SLPS427D October   2012  – September 2015 CSD17313Q2Q1

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Community Resources
    2. 6.2 Trademarks
    3. 6.3 Electrostatic Discharge Caution
    4. 6.4 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Q2 Package Dimensions
    2. 7.2 Recommended PCB Pattern
    3. 7.3 Recommended Stencil Pattern
    4. 7.4 Q2 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQK|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (March 2013) to D Revision

  • Enhanced description Go
  • Added 7-inch reel to Ordering Information table Go
  • Updated Continuous Drain Current Go
  • Updated pulsed current conditions Go
  • Updated Figure 1 to show RθJC curves Go
  • Added VGS = 4.5 V line in Figure 8 Go
  • Updated the SOA in Figure 10 Go
  • Added Device and Documentation section. Go

Changes from B Revision (January 2013) to C Revision

Changes from A Revision (November 2012) to B Revision

  • Changed the Recommended PCB PatternGo
  • Added the Recommended Stencil PatternGo

Changes from * Revision (October 2012) to A Revision

  • Changed the device number From: CSD17313Q2-Q1 To: CSD17313Q2Q1Go