SCAS882E June   2009  – October 2016 CDCE62002

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Thermal Information
    3. 7.3 Electrical Characteristics
    4. 7.4 Timing Requirements
    5. 7.5 SPI Bus Timing Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
      1. 9.2.1 Interface and Control Block
      2. 9.2.2 Input Block
      3. 9.2.3 Output Block
      4. 9.2.4 Synthesizer Block
      5. 9.2.5 Computing the Output Frequency
    3. 9.3 Feature Description
      1. 9.3.1 Phase Noise Analysis
      2. 9.3.2 Output-to-Output Isolationthe OUTPUT TO OUTPUT ISOLATION section
      3. 9.3.3 Device Control
      4. 9.3.4 External Control Pins
        1. 9.3.4.1 Factory Default Programming
      5. 9.3.5 Input Block
        1. 9.3.5.1 Reference Input Buffer
        2. 9.3.5.2 Smart Multiplexer Dividers
        3. 9.3.5.3 Auxiliary Input Port
        4. 9.3.5.4 Output Block
        5. 9.3.5.5 Synthesizer Block
        6. 9.3.5.6 Input Divider
        7. 9.3.5.7 Feedback and Feedback Bypass Divider
          1. 9.3.5.7.1 VCO Select
          2. 9.3.5.7.2 Prescaler
          3. 9.3.5.7.3 Loop Filter
        8. 9.3.5.8 Internal Loop Filter Component Configuration
      6. 9.3.6 Lock Detect
      7. 9.3.7 Crystal Input Interface
      8. 9.3.8 VCO Calibration
      9. 9.3.9 Start-Up Time Estimation
    4. 9.4 Device Functional Modes
      1. 9.4.1 Clock Generator
      2. 9.4.2 SERDES Start-Up and Clock Cleaner
      3. 9.4.3 Clocking ADCS With the CDCE62002
    5. 9.5 Programming
      1. 9.5.1 Interface and Control Block
        1. 9.5.1.1 SPI (Serial Peripheral Interface)
        2. 9.5.1.2 SPI Interface Master
        3. 9.5.1.3 SPI Consecutive Read/Write Cycles to the CDCE62002
        4. 9.5.1.4 Writing to the CDCE62002
        5. 9.5.1.5 Reading from the CDCE62002
        6. 9.5.1.6 Writing to EEPROM
        7. 9.5.1.7 CDCE62002 SPI Command Structure
      2. 9.5.2 Device Configuration
    6. 9.6 Register Maps
      1. 9.6.1 Device Registers: Register 0 Address 0x00
      2. 9.6.2 Device Registers: Register 1 Address 0x01
      3. 9.6.3 Device Registers: Register 2 Address 0x02
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Package

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Detailed Description

9.1 Overview

The CDCE62002 comprises of four primary blocks: the interface and control block, the input block, the output block, and the synthesizer block. To determine which settings are appropriate for any specific combination of input and output frequencies, a basic understanding of these blocks is required. The interface and control block determines the state of the CDCE62002 at power up based on the contents of the onboard EEPROM. In addition to the EEPROM, the SPI port is available to configure the CDCE62002 by writing directly to the device registers after power up. The input block selects which of the two input ports is available for use by the synthesizer block. The output block provides two separate clock channels that are fully programmable. The synthesizer block multiplies and filters the input clock selected by the input block.

NOTE

This section of the data sheet provides a high-level description of the features of the CDCE62002 for purpose of understanding its capabilities. For a complete description of device registers and I/O, refer to the Device Configuration section.

9.2 Functional Block Diagrams

CDCE62002 blk_diag_cas882.gif Figure 11. CDCE62002 Block Diagram

9.2.1 Interface and Control Block

The CDCE62002 is a highly flexible and configurable architecture and as such contains a number of registers so that the user may specify device operation. The contents of three 28-bit wide registers implemented in static RAM determine device configuration at all times. On power up, the CDCE62002 copies the contents of the EEPROM into the RAM and the device begins operation based on the default configuration stored in the EEPROM. Systems that do not have a host system to communicate with the CDCE62002 use this method for device configuration.After power up, the host system may overwrite the contents of the RAM through the SPI (Serial Peripheral Interface) port. This enables the configuration and reconfiguration of the CDCE62002 during system operation. Finally, the device offers the ability to copy the contents of the RAM into EEPROM

CDCE62002 ctrl_blk_cas882.gif Figure 12. CDCE62002 Interface and Control Block

9.2.2 Input Block

The input block includes one universal input buffer and an auxiliary input. The input block buffers the incoming signals and facilitates signal routing to the Internal synthesizer block through the smart multiplexer (called the smart MUX). The CDCE62002 can divide the REF_IN signal through the dividers present on the inputs of the first stage of the smart MUX.

CDCE62002 input_blk_cas882.gif Figure 13. CDCE62002 Input Block

9.2.3 Output Block

Both identical output blocks incorporate a clock divider module (CDM), and a universal output buffer. If an individual clock output channel is not used, then the user should disable the output buffer for the unused channel to save device power. Each channel includes 4-bit in register 0 to control the divide ratio. The output divider supports divide ratios from divide of 1 (bypass the divider) 2, 3, 4, 5, 8, 10, 12, 16, 20, 24, and 32.

CDCE62002 out_blk_cas882.gif Figure 14. CDCE62002 Output Block

9.2.4 Synthesizer Block

Figure 15 presents a high-level overview of the synthesizer block on the CDCE62002. This block contains the phase-locked loop, internal loop filter, and dual voltage-controlled oscillators. Only one VCO is selected at a time. The loop is closed after a prescaler divider that feeds the output stage the feedback divider.

