SLPS411G April   2013  – January 2022 CSD17381F4

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Support Resources
    2. 6.2 Trademarks
    3. 6.3 Electrostatic Discharge Caution
    4. 6.4 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Mechanical Dimensions
    2. 7.2 Recommended Minimum PCB Layout
    3. 7.3 Recommended Stencil Pattern

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YJC|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical MOSFET Characteristics

(TA = 25°C unless otherwise stated)

GUID-3D5BD281-872B-4796-B065-F6F0E71250D1-low.gifFigure 5-1 Transient Thermal Impedance
GUID-ADA3D961-ABA1-4F4A-980F-0C14E5AFC6B0-low.pngFigure 5-2 Saturation Characteristics
GUID-E2211B5E-1DFC-4D51-9B8B-9AE0A54223BF-low.pngFigure 5-4 Gate Charge
GUID-7E8F932E-F8DE-45F8-9811-920403C8F39B-low.pngFigure 5-6 Threshold Voltage vs Temperature
GUID-49D4866A-F507-4F0F-AB78-6DF0AC564D6C-low.pngFigure 5-8 Normalized On-State Resistance vs Temperature
GUID-35FB11FB-3AF5-48E3-BF1D-5A0FF859F3B8-low.gif
Single Pulse Typical RθJA =250°C/W (min Cu)
Figure 5-10 Maximum Safe Operating Area
GUID-EF25BD85-DAD1-44CE-9FFE-B93E3794BD9C-low.pngFigure 5-12 Maximum Drain Current vs Temperature
GUID-39E168CD-7D56-4E7C-ACFC-661FA2C7CCD0-low.pngFigure 5-3 Transfer Characteristics
GUID-4A8599DE-8EB8-4F13-AE7E-031D99EF8926-low.pngFigure 5-5 Capacitance
GUID-3DE320A4-D992-4825-9C1D-FC582766AB59-low.pngFigure 5-7 On-State Resistance vs Gate-to-Source Voltage
GUID-DF509A28-0F7F-4204-879E-0B21AC611C5D-low.pngFigure 5-9 Typical Diode Forward Voltage
GUID-AE3E2596-6D61-4014-B0D9-28354C57F729-low.pngFigure 5-11 Single Pulse Unclamped Inductive Switching