SLUSE97
November 2023
BQ76905
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Device Comparison Table
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Supply Current
6.6
Digital I/O
6.7
REGOUT LDO
6.8
Voltage References
6.9
Coulomb Counter
6.10
Coulomb Counter Digital Filter
6.11
Current Wake Detector
6.12
Analog-to-Digital Converter
6.13
Cell Balancing
6.14
Internal Temperature Sensor
6.15
Thermistor Measurement
6.16
Hardware Overtemperature Detector
6.17
Internal Oscillator
6.18
Charge and Discharge FET Drivers
6.19
Comparator-Based Protection Subsystem
6.20
Timing Requirements—I2C Interface, 100-kHz Mode
6.21
Timing Requirements—I2C Interface, 400-kHz Mode
6.22
Timing Diagram
6.23
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Device Configuration
7.3.1
Commands and Subcommands
7.3.2
Configuration Using OTP or Registers
7.3.3
Device Security
7.4
Device Hardware Features
7.4.1
Voltage ADC
7.4.2
Coulomb Counter and Digital Filters
7.4.3
Protection FET Drivers
7.4.4
Voltage References
7.4.5
Multiplexer
7.4.6
LDOs
7.4.7
Standalone Versus Host Interface
7.4.8
ALERT Pin Operation
7.4.9
Low Frequency Oscillator
7.4.10
I2C Serial Communications Interface
7.5
Measurement Subsystem
7.5.1
Voltage Measurement
7.5.1.1
Voltage ADC Scheduling
7.5.1.2
Unused VC Pins
7.5.1.3
General Purpose ADCIN Functionality
7.5.2
Current Measurement and Charge Integration
7.5.3
Internal Temperature Measurement
7.5.4
Thermistor Temperature Measurement
7.5.5
Factory Trim and Calibration
7.6
Protection Subsystem
7.6.1
Protections Overview
7.6.2
Primary Protections
7.6.3
CHG Detector
7.6.4
Cell Open-Wire Protection
7.6.5
Diagnostic Checks
7.7
Cell Balancing
7.8
Device Operational Modes
7.8.1
Overview of Operational Modes
7.8.2
NORMAL Mode
7.8.3
SLEEP Mode
7.8.4
DEEPSLEEP Mode
7.8.5
SHUTDOWN Mode
7.8.6
CONFIG_UPDATE Mode
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Performance Plot
8.2.4
Random Cell Connection Support
8.2.5
Startup Timing
8.2.6
FET Driver Turn-Off
8.2.7
Usage of Unused Pins
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Documentation Support
9.1.1
Related Documentation
9.2
Receiving Notification of Documentation Updates
9.3
Support Resources
9.4
Trademarks
9.5
Electrostatic Discharge Caution
9.6
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RGR|20
MPQF239A
Thermal pad, mechanical data (Package|Pins)
RGR|20
QFND242E
Orderable Information
sluse97_oa
sluse97_pm
9.6
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.