CDCE62002 synth_blk_cas882.gif Figure 15. CDCE62002 Synthesizer Block

9.2.5 Computing the Output Frequency

Figure 16 presents the block diagram of the CDCE62002 synthesizer highlighting the clock path for a single output. It also identifies the following regions containing dividers comprising the complete clock path:

  • R: Is the Reference divider values.
  • O: The output divider value (see Output Block for more details)
  • I: The input divider value (see Synthesizer Block for more details)
  • P: The Prescaler divider value (see Synthesizer Block of more details)
  • F: The cumulative divider value of all dividers falling within the feedback divider (see Synthesizer Block for more details)
CDCE62002 clk_path_cas882.gif Figure 16. CDCE62002 Clock Path – Synthesizer

With respect to Figure 16, any output frequency generated by the CDCE62002 relates to the input frequency connected to the Synthesizer Block by Equation 1:

Equation 1. CDCE62002 eq1_fout_cas882.gif

Equation 1 holds true subject to the constraints in Equation 2:

Equation 2. CDCE62002 eq2_con_cas882.gif

And the comparison frequency FCOMP,

40.0 kHz ≤ FCOMP ≤ 40 MHz

Where:

Equation 3. CDCE62002 eq3_fcomp_cas882.gif

When AUX_IN is selected as the input, R can be set to 1 in Equation 1 and Equation 3.

9.3 Feature Description

9.3.1 Phase Noise Analysis

Table 1. Phase Noise for 30.72-MHz External Reference

Phase Noise Specifications under following configuration: VCO = 1966.08 MHz, REF_IN = 30.72 MHz,
PFD Frequency = 30.72 MHz, Charge Pump Current = 1.5-mA Loop BW = 400 kHz at 3.3 V and 25°C.
PHASE NOISE AT REFERENCE
30.72 MHz		 LVPECL-HP
491.52 MHz		 LVPECL
491.52 MHz		 LVDS
491.52 MHz		 LVCMOS
122.88 MHz		 UNIT
10Hz –108 –84 –84 –85 –97 dBc/Hz
100Hz –130 –98 –98 –97 –111 dBc/Hz
1kHz –134 –106 –106 –106 –118 dBc/Hz
10kHz –152 –118 –118 –118 –130 dBc/Hz
100kHz –156 –121 –121 –121 –133 dBc/Hz
1MHz –157 –131 –131 –130 –142 dBc/Hz
10MHz — –146 –146 –145 –151 dBc/Hz
20MHz — –146 –146 –145 –151 dBc/Hz
Jitter(RMS) 10k~20MHz 195
(10k~1MHz)		 319 316 332.2 372.1 fs

Table 2. Phase Noise for 25-MHz Crystal Reference

Phase Noise Specifications under following configuration: VCO = 2000.00 MHz, AUX_IN-REF = 25.00 MHz,
PFD Frequency = 25.00 MHz, Charge Pump Current = 1.5-mA Loop BW = 400 kHz 3.3V and 25°C.
PHASE NOISE AT LVPECL-HP
500.00 MHz		 LVDS
250.00 MHz		 LVCMOS
125.00 MHz		 UNIT
10Hz –72 –72 –79 dBc/Hz
100Hz –97 –97 –103 dBc/Hz
1kHz –111 –111 –118 dBc/Hz
10kHz –120 –120 –126 dBc/Hz
100kHz –124 –124 –130 dBc/Hz
1MHz –136 –136 –142 dBc/Hz
10MHz –147 –147 –151 dBc/Hz
20MHz –148 –148 –151 dBc/Hz
Jitter(RMS) 10k~20MHz 426 426 443 fs

9.3.2 Output-to-Output Isolation

Table 3. Output-to-Output Isolation

WORST SPUR UNIT
The Output to Output Isolation was tested at 3.3-V supply and 25°C ambient temperature (Default Configuration):
Output 1 Measured Channel In LVDS Signaling at 125 MHz –70 dB
Output 0 Aggressor Channel LVPECL 156.25 MHz

9.3.3 Device Control

Figure 17 provides a conceptual explanation of the CDCE62002 Device operation. Table 4 defines how the device behaves in each of the operational states.

CDCE62002 dev_state_cas882.gif Figure 17. CDCE62002 Device State Control Diagram

Table 4. CDCE62002 Device State Definitions

STATE DEVICE BEHAVIOR ENTERED VIA EXITED VIA SPI PORT STATUS PLL STATUS OUTPUT DIVIDER STATUS OUTPUT BUFFER STATUS
Power-On Reset After device power supply reaches approximately 2.35 V, the contents of EEPROM are copied into the Device Registers, thereby initializing the device hardware. Power applied to the device or upon exit from Power-Down State through the PD pin set HIGH. Power-On-Reset and EEPROM loading delays are finished OR the PD pin is set LOW. OFF Disabled Disabled OFF
VCO CAL The voltage-controlled oscillator is calibrated based on the PLL settings and the incoming reference clock. After the VCO has been calibrated, the device enters Active Mode automatically. Delay process in the Power-On Reset State is finished or PLLRESET=ON Calibration Process in completed ON Enabled Disabled OFF
Active Mode Normal Operation CAL Done (VCO calibration process finished) or Sync = OFF (from Sync State). Power Down or PLLRESET=ON ON Enabled Disabled or Enabled Disabled or Enabled
Power Down Used to shut down all hardware and Resets the device after exiting the Power-Down State. Therefore, the EEPROM contents will eventually be copied into RAM after the Power-Down State is exited. PD pin is pulled LOW. PD pin is pulled HIGH. ON Disabled Disabled Disabled
Sync Sync synchronizes both outputs dividers so that they begin counting at the same time Sync Bit in device register 2 bit 8 is set LOW Sync bit in device register 2 bit 8 is set HIGH ON Enabled Disabled Disabled

9.3.4 External Control Pins

Power Down (PD)

When pulled LOW, PD activates the power-down state which shuts down all hardware and resets the device. Restoring PD high will cause the CDCE62002 to exit the power-down state. This causes the device to behave as if it has been powered up including copying the EEPROM contents into RAM. PD pin also has a shadowed PD bit residing in Register 2 Bit 7. When asserted Low it puts the device in power-down mode, but it does not load the EEPROM when the bits is disserted.

NOTE

The SPI_LE signal has to be high in order for the EEPROM to load correctly into RAM on the Rising edge of PD Pin.

