SWAS034B February   2017  – July 2024 CC3120

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagrams
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagram
    2. 6.2 Pin Attributes
    3. 6.3 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Current Consumption Summary
    6. 7.6  TX Power and IBAT versus TX Power Level Settings
    7. 7.7  Brownout and Blackout Conditions
    8. 7.8  Electrical Characteristics (3.3 V, 25°C)
    9. 7.9  WLAN Receiver Characteristics
    10. 7.10 WLAN Transmitter Characteristics
    11. 7.11 WLAN Filter Requirements
      1. 7.11.1 WLAN Filter Requirements
    12. 7.12 Thermal Resistance Characteristics
      1. 7.12.1 Thermal Resistance Characteristics for RGK Package
    13. 7.13 Reset Requirement
    14. 7.14 Timing and Switching Characteristics
      1. 7.14.1 Power Supply Sequencing
      2. 7.14.2 Device Reset
      3. 7.14.3 Reset Timing
        1. 7.14.3.1 nRESET (32-kHz Crystal)
        2. 7.14.3.2 First-Time Power-Up and Reset Removal Timing Requirements (32-kHz Crystal)
        3. 7.14.3.3 nRESET (External 32-kHz)
          1. 7.14.3.3.1 First-Time Power-Up and Reset Removal Timing Requirements (External 32-kHz)
      4. 7.14.4 Wakeup From HIBERNATE Mode
        1. 7.14.4.1 nHIB Timing Requirements
      5. 7.14.5 Clock Specifications
        1. 7.14.5.1 Slow Clock Using Internal Oscillator
          1. 7.14.5.1.1 RTC Crystal Requirements
        2. 7.14.5.2 Slow Clock Using an External Clock
          1. 7.14.5.2.1 External RTC Digital Clock Requirements
        3. 7.14.5.3 Fast Clock (Fref) Using an External Crystal
          1. 7.14.5.3.1 WLAN Fast-Clock Crystal Requirements
        4. 7.14.5.4 Fast Clock (Fref) Using an External Oscillator
          1. 7.14.5.4.1 External Fref Clock Requirements (–40°C to +85°C)
      6. 7.14.6 Interfaces
        1. 7.14.6.1 Host SPI Interface Timing
          1. 7.14.6.1.1 Host SPI Interface Timing Parameters
        2. 7.14.6.2 Flash SPI Interface Timing
          1. 7.14.6.2.1 Flash SPI Interface Timing Parameters
    15. 7.15 External Interfaces
      1. 7.15.1 SPI Flash Interface
        1. 7.15.1.1 SPI Flash Interface
      2. 7.15.2 SPI Host Interface
        1. 7.15.2.1 SPI Host Interface
      3. 7.15.3 Host UART Interface
        1. 7.15.3.1 SimpleLink™ UART Configuration
        2. 7.15.3.2 5-Wire UART Topology
        3. 7.15.3.3 4-Wire UART Topology
        4. 7.15.3.4 3-Wire UART Topology
  9. 8 Detailed Description
    1. 8.1 Device Features
      1. 8.1.1 WLAN
      2. 8.1.2 Network Stack
      3. 8.1.3 Security
      4. 8.1.4 Host Interface and Driver
      5. 8.1.5 System
    2. 8.2 Power-Management Subsystem
      1. 8.2.1 VBAT Wide-Voltage Connection
      2. 8.2.2 Preregulated 1.85V
    3. 8.3 Low-Power Operating Modes
      1. 8.3.1 Low-Power Deep Sleep
      2. 8.3.2 Hibernate
      3. 8.3.3 Shutdown
    4. 8.4 Memory
      1. 8.4.1 External Memory Requirements
    5. 8.5 Restoring Factory Default Configuration
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Application Information
      1. 9.1.1 Typical Application—CC3120R Wide-Voltage Mode
      2. 9.1.2 Typical Application Schematic—CC3120R Preregulated, 1.85-V Mode
    2. 9.2 PCB Layout Guidelines
      1. 9.2.1 General PCB Guidelines
      2. 9.2.2 Power Layout and Routing
        1. 9.2.2.1 Design Considerations
      3. 9.2.3 Clock Interfaces
      4. 9.2.4 Digital Input and Output
      5. 9.2.5 RF Interface
  11. 10Device and Documentation Support
    1. 10.1 Development Tools and Software
    2. 10.2 Firmware Updates
    3. 10.3 Device Nomenclature
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Export Control Notice
    9. 10.9 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Revision History

Changes from Revision A (May 2021) to Revision B (July 2024)

Changes from February 7, 2018 to May 13, 2021 (from Revision * (Feb 2017) to Revision A (May 2021))

  • Updated formatting and organization to reflect current TI standardsGo
  • Added WPA3 Personal and WPA3 Enterprise to Section 1 Go
  • Changed Features sectionGo
  • Added WPA3 Personal and WPA3 Enterprise to Description Go
  • Changed Description section Go
  • Added Functional Block Diagram to the Functional Block Diagrams sectionGo
  • Added CC3120R Hardware Overview block diagram Go
  • Added Device Comparison sectionGo
  • Changed Device Features Comparison tableGo
  • Changed CC3120 SDK Plug-In linkGo
  • Added NC = No internal connection note to the pinout diagram Go
  • Changed Pin Attributes tableGo
  • Deleted the pin number for GND_TAB Go
  • Changed Connections for Unused Pins tableGo
  • Changed the typical value for Hibernate from "4 µA" to "4.5 µA"Go
  • Deleted the + sign from the typical values in the WLAN Transmitter Characteristics tableGo
  • Added the table note "Power of 802.11b rates are reduced to meet ETSI requirements" to the WLAN Transmitter Characteristics tableGo
  • Added Reset Requirement table Go
  • Changed from "200-mS" to 200-ms" in the Device Reset section Go
  • Changed from "pin 32" to "pin 52" in the second list item of the Device Reset section Go
  • Changed the Host SPI Interface Timing diagramGo
  • Changed the parameter numbers in the Host SPI Interface Timing Parameters table Go
  • Changed Flash SPI Interface Timing diagramGo
  • Changed the parameter numbers in the Flash SPI Interface Timing Parameters table Go
  • Added WPA3 Personal and WPA3 Enterprise to Section 8 Go
  • Added WPA3 Personal and WPA3 Enterprise to WLAN Go
  • Added WPA3 personal and enterprise to Table 8-1 Go
  • Added "The typical battery drain in this mode is 4.5 µA" to the Hibernate sectionGo
  • Added "The typical battery drain in this mode is 1 µA" to the Shutdown sectionGo
  • Changed the table title from "Title" to "Recommended Flash Size" Go
  • Changed the CC3120R Wide-Voltage Mode Application Circuit diagramGo
  • Added R14 information to the Bill of Materials for CC3120R in Wide-Voltage Mode tableGo
  • Changed the CC3120R Preregulated 1.85-V Mode Application Circuit diagram Go
  • Added R13 information to the Bill of Materials for CC3120R in Preregulated, 1.85-V Mode tableGo
  • Changed from "XTALM" to "XTAL_N" in the Clock Interfaces sectionGo
  • Changed Tools and Software sectionGo
  • Changed CC3120R Device NomenclaturefigureGo
  • Changed Documentation Support sectionGo