputs used to communicate with primary by varying reflected impedance. Connect a capacitor from COMM1 to AC1 and a capacitor from COMM2 to AC2 for capacitive load modulation. For resistive modulation connect COMM1 and COMM2 to RECT through a single resistor. See Section 8.3.10 for more information.
COMM215O
EN110IInputs that allow user to enable and disable wireless and wired charging <EN1 EN2>:
<00> Wireless charging is enabled unless AD voltage > VAD_Pres.
<01> Dynamic communication current limit disabled.
<10> AD-EN pulled low, wireless charging disabled.
<11> Wired and wireless charging disabled.
EN211I
FOD14IInput for the rectified power measurement. See Section 8.3.16 for details.
ILIM12I/OProgramming pin for the over current limit. The total resistance from ILIM to GND (RILIM) sets the current limit. The schematic shown in Figure 9-1 illustrates the RILIM as R1 + RFOD. Details can be found in Section 7.5 and Figure 9-1.
OUT4OOutput pin, delivers power to the load.
PGND1, 20Power ground
RECT18OFilter capacitor for the internal synchronous rectifier. Connect a ceramic capacitor to PGND. Depending on the power levels, the value may be 4.7 μF to 22 μF.
TS/CTRL13IDual function pin: Temperature Sense (TS) and Control (CTRL) pin functionality.
For the TS functionality connect TS/CTRL to ground through a Negative Temperature Coefficient (NTC) resistor. If an NTC function is not desired, connect to PGND with a 10-kΩ resistor. See Section 8.3.13 for more details.
For the CTRL functionality pull below VCTRL-Low or pull above VCTRL-High to send an End Power Transfer Packet. See Table 8-4 for more details.
—PAD—The exposed thermal pad should be connected to ground (PGND)