9.3.4.1 Factory Default Programming

The CDCE62002 is factory pre-programmed to work with 25-MHz input from the reference input or from the auxiliary input with auto switching enabled. An internal PFD of 6.25 MHz and about 400-KHz loop bandwidth. Output 0 is pre-programmed as an LVPECL driver to output 156.25 MHz and output 1 is pre-programmed as LVDS driver to output 125 MHz.

CDCE62002 fac_prog_cas882.gif Figure 18. CDCE62002 Default Factory Programming

9.3.5 Input Block

The input block includes one universal input buffers, an auxiliary input, and a smart multiplexer.

CDCE62002 reg_ref_cas882.gif Figure 19. CDCE62002 Input Block With References to Registers

The CDCE62002 provides a reference divider that divides the clock exiting reference (REF_IN) input buffer.

Table 5. CDCE62002 Reference Divider Settings

REFERENCE DIVIDER TOTAL
DIVIDE
RATIO
BIT NAME → REFDIVIDE3 REFDIVIDE2 REFDIVIDE1 REFDIVIDE0
REGISTER BIT → 0.9 0.8 0.7 0.6
0 0 0 0 /1
0 0 0 1 /2
0 0 1 0 /3
0 0 1 1 /4
0 1 0 0 /5
0 1 0 1 /6
0 1 1 0 /7
0 1 1 1 /8
1 0 0 0 /2
1 0 0 1 /4
1 0 1 0 /6
1 0 1 1 /8
1 1 0 0 /10
1 1 0 1 /12
1 1 1 0 /14
1 1 1 1 /16

9.3.5.1 Reference Input Buffer

Figure 20 shows the key elements of a universal input buffer (UIB). A UIB supports multiple formats along with different termination and coupling schemes. The CDCE62002 implements the UIB by including onboard switched termination, a programmable bias voltage generator, and a multiplexer. The CDCE62002 provides a high degree of configurability on the UIB to facilitate most existing clock input formats. REF_IN only provides biasing internally. TI recommends terminating it externally if needed.

CDCE62002 IP_buff_cas882.gif Figure 20. CDCE62002 Universal Input Buffer

9.3.5.2 Smart Multiplexer Dividers

CDCE62002 smt_multif_cas882.gif Figure 21. CDCE62002 Smart Multiplexer

In auto select mode the smart Mux switches automatically between reference input and auxiliary input with a preference to the reference input. In order for the smart MUX to function correctly the frequency after the reference divider and the auxiliary input signal frequency should be within 20% of each other or one of them should be zero or ground. In REF select mode, TI recommends connecting AUX_IN to GND with a 1-k pulldown resistor. In AUX Select mode, TI recommends pulling the REF_INp high and REF_INn low with a 1-k resistor each.

9.3.5.3 Auxiliary Input Port

The auxiliary input on the CDCE62002 is designed to connect to an AT-Cut Crystal with a total load capacitance of 8 pF to 10 pF. One side of the crystal connects to ground while the other side connects to the auxiliary input of the device. The circuit accepts crystals from 2 to 42 MHz. See the Crystal Input Interface section for crystal load selection.

CDCE62002 aux_input_cas882.gif Figure 22. CDCE62002 Auxiliary Input Port

9.3.5.4 Output Block

The output block includes two identical output channels. Each output channel comprises of a clock divider module, and a universal output buffer as shown in Figure 23.

CDCE62002 out_chan_cas882.gif Figure 23. CDCE62002 Output Channel

Table 6. CDCE62002 Output Divider Settings

OUTPUT DIVIDERS SETTING DIVIDE RATIO
DIVIDER 0 → 0.18 0.17 0.16 0.15
DIVIDER 1 → 0.22 0.21 0.20 0.19
0 0 0 0 Disabled
0 0 0 1 /1
0 0 1 0 /2
0 0 1 1 /3
0 1 0 0 /4
0 1 0 1 /5
0 1 1 0 /6
0 1 1 1 Disabled
1 0 0 0 /8
1 0 0 1 Disabled
1 0 1 0 /10
1 0 1 1 /20
1 1 0 0 /12
1 1 0 1 /24
1 1 1 0 /16
1 1 1 1 /32

9.3.5.5 Synthesizer Block

Figure 24 provides an overview of the CDCE62002 synthesizer block. The synthesizer block provides a phase-locked loop, a partially integrated programmable loop filter, and two voltage-controlled oscillators (VCO). The synthesizer block generates an output clock called SYNTH and drives it onto the Internal clock distribution bus.

CDCE62002 syn2_blk_cas882.gif Figure 24. CDCE62002 Synthesizer Block

9.3.5.6 Input Divider

The input divider divides the clock signal selected by the smart multiplexer and presents the divided signal to the phase frequency detector / charge pump of the frequency synthesizer.

Table 7. CDCE62002 Input Divider Settings

INPUT DIVIDER SETTINGS DIVIDE
RATIO
SELINDIV7 SELINDIV6 SELINDIV5 SELINDIV4 SELINDIV3 SELINDIV2 SELINDIV1 SELINDIV0
1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1
0 0 0 0 0 0 0 0 1
0 0 0 0 0 0 0 1 2
0 0 0 0 0 0 1 0 3
0 0 0 0 0 0 1 1 4
0 0 0 0 0 1 0 0 5
0 0 0 0 0 1 0 1 6
– – – – – – – – –
– – – – – – – – –
1 1 1 1 1 1 1 1 256

9.3.5.7 Feedback and Feedback Bypass Divider

Table 8 shows how to configure the feedback divider for various divide values:

