SCHS047M August   1998  – November 2024 CD4051B , CD4052B , CD4053B

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 AC Performance Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Wide range of digital and analog signal levels:
    • Digital: 3V to 20V
    • Analog: ≤ 20VP-P
  • Low ON resistance, 125Ω (typical) over 15VP-P signal input range for VDD – VEE = 18V
  • High OFF resistance, channel leakage of ±10pA (typical) at VDD – VEE = 18V
  • Logic-level conversion for digital addressing signals of 3V to 20V (VDD – VSS = 3V to 20V) to switch analog signals to 20VP-P (VDD – VEE = 20V) matched switch characteristics, rON = 5Ω (typical) for VDD – VEE = 15V very low quiescent power dissipation under all digital-control input and supply conditions, 0.2µW (typical) at VDD – VSS = VDD – VEE = 10V
  • Binary address decoding on chip
  • 5V, 10V, and 15V parametric ratings
  • 100% tested for quiescent current at 20V
  • Maximum input current of 1µA at 18V over full package temperature range, 100nA at 18V and 25°C
  • Break-before-make switching eliminates channel overlap