SWRS210H January   2018  – November 2020 CC1312R

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Connections for Unused Pins and Modules
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 861 MHz to 1054 MHz - Receive (RX)
    11. 8.11 861 MHz to 1054 MHz - Transmit (TX) 
    12. 8.12 861 MHz to 1054 MHz - PLL Phase Noise Wideband Mode
    13. 8.13 861 MHz to 1054 MHz - PLL Phase Noise Narrowband Mode
    14. 8.14 359 MHz to 527 MHz - Receive (RX)
    15. 8.15 359 MHz to 527 MHz - Transmit (TX) 
    16. 8.16 359 MHz to 527 MHz - PLL Phase Noise
    17. 8.17 143 MHz to 176 MHz - Receive (RX)
    18. 8.18 143 MHz to 176 MHz  - Transmit (TX) 
    19. 8.19 143 MHz to 176 MHz - PLL Phase Noise
    20. 8.20 Timing and Switching Characteristics
      1. 8.20.1 Reset Timing
      2. 8.20.2 Wakeup Timing
      3. 8.20.3 Clock Specifications
        1. 8.20.3.1 48 MHz Clock Input (TCXO)
        2. 8.20.3.2 48 MHz Crystal Oscillator (XOSC_HF)
        3. 8.20.3.3 48 MHz RC Oscillator (RCOSC_HF)
        4. 8.20.3.4 2 MHz RC Oscillator (RCOSC_MF)
        5. 8.20.3.5 32.768 kHz Crystal Oscillator (XOSC_LF)
        6. 8.20.3.6 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.20.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.20.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       43
      5. 8.20.5 UART
        1. 8.20.5.1 UART Characteristics
    21. 8.21 Peripheral Characteristics
      1. 8.21.1 ADC
        1. 8.21.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.21.2 DAC
        1. 8.21.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.21.3 Temperature and Battery Monitor
        1. 8.21.3.1 Temperature Sensor
        2. 8.21.3.2 Battery Monitor
      4. 8.21.4 Comparators
        1. 8.21.4.1 Low-Power Clocked Comparator
        2. 8.21.4.2 Continuous Time Comparator
      5. 8.21.5 Current Source
        1. 8.21.5.1 Programmable Current Source
      6. 8.21.6 GPIO
        1. 8.21.6.1 GPIO DC Characteristics
    22. 8.22 Typical Characteristics
      1. 8.22.1 MCU Current
      2. 8.22.2 RX Current
      3. 8.22.3 TX Current
      4. 8.22.4 RX Performance
      5. 8.22.5 TX Performance
      6. 8.22.6 ADC Performance
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Proprietary Radio Formats
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems
    14. 9.14 Network Processor
  10. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
    2. 10.2 Junction Temperature Calculation
  11. 11Device and Documentation Support
    1. 11.1 Tools and Software
      1. 11.1.1 SimpleLink™ Microcontroller Platform
    2. 11.2 Documentation Support
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGZ|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.5 Power Consumption - Power Modes

When measured on the CC1312REM-XD7793  reference design with Tc = 25 °C, VDDS = 3.6 V with DC/DC enabled unless otherwise noted.
 
PARAMETER TEST CONDITIONS TYP UNIT
Core Current Consumption
Icore Reset and Shutdown Reset. RESET_N pin asserted or VDDS below power-on-reset threshold 150 nA
Shutdown. No clocks running, no retention 150
Standby
without cache retention		 RTC running, CPU, 80KB RAM and (partial) register retention.
RCOSC_LF		 0.85 µA
RTC running, CPU, 80KB RAM and (partial) register retention
XOSC_LF		 0.99 µA
Standby
with cache retention		 RTC running, CPU, 80KB RAM and (partial) register retention.
RCOSC_LF		 2.78 µA
RTC running, CPU, 80KB RAM and (partial) register retention.
XOSC_LF		 2.92 µA
Idle Supply Systems and RAM powered
RCOSC_HF		 590 µA
Active MCU running CoreMark at 48 MHz
RCOSC_HF		 2.89 mA
Peripheral Current Consumption 1, 2
Iperi Peripheral power domain Delta current with domain enabled 82.3 µA
Serial power domain Delta current with domain enabled 5.5
RF Core Delta current with power domain enabled,
clock enabled, RF core idle		 178.9
µDMA Delta current with clock enabled, module is idle 53.6
Timers Delta current with clock enabled, module is idle(5) 67.8
I2C Delta current with clock enabled, module is idle 8.2
I2S Delta current with clock enabled, module is idle 21.7
SSI Delta current with clock enabled, module is idle(4) 69.4
UART Delta current with clock enabled, module is idle(3) 140.8
CRYPTO (AES) Delta current with clock enabled, module is idle 21.1
PKA Delta current with clock enabled, module is idle 71.1
TRNG Delta current with clock enabled, module is idle 29.7
Sensor Controller Engine Consumption
ISCE Active mode 24 MHz, infinite loop, VDDS = 3.0 V 808.5 µA
Low-power mode 2 MHz, infinite loop, VDDS = 3.0 V 30.1
(1) Adds to core current Icore for each peripheral unit activated.
(2) Iperi is not supported in Standby or Shutdown modes.
(3) Only one UART running
(4) Only one SSI running
(5) Only one GPTimer running