Table 8. CDCE62002 Feedback Divider Settings

FEEDBACK DIVIDER DIVIDE
RATIO
SELFBDIV7 SELFBDIV6 SELFBDIV5 SELFBDIV4 SELFBDIV3 SELFBDIV2 SELFBDIV1 SELFBDIV0
1.18 1.17 1.16 1.15 1.14 1.13 1.12 1.11
0 0 0 0 0 0 0 0 8
0 0 0 0 0 0 0 1 12
0 0 0 0 0 0 1 0 16
0 0 0 0 0 0 1 1 20
0 0 0 0 0 1 0 1 24
0 0 0 0 0 1 1 0 32
0 0 0 0 1 0 0 1 36
0 0 0 0 0 1 1 1 40
0 0 0 0 1 0 1 0 48
0 0 0 1 1 0 0 0 56
0 0 0 0 1 0 1 1 60
0 0 0 0 1 1 1 0 64
0 0 0 1 0 1 0 1 72
0 0 0 0 1 1 1 1 80
0 0 0 1 1 0 0 1 84
0 0 0 1 0 1 1 0 96
0 0 0 1 0 0 1 1 100
0 1 0 0 1 0 0 1 108
0 0 0 1 1 0 1 0 112
0 0 0 1 0 1 1 1 120
0 0 0 1 1 1 1 0 128
0 0 0 1 1 0 1 1 140
0 0 1 1 0 1 0 1 144
0 0 0 1 1 1 1 1 160
0 0 1 1 1 0 0 1 168
0 1 0 0 1 0 1 1 180
0 0 1 1 0 1 1 0 192
0 0 1 1 0 0 1 1 200
0 1 0 1 0 1 0 1 216
0 0 1 1 1 0 1 0 224
0 0 1 1 0 1 1 1 240
0 1 0 1 1 0 0 1 252
0 0 1 1 1 1 1 0 256
0 0 1 1 1 0 1 1 280
0 1 0 1 0 1 1 0 288
0 1 0 1 0 0 1 1 300
0 0 1 1 1 1 1 1 320
0 1 0 1 1 0 1 0 336
0 1 0 1 0 1 1 1 360
0 1 0 1 1 1 1 0 384
1 1 0 1 1 0 0 0 392
0 1 1 1 0 0 1 1 400
0 1 0 1 1 0 1 1 420
1 0 1 1 0 1 0 1 432
0 1 1 1 1 0 1 0 448
0 1 0 1 1 1 1 1 480
1 0 0 1 0 0 1 1 500
1 0 1 1 1 0 0 1 504
0 1 1 1 1 1 1 0 512
0 1 1 1 1 0 1 1 560
1 0 1 1 0 1 1 0 576
1 1 0 1 1 0 0 1 588
1 0 0 1 0 1 1 1 600
0 1 1 1 1 1 1 1 640
1 0 1 1 1 0 1 0 672
1 0 0 1 1 0 1 1 700
1 0 1 1 0 1 1 1 720
1 0 1 1 1 1 1 0 768
1 1 0 1 1 0 1 0 784
1 0 0 1 1 1 1 1 800
1 0 1 1 1 0 1 1 840
1 1 0 1 1 1 1 0 896
1 0 1 1 1 1 1 1 960
1 1 0 1 1 0 1 1 980
1 1 1 1 1 1 1 0 1024
1 1 0 1 1 1 1 1 1120
1 1 1 1 1 1 1 1 1280

Table 9 shows how to configure the Feedback Bypass Divider.

Table 9. CDCE62002 Feedback Bypass Divider Settings

FEEDBACK BYPASS DIVIDER DIVIDE RATIO
SELBPDIV2 SELBPDIV1 SELBPDIV0
1.21 1.20 1.19
0 0 0 2
0 0 1 5
0 1 0 8
0 1 1 10
1 0 0 16
1 0 1 20
1 1 0 RESERVED
1 1 1 1(bypass)

9.3.5.7.1 VCO Select

Table 10 illustrates how to control the dual voltage controlled oscillators.

Table 10. CDCE62002 VCO Select

BIT NAME → VCO SELECT
SELVCO		 VCO CHARACTERISTICS
REGISTER NAME → 1.0 VCO RANGE Fmin (MHz) Fmax (MHz)
0 Low 1750 2046
1 High 2040 2356

9.3.5.7.2 Prescaler

Table 11 shows how to configure the prescaler.

Table 11. CDCE62002 Prescaler Settings

SETTINGS DIVIDE RATIO
SELPRESCB SELPRESCA
1.10 1.9
0 0 5
1 0 4
0 1 3
1 1 2

9.3.5.7.3 Loop Filter

Figure 25 depicts the loop filter topology of the CDCE62002. It facilitates both internal and external implementations providing optimal flexibility.

CDCE62002 loop_filter_cas882.gif Figure 25. CDCE62002 Loop Filter Topology

9.3.5.8 Internal Loop Filter Component Configuration

Figure 25 illustrates the switching between four fixed internal loop filter settings and the external loop filter setting. Table 12 shows that the CDCE62002 has 16 settings different settings for the loop filter. Four of the settings are internal and twelve are external.

Table 12. CDCE62002 Loop Filter Settings

LFRCSEL Charge
Pump
3 2 1 0 Loop Filter C1 C2 R2 R3 C3 Current
0 0 0 0 Internal 1.5 pF 473.5 pF 4.0k 5k 2.5 pF 1.5 mA
0 0 0 1 Internal 1.5 pF 473.5 pF 4.0k 5k 2.5 pF 400 μA
0 0 1 0 Internal 1.5 pF 473.5 pF 2.7k 5k 2.5 pF 250 μA
0 0 1 1 Internal 1.5 pF 473.5 pF 2.7k 5k 2.5 pF 150 μA
0 1 0 0 External X X X 20k 112 pF 1.0 mA
0 1 0 1 External X X X 20k 112 pF 2.0 mA
0 1 1 0 External X X X 20k 112 pF 3.0 mA
0 1 1 1 External X X X 20k 112 pF 3.75 mA
1 0 0 0 External X X X 10k 100 pF 1.0 mA
1 0 0 1 External X X X 10k 100 pF 2.0 mA
1 0 1 0 External X X X 10k 100 pF 3.0 mA
1 0 1 1 External X X X 10k 100 pF 3.75 mA
1 1 0 0 External X X X 5k 100 pF 1.0 mA
1 1 0 1 External X X X 5k 64 pF 2.0 mA
1 1 1 0 External X X X 5k 48 pF 3.0 mA
1 1 1 1 External X X X 5k 38 pF 3.75 mA

9.3.6 Lock Detect

The CDCE62002 provides a lock detect indicator circuit that can be detected on an external Pin PLL_LOCK (Pin 32) and internally by reading PLLLOCKPIN bit (6) in Register 2.

