SWRS306 October   2024 CC2755R10

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Functional Block Diagram
  6. 5Device Comparison
  7. 6Pin Configuration and Functions
    1. 6.1 Pin Diagram—RHA package
    2. 6.2 Signal Descriptions – RHA Package
    3. 6.3 Connections for Unused Pins and Modules—RHA Package
    4. 6.4 RHA Peripheral Pin Mapping
    5. 6.5 RHA Peripheral Signal Descriptions
  8. 7Device and Documentation Support
    1. 7.1 Device Nomenclature
    2. 7.2 Tools and Software
      1. 7.2.1 SimpleLink™ Microcontroller Platform
    3. 7.3 Documentation Support
    4. 7.4 Support Resources
    5. 7.5 Trademarks
    6. 7.6 Electrostatic Discharge Caution
    7. 7.7 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

Wireless MCU Processing Elements
  • Arm® Cortex®-M33 processor (96MHz) with FPU (floating point unit), TrustZone®-M support and CDE (custom datapath extension) for machine learning acceleration
  • Algorithm Processing Unit (APU) (96MHz)
    • Mathematical accelerator for efficient vector and matrix operations
    • Bluetooth® 6.0 Channel Sounding post-processing support for IFFT and advanced super-resolution algorithms like MUSIC (MUltiple SIgnal Classification)
Wireless MCU Memory
  • Up to 1MB of in-system programmable flash
  • Up to 162KB of SRAM
  • 32KB of System ROM with secure boot root of trust (RoT) and a serial (SPI/UART) bootloader
  • Serial wire debug (SWD)
MCU Peripherals
  • 23 GPIOs, digital peripherals can be routed to multiple GPIOs
    • Two IO pads SWD, multiplexed with GPIOs
    • Two IO pads LFXT, multiplexed with GPIOs
    • 19 DIOs (analog or digital IOs)
  • All GPIOs with wakeup and interrupt capabilities
  • 3 × 16-bit and 1 × 32-bit general-purpose timers, quadrature decode mode support
  • Real-time clock (RTC)
  • Watchdog timer
  • System timer for radio, RTOS, and application operations for Bluetooth channel sounding postprocessing
  • 12-bit ADC, up to 1.2Msps, 8 external inputs
  • Temperature sensor and battery monitor
  • 1× low power comparator
  • 2× UART with LIN capability
  • 2× SPI
  • 1× I2C
  • 1× I2S
Security enablers
  • Global Platform SESIP (Security Evaluation Standard for IoT Platforms) Level 3 and Arm PSA (Platform Security Architecture) Level 3 Certification
  • Hardware Security Module (HSM) with proprietary controller and dedicated memories supporting accelerated cryptographic operations and secure key storage:
    • AES (up to 256 bits) crypto accelerator
    • ECC (up to 521 bits), RSA (up to 3072 bits) public key accelerator
    • SHA-2 (up to 512 bits) accelerator
    • True random number generator
    • HSM firmware update support
  • Separate AES 128bit crypto accelerator (LAES) for latency-critical link-layer crypto operations
  • Secure boot and secure firmware updates
  • Cortex®-M33 TrustZone-M, MPU, memory firewalls for software isolation
  • Voltage glitch monitor (VGM)
Low power consumption (at 3.3V)
  • On-chip buck DC/DC converter
  • RX current: 6.1mA
  • TX current at 0dBm: 7.7mA
  • TX current at +10dBm: 24mA
  • TX current at +20dBm: 128mA (P version)
  • Active mode MCU 96MHz (CoreMark®): 6.8mA
  • Standby: 0.9µA (low power mode, RTC on, full RAM retention)
  • Reset or Shutdown: 160nA
Wireless protocol support
  • Matter
  • Bluetooth® 6.x Low Energy
    • Support for Bluetooth Channel Sounding (High Accuracy Distance Measurement)
  • Zigbee®
  • Thread
  • Proprietary Systems
High-performance radio
  • 2.4GHz RF transceiver compatible with Bluetooth® Low Energy specification and IEEE 802.15.4 specification
  • Output power up to +10dBm (R version)
  • Output power up to +20dBm (P version)
  • Integrated BALUN
  • Integrated RF switch
  • Receiver sensitivity:
    • -103.5dBm for Bluetooth® LE 125kbps
    • -97dBm for Bluetooth® LE 1Mbps
    • –103dBm for IEEE 802.15.4 (2.4GHz)
Regulatory compliance
  • Designed for systems targeting compliance with worldwide radio frequency regulations
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15 (US)
    • ARIB STD-T66 (Japan)
Development Tools and Software
  • LP-EM-CC2745R10-Q1 LaunchPad™ Development Kit
  • BP-EM-CS Multiple antenna board for Bluetooth 6.0 Channel Sounding
  • SimpleLink™ Low Power F3 Software Development Kit (SDK)
    • Fully qualified Bluetooth® software protocol stack in SDK
      • Up to 32 concurrent multirole connections
      • Bluetooth 6.0 Channel Sounding Support
  • SysConfig system configuration tool
  • SmartRF™ Studio for simple radio configuration

Operating range:

  • Junction temperature TJ: –40⁰C to 125⁰C
  • Wide supply voltage range 1.71V to 3.8V
Package
  • 6mm × 6mm QFN40 with wettable flanks