SLPS667B February   2017  – June 2024 CSD17318Q2

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Specifications
    1. 4.1 Electrical Characteristics
    2. 4.2 Thermal Characteristics
    3. 4.3 Typical MOSFET Characteristics
  6. 5Device and Documentation Support
    1. 5.1 Receiving Notification of Documentation Updates
    2. 5.2 Support Resources
    3. 5.3 Trademarks
  7. 6Revision History
  8. 7Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

4.2 Thermal Characteristics

TA = 25°C (unless otherwise noted)
PARAMETERMINTYPMAXUNIT
RθJCThermal resistance junction-to-case(1)7.9°C/W
RθJAThermal resistance junction-to-ambient(1)(2)65°C/W
(1) RθJC is determined with the device mounted on a 1in2 (6.45cm2), 2oz (0.071mm) thick Cu pad on a 1.5in × 1.5in (3.81cm × 3.81cm), 0.06in (1.52mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1in2 (6.45cm2), 2oz (0.071mm) thick Cu.
CSD17318Q2
Max RθJA = 65°C/W when mounted on 1in2 (6.45cm2) of 2oz (0.071mm) thick Cu.
CSD17318Q2
Max RθJA = 250°C/W when mounted on a minimum pad area of 2oz (0.071mm) thick Cu.