Two signals whose phase difference is less than a prescribed amount are locked otherwise they are unlocked. The phase frequency detector / charge pump compares the clock provided by the input divider and the feedback divider; using the input divider as the phase reference. The lock detect circuit implements a programmable lock detect window. Table 13 shows an overview of how to configure the lock detect feature. The PLL_LOCK pin will possibly jitter several times between lock and out of lock until the PLL achieves a stable lock. If desired, choosing a wide loop bandwidth and a high number of successive clock cycles virtually eliminates this characteristic. PLL_LOCK will return to out of lock, if just one cycle is outside the lock detect window or if a cycle slip occurs.

CDCE62002 lock_det_cas882.gif Figure 26. CDCE62002 Lock Detect

Table 13. CDCE62002 Lock Detect Control

LOCK DETECT LOCK DETECT WINDOW
BIT NAME → LOCKW(1) LOCKW(0)
REGISTER NAME → 0.13 0.14
0 0 2.1 ns
0 1 4.6 ns
1 0 7.2 ns
1 1 19.9 ns

9.3.7 Crystal Input Interface

In fundamental mode, TI recommends the oscillation mode of operation for the input crystal and parallel resonance is the recommended type of circuit for the crystal.

A crystal load capacitance refers to all capacitances in the oscillator feedback loop. It is equal to the amount of capacitance seen between the terminals of the crystal in the circuit. For parallel resonant mode circuits, the correct load capacitance is necessary to ensure the oscillation of the crystal within the expected parameters.

The CDCE62002 implements an input crystal oscillator circuitry, known as the Colpitts oscillator, and requires one pad of the crystal to interface with the AUX_IN pin; the other pad of the crystal is tied to ground. In this crystal interface, it is important to account for all sources of capacitance when calculating the correct value for the discrete capacitor component, CL, for a design.

The CDCE62002 has been characterized with 10-pF parallel resonant crystals. The input crystal oscillator stage in the CDCE62002 is designed to oscillate at the correct frequency for all parallel resonant crystals with low-pull capability and rated with a load capacitance that is equal to the sum of the on-chip load capacitance at the AUX_IN pin (10-pF), crystal stray capacitance, and board parasitic capacitance between the crystal and AUX_IN pin.

The normalized frequency error of the crystal, as a result of load capacitance mismatch, can be calculated as Equation 4:

Equation 4. CDCE62002 new_EQ4_cas882.gif

where

  • CS is the motional capacitance of the crystal
  • C0 is the shunt capacitance of the crystal
  • CL,R is the rated load capacitance for the crystal
  • CL,A is the actual load capacitance in the implemented PCB for the crystal
  • Δf is the frequency error of the crystal
  • f is the rated frequency of the crystal

The first three parameters can be obtained from the crystal vendor.

To minimize the frequency error of the crystal to meet application requirements, the difference between the rated load capacitance and the actual load capacitance must be minimized and a crystal with low-pull capability (low CS) must be used.

For example, if an application requires less than ±50-ppm frequency error and a crystal with less than ±50-ppm frequency tolerance is picked, the characteristics are as follows: C0 = 7 pF, CS = 10 pF, and CL,R = 12 pF. To meet the required frequency error, calculate CL,A using Equation 4 to be 17 pF. Subtracting CL,R from CL,A, results in 5 pF; take care during printed-circuit board (PCB) layout with the crystal and the CDCE62002 to ensure that the sum of the crystal stray capacitance and board parasitic capacitance is less than the calculated 5 pF.

Good layout practices are fundamental to the correct operation and reliability of the oscillator. It is critical to place the crystal components very close to the XIN pin to minimize routing distances. Long traces in the oscillator circuit are a very common source of problems. Do not route other signals across the oscillator circuit. Also, make sure power and high-frequency traces are routed as far away as possible to avoid crosstalk and noise coupling. Avoid the use of vias; if the routing becomes very complex, it is better to use 0-Ω resistors as bridges to go over other signals. Vias in the oscillator circuit must only be used for connections to the ground plane. Do not share ground connections; instead, make a separate connection to ground for each component that requires grounding. If possible, place multiple vias in parallel for each connection to the ground plane. Especially in the Colpitts oscillator configuration, the oscillator is very sensitive to capacitance in parallel with the crystal. Therefore, the layout must be designed to minimize stray capacitance across the crystal to less than 5 pF total under all circumstances to ensure proper crystal oscillation. Be sure to take into account both PCB and crystal stray capacitance.

9.3.8 VCO Calibration

The CDCE62002 includes two on-chip LC oscillator-based VCOs with low phase noise covering a frequency range of 1.75 GHz to 2.356 GHz. The VCO must be calibrated to ensure proper operation over the valid device operating conditions. VCO calibration is controlled by the reference clock input. This calibration requires that the PLL be set up properly to lock the PLL loop and that the reference clock input be present.

The device enters self-calibration of the VCO automatically at power up, after the registers have been loaded from the EEPROM and an input clock signal is detected. If there is no input clock available during power up, the VCO will wait for reference clock before starting calibration.

If the input signal is not valid during self-calibration, it is necessary to re-initiate VCO calibration after the input clock signal stabilizes.

NOTE

Re-calibration is also necessary anytime a PLL setting is changed (e.g. divider ratios in the PLL or loop filter settings are adjusted).

VCO calibration can be initiated by writing to register 2 bits 7, 13 and 20.

Table 14. VCO Calibration Method Through Register Programming

CALSELECT
Reg 2.13		 PLLRESET
2.20		 PD
2.7		 VCO CALIBRATION MECHANISM(1)
1 1-0-1 1 VCO calibration starts at PLLRESET toggling low-to-high. The outputs turn off for the duration of the calibration, which is a few ns.
0 X 1-0-1 Device is powered down when PD is toggle 1-to-0. All outputs are disabled while PD is zero. After asserting PD from zero to one the VCO becomes calibrated and immediately afterwards the device outputs turn on.
(1) A VCO calibration is also initiated if the external PD pin is toggle high-low-high. In this case all EEPROM registers become reloaded into the device and the CALSELECT bit is reset to 0.

