SLPS296B February   2012  – September 2022 CSD25211W1015

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Electrical Characteristics
  6. 6 Thermal Characteristics
  7. 7 Typical MOSFET Characteristics
  8. 8 Mechanical Data
    1. 8.1 CSD25211W1015 Package Dimensions
    2. 8.2 Land Pattern Recommendation
  9. 9 Electrostatic Discharge Caution
  10. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YZC|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Thermal Characteristics

(TA = 25°C unless otherwise stated)
PARAMETERMINTYPMAXUNIT
R θJAThermal Resistance Junction to Ambient (Minimum Cu area)230°C/W
Thermal Resistance Junction to Ambient (1 in2 Cu area)149°C/W

GUID-3305650D-3465-4ACD-98B9-7826F89D5D5C-low.gif
Max RθJA = 149°C/W when mounted on 1 inch2 of 2 oz. Cu.
GUID-33C8E2A2-05E2-4CAE-B7D5-122AA27CFF09-low.gif
Max RθJA = 230°C/W when mounted on minimum pad area of
2 oz. Cu.