SWRS306 October   2024 CC2755R10

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Functional Block Diagram
  6. 5Device Comparison
  7. 6Pin Configuration and Functions
    1. 6.1 Pin Diagram—RHA package
    2. 6.2 Signal Descriptions – RHA Package
    3. 6.3 Connections for Unused Pins and Modules—RHA Package
    4. 6.4 RHA Peripheral Pin Mapping
    5. 6.5 RHA Peripheral Signal Descriptions
  8. 7Device and Documentation Support
    1. 7.1 Device Nomenclature
    2. 7.2 Tools and Software
      1. 7.2.1 SimpleLink™ Microcontroller Platform
    3. 7.3 Documentation Support
    4. 7.4 Support Resources
    5. 7.5 Trademarks
    6. 7.6 Electrostatic Discharge Caution
    7. 7.7 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Device Comparison

IP CC2755P10 CC2755R10
CM33 (MCU) ✔ ✔
CDE (Custom Datapath Extension) (Machine Learning Acceleration) ✔ ✔

APU (Algorithm Processing Unit)

(Bluetooth Channel Sounding Post-processing)

 ✔ ✔
HSM ✔ ✔
VGM ✔ ✔
2x UART, 2x SPI, 1x I2C, 1x I2S ✔ ✔
+10dBm PA ✔ ✔
+20dBm PA ✔
ADC12 ✔ ✔
Flash (KB) 10241 10241
SRAM (KB) 162 162
GPIO 23 23
QFN PKG Size (mm x mm) 6 × 6 6 × 6
  1. 128KB of the device flash memory is reserved for the HSM firmware.