9.3.9 Start-Up Time Estimation

The CDCE62002 startup time can be estimated based on the parameters defined in Table 15 and graphically shown in Figure 27.

Table 15. Start-up Time Dependencies

PARAMETER DESCRIPTION METHOD OF DETERMINATION
tpul Power-up time (low limit) Power-supply rise time to low limit of power-on-reset (POR) trip point Time required for power supply to ramp to 2.27 V
tpuh Power-up time (high limit) Power-supply rise time to high limit of power-on-reset (POR) trip point Time required for power supply to ramp to 2.64 V
trsu Reference start-up time After POR releases, the Colpitts oscillator is enabled. This start-up time is required for the oscillator to generate the requisite signal levels for the delay block to be clocked by the reference input 500 µs best-case and 800 µs worst-case (This is only for crystal connected to AUX_IN)
tdelay Delay time Internal delay time generated from the clock. This delay provides time for the oscillator to stabilize. tdelay = 16384 x tid
tid = period of input clock to the input divider
tVCO_CAL VCO calibration time VCO calibration time generated from the PFD clock. This process selects the operating point for the VCO based on the PLL settings. tVCO_CAL = 550 x tPFD
tPFD = period of the PFD clock
tPLL_LOCK PLL lock time Time required for PLL to lock within ±10 ppm of reference frequency tPLL_LOCK = 3/LBW
LBW = PLL Loop Bandwidth
CDCE62002 startup_tim_cas882.gif Figure 27. Start-Up Time dependencies

9.4 Device Functional Modes

9.4.1 Clock Generator

The CDCE62002 can generate 1 to 4 low noise clocks from a single crystal or crystal oscillator as follows:

CDCE62002 clk_gen_cas882.gif Figure 28. CDCE62002 as a Clock Generator

9.4.2 SERDES Start-Up and Clock Cleaner

The CDCE62002 can serve as a SERDES device companion by providing a crystal based reference for the SERDES device to lock to receive data stream and when the SERDES locks to the data and outputs the recovered clock the CDCE62002 can switch and use the recovered clock and serve as a jitter cleaner.

CDCE62002 serdes_clk_cas882.gif Figure 29. CDCE62002 Clocking SERDES

Because the jitter of the recovered clock can be above 100 ps (RMS), the output jitter from CDCE62002 can be as low and 6 ps (RMS) depending on the external loop filter configuration.

9.4.3 Clocking ADCS With the CDCE62002

High-speed analog to digital converters incorporate high input bandwidth on both the analog port and the sample clock port. Often the input bandwidth far exceeds the sample rate of the converter. Engineers regularly implement receiver chains that take advantage of the characteristics of bandpass sampling. This implementation trend often causes engineers working in communications system design to encounter the term clock-limited performance. Therefore, it is important to understand the impact of clock jitter on ADC performance. Equation 5 shows the relationship of data converter signal to noise ratio (SNR) to total jitter:

Equation 5. CDCE62002 eq4_snr_jit_cas882.gif

Total jitter comprises two components: the intrinsic aperture jitter of the converter and the jitter of the sample clock:

Equation 6. CDCE62002 eq5_jit_tot_cas882.gif

With respect to an ADC with N-bits of resolution, ignoring total jitter, ADC quantization error, and input noise, Equation 7 shows the relationship between resolution and SNR:

Equation 7. CDCE62002 eq6_snr_adc_cas882.gif

Figure 30 plots Equation 5 and Equation 7 for constant values of total jitter. When used in conjunction with most ADCs, the CDCE62002 supports a total jitter performance value of <1 ps.

CDCE62002 datacon_jit_cas882.gif Figure 30. Data Converter Jitter Requirements

9.5 Programming

9.5.1 Interface and Control Block

The interface and control block includes a SPI interface, one control pin, a non-volatile memory array in which the device stores default configuration data, and an array of device registers implemented in static RAM. This RAM, also called the device registers, configures all hardware within the CDCE62002.

9.5.1.1 SPI (Serial Peripheral Interface)

The serial interface of CDCE62002 is a simple bidirectional SPI interface for writing and reading to and from the device registers. It implements a low speed serial communications link in a master/slave topology in which the CDCE62002 is a slave. The SPI consists of four signals:

  • SPI_CLK:Serial Clock (Output from Master) – the CDCE62002 and the master host clock data in and out on the rising edge of SPI_CLK. Data transitions therefore occur on the falling edge of the clock. (LVCMOS Input Buffer)
  • SPI_MOSI: Master Output Slave Input (LVCMOS Input Buffer).
  • SPI_MISO: Master Input Slave Output (Open Drain LVCMOS Buffer)
  • SPI_LE: Latch Enable (Output from Master). The falling edge of SPI_LE initiates a transfer. If SPI_LE is high, no data transfer can take place. (LVCMOS Input Buffer).

9.5.1.2 SPI Interface Master

The Interface master can be designed using a FPGA or a microcontroller. The CDCE62002 acts as a slave to the SPI master and only supports non-consecutive read and write command. The SPI clock should start and stop with respect to the SPI_LE signal as shown in Figure 31 SPI_MOSI, SPI_CLK and SPI_LE are generated by the SPI Master. SPI_MISO is generated by the SPI slave the CDCE62002.

CDCE62002 read_wrt_com_cas882.gif Figure 31. CDCE62002 SPI Read/Write Command

9.5.1.3 SPI Consecutive Read/Write Cycles to the CDCE62002

Figure 32 Illustrates how two consecutive SPI cycles are performed between a SPI Master and the CDCE62002 SPI Slave.

CDCE62002 RW_cycles_cas882.gif Figure 32. Consecutive Read/Write Cycles

9.5.1.4 Writing to the CDCE62002

Figure 33 illustrates a Write to RAM operation. Notice that the latching of the first data bit in the data stream (Bit 0) occurs on the first rising edge of SPI_CLK after SPI_LE transitions from a high to a low. For the CDCE62002, data transitions occur on the falling edge of SPI_CLK. A rising edge on SPI_LE signals to the CDCE62002 that the transmission of the last bit in the stream (Bit 31) has occurred.

