SLPS427D October 2012 – September 2015 CSD17313Q2Q1
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
DIM | MILLIMETERS | INCHES | ||||
---|---|---|---|---|---|---|
MIN | NOM | MAX | MIN | NOM | MAX | |
A | 0.700 | 0.750 | 0.800 | 0.028 | 0.030 | 0.032 |
A1 | 0.000 | 0.050 | 0.000 | 0.002 | ||
b | 0.250 | 0.300 | 0.350 | 0.010 | 0.012 | 0.014 |
C | 0.203 TYP | 0.008 TYP | ||||
D | 2.000 TYP | 0.080 TYP | ||||
D1 | 0.900 | 0.950 | 1.000 | 0.036 | 0.038 | 0.040 |
D2 | 0.300 TYP | 0.012 TYP | ||||
E | 2.000 TYP | 0.080 TYP | ||||
E1 | 0.900 | 1.000 | 1.100 | 0.036 | 0.040 | 0.044 |
E2 | 0.280 TYP | 0.0112 TYP | ||||
E3 | 0.470 TYP | 0.0188 TYP | ||||
e | 0.650 BSC | 0.026 TYP | ||||
K | 0.280 TYP | 0.0112 TYP | ||||
K1 | 0.350 TYP | 0.014 TYP | ||||
K2 | 0.200 TYP | 0.008 TYP | ||||
K3 | 0.200 TYP | 0.008 TYP | ||||
K4 | 0.470 TYP | 0.0188 TYP | ||||
L | 0.200 | 0.25 | 0.300 | 0.008 | 0.010 | 0.012 |
For recommended circuit layout for PCB designs, see application note Reducing Ringing through PCB Layout Techniques, (SLPA005).
NOTES:
1. Measured from centerline of sprocket hole to centerline of pocket