CDCE62002 SPI_write_cas882.gif Figure 33. CDCE62002 SPI Write Operation

9.5.1.5 Reading from the CDCE62002

Figure 34 shows how the CDCE62002 executes a read command. The SPI master first issues a read command to initiate a data transfer from the CDCE62002 back to the host (see SPI Bus Timing Characteristics). This command specifies the address of the register of interest. By transitioning SPI_LE from a low to a high, the CDCE62002 resolves the address specified in the appropriate bits of the data field. The host drives SPI_LE low and the CDCE62002 presents the data present in the register specified in the read command on SPI_MISO.

CDCE62002 SPI_read_cas882.gif Figure 34. CDCE62002 SPI Read Operation

9.5.1.6 Writing to EEPROM

After the CDCE62002 detects a power-up and completes a reset cycle, the device copies the contents of the on-chip EEPROM into the device registers. (SPI_LE signal has to be HIGH in order for the EEPROM to load correctly during the rising edge of power_down signal).

The host issues a special commands shown in Figure 35 to copy the contents of device registers 0 and 1into EERPOM.

  • Copy RAM to EEPROM – unlock, execution of this command can happen many times.

After the command is initiated, power must remain stable and the host must not access the CDCE62002 for at least 50 ms to allow the EEPROM to complete the write cycle and to avoid the possibility of EEPROM corruption.

9.5.1.7 CDCE62002 SPI Command Structure

The CDCE62002 supports three commands issued by the master through the SPI:

  • Write to RAM
  • Read Command
  • Copy RAM to EEPROM – unlock

Figure 35 provides a summary of the CDCE62002 SPI command structure. The host (master) constructs a Write to RAM command by specifying the appropriate register address in the address field and appends this value to the beginning of the data field. Therefore, a valid command stream must include 32 bits, transmitted LSB first. The host must issue a read command to initiate a data transfer from the CDCE62002 back to the host. This command specifies the address of the register of interest in the data field.

CDCE62002 structure_csa882.gif

NOTE:

‘A’ indicates address bits.
Figure 35. CDCE62002 SPI Command Structure

9.5.2 Device Configuration

The Feature Description section described four different functional blocks contained within the CDCE62002. Figure 36 depicts these blocks along with a high-level functional block diagram of the circuit elements comprising each block. The balance of this section focuses on a detailed discussion of each functional block from the perspective of how to configure them.

CDCE62002 circuit_blk_cas882.gif Figure 36. CDCE62002 Circuit Blocks

9.6 Register Maps

9.6.1 Device Registers: Register 0 Address 0x00

Table 16. CDCE62002 Register 0 Bit Definitions

REGISTER
BIT		 BIT
NAME		 RELATED BLOCK DESCRIPTION / FUNCTION
0 INBUFSELX INBUFSELX Input Buffer Select (LVPECL,LVDS or LVCMOS)
XY(00 ) Disabled, (01) LVDS, (10) LVPECL, (11) LVCMOS
The VBB internal Biasing will be determined from this setting		 EEPROM
1 INBUFSELY INBUFSELY EEPROM
2 REFSEL Smart MUX
Bits(2,3)		 See specific section for more detailed description and configuration setup.
00 – RESERVED
10 – REF_IN Select
01– AUX_IN Select
11 – Auto Select ( Reference then AUX) 		EEPROM
3 AUXSEL EEPROM
4 ACDCSEL Input Buffers If Set to 1 DC Termination, If set to “0” AC Termination EEPROM
5 TERMSEL Input Buffers If Set to 0 Input Buffer Internal Termination Enabled EEPROM
6 REFDIVIDE 0 Reference Divider Settings (Refer to Table 5)
See specific section for more detailed description and configuration setup. 		EEPROM
7 REFDIVIDE 1 EEPROM
8 REFDIVIDE 2 EEPROM
9 REFDIVIDE 3 EEPROM
10 RESERVED Always Set to 0 EEPROM
11 I70TEST TEST Set to 0 for Normal Operation. EEPROM
12 ATETEST TEST Set to 0 for Normal Operation. EEPROM
13 LOCKW(0) PLL Lock Lock-detect window Bit 0 EEPROM
14 LOCKW(1) PLL Lock Lock-detect window Bit 1 EEPROM
15 OUT0DIVRSEL0 Output 0 Output 0 Divider Settings (Refer to Table 6)
See specific section for more detailed description and configuration setup. 		EEPROM
16 OUT0DIVRSEL1 Output 0 EEPROM
17 OUT0DIVRSEL2 Output 0 EEPROM
18 OUT0DIVRSEL3 Output 0 EEPROM
19 OUT1DIVRSEL0 Output 1 Output 1 Divider Settings (Refer to Table 6)
See specific section for more detailed description and configuration setup. 		EEPROM
20 OUT1DIVRSEL1 Output 1 EEPROM
21 OUT1DIVRSEL2 Output 1 EEPROM
22 OUT1DIVRSEL3 Output 1 EEPROM
23 HIPERORMANCE Output 0 & 1 High Performance, If this Bit is set to 1:
– Increases the Bias in the device to achieve Best Phase Noise on the Output Divider
– It changes the LVPECL Buffer to Hi Swing in LVPECL.
– It increases the current consumption by 20mA (Typical)
– This setting only applies to LVPECL output buffers. If none of these two outputs are LVPECL, this bit should be set to zero.		 EEPROM
24 OUTBUFSEL0X Output 0 Output Buffer mode select for OUTPUT 0 .
(X,Y)=00:Disabled, 01:LVCMOS, 10:LVDS, 11:LVPECL		 EEPROM
25 OUTBUFSEL0Y Output 0 EEPROM
26 OUTBUFSEL1X Output 1 Output Buffer mode select for OUTPUT 1 .
(X,Y)=00:Disabled, 01:LVCMOS, 10:LVDS, 11:LVPECL		 EEPROM
27 OUTBUFSEL1Y Output 1 EEPROM

Table 17. Reference Input AC/DC Input Termination Table

REFERENCE INPUT REGISTER
BITS		 VBB VOLTAGE REF+
TERMINATION		 REF–
TERMINATION
INTERNAL TERMINATION 0 1 4 5 GENERATOR 5kΩ to VBB 5kΩ to VBB
External Termination X X X 1 — OPEN OPEN
Disabled 0 0 X X — OPEN OPEN
LVCMOS 1 1 X 0 — OPEN OPEN
LVPECL-AC 1 0 0 0 1.9 V CLOSED CLOSED
LVPECL-DC 1 0 1 0 1.0 V CLOSED CLOSED
LVDS-AC 0 1 0 0 1.2 V CLOSED CLOSED
LVDS-DC 0 1 1 0 1.2 V CLOSED CLOSED

9.6.2 Device Registers: Register 1 Address 0x01

Table 18. CDCE62002 Register 1 Bit Definitions

REGISTER
BIT		 BIT NAME RELATED
BLOCK		 DESCRIPTION / FUNCTION
0 SELVCO VCO Core VCO Select – See Table 10 for details EEPROM
1 SELINDIV0 VCO Core Input Divider Settings (Refer to Table 7)
See specific section for more detailed description and configuration setup. 		EEPROM
2 SELINDIV1 VCO Core EEPROM
3 SELINDIV2 VCO Core EEPROM
4 SELINDIV3 VCO Core EEPROM
5 SELINDIV4 VCO Core EEPROM
6 SELINDIV5 VCO Core EEPROM
7 SELINDIV6 VCO Core EEPROM
8 SELINDIV7 VCO Core EEPROM
9 SELPRESCA VCO Core PRESCALER Setting. (Refer to Table 11)
See specific section for more detailed description and configuration setup. 		EEPROM
10 SELPRESCB VCO Core EEPROM
11 SELFBDIV0 VCO Core FEEDBACK DIVIDER Setting (Refer to Table 8)
See specific section for more detailed description and configuration setup. 		EEPROM
12 SELFBDIV1 VCO Core EEPROM
13 SELFBDIV2 VCO Core EEPROM
14 SELFBDIV3 VCO Core EEPROM
15 SELFBDIV4 VCO Core EEPROM
16 SELFBDIV5 VCO Core EEPROM
17 SELFBDIV6 VCO Core EEPROM
18 SELFBDIV7 VCO Core EEPROM
19 SELBPDIV0 VCO Core BYPASS DIVIDER Setting (Refer to Table 9) See specific section for more detailed description and configuration setup. EEPROM
20 SELBPDIV1 VCO Core EEPROM
21 SELBPDIV2 VCO Core EEPROM
22 LFRCSEL0 VCO Core Loop Filter & Charge Pump Control Setting (Refer to Table 12)
See specific section for more detailed description and configuration setup. 		EEPROM
23 LFRCSEL1 VCO Core EEPROM
24 LFRCSEL2 VCO Core EEPROM
25 LFRCSEL3 VCO Core EEPROM
26 RESERVED Status TI Use Only; set 0 EEPROM
27 RESERVED Status Read Only; May read back to 1 or 0; set '1' while writing EEPROM

9.6.3 Device Registers: Register 2 Address 0x02

Table 19. CDCE62002 Register 2 Bit Definitions

REGISTER
BIT 		BIT NAME RELATED BLOCK DESCRIPTION / FUNCTION
0 RESERVED Diagnostics TI Test Registers. For TI Use Only RAM
1 RESERVED Diagnostics TI Test Registers. For TI Use Only RAM
2 RESERVED Diagnostics TI Test Registers. For TI Use Only RAM
3 RESERVED Diagnostics TI Test Registers. For TI Use Only RAM
4 RESERVED Diagnostics TI Test Registers. For TI Use Only RAM
5 RESERVED Diagnostics TI Test Registers. For TI Use Only RAM
6 PLLLOCKPIN Status Read only: Status of the PLL Lock Pin Driven by the device. PLL Lock = 1 RAM
7 PD Control Power-down mode “On” when set to 0, Off when set to “1” is normal operation (PD bit does not load the EEPROM into RAM when set to "1"). RAM
8 SYNC Control If toggled 1-0-1 this bit forces “SYNC“ resynchronize the Output Dividers. RAM
9 RESERVED Diagnostics TI Test Registers. For TI Use Only RAM
10 VERSION0 Read Only RAM
11 VERSION1 Read Only RAM
12 VERSION2 Read Only RAM
13 CALSELECT VCO Core This bit selects the VCO calibration mode. If CALSELECT = 0 , toggling PD# bit (Register 2 bit 7) will calibrate the VCO. When CALSELECT = 1, toggling the PLLRESET bit (Register 2 bit 20) will calibrate the VCO.
Default value = 0		 RAM
14 RESERVED Diagnostics TI Test Registers. For TI Use Only RAM
15 RESERVED Diagnostics TI Test Registers. For TI Use Only RAM
16 RESERVED Diagnostics TI Test Registers. For TI Use Only RAM
17 RESERVED Diagnostics TI Test Registers. For TI Use Only RAM
18 RESERVED Diagnostics TI Test Registers. For TI Use Only RAM
19 RESERVED Diagnostics TI Test Registers. For TI Use Only RAM
20 PLLRESET Diagnostics When CALSELECT=1 this bit forces a VCO calibration when toggled 1-0-1. If CALSELECT=0 this bit is ignored. RAM
21 TITSTCFG0 Diagnostics TI Test Registers. For TI Use Only RAM
22 TITSTCFG1 Diagnostics TI Test Registers. For TI Use Only RAM
23 TITSTCFG2 Diagnostics TI Test Registers. For TI Use Only RAM
24 TITSTCFG3 Diagnostics TI Test Registers. For TI Use Only RAM
25 RESERVED Diagnostics TI Test Registers. For TI Use Only RAM
26 RESERVED Diagnostics TI Test Registers. For TI Use Only RAM
27 RESERVED Diagnostics TI Test Registers. For TI Use Only RAM