SLASFK2 December   2024 DAC121S101-SEP

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagram
    8. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 DAC Section
      2. 6.3.2 Resistor String
      3. 6.3.3 Output Amplifier
    4. 6.4 Device Functional Modes
      1. 6.4.1 Power-On Reset
      2. 6.4.2 Power-Down Modes
    5. 6.5 Programming
      1. 6.5.1 Serial Interface
      2. 6.5.2 Input Shift Register
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Bipolar Operation
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Documentation Support
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Power Supply Recommendations

A precision analog component requires careful layout, adequate bypassing, and clean, well-regulated power supplies. The power applied to the VA pin must be well regulated and low noise. Switching power supplies and DC/DC converters often have high-frequency glitches or spikes riding on the output voltage. In addition, digital components can create similar high-frequency spikes as internal logic states switch. This noise can easily couple into the DAC output voltage through various paths between the power connections and analog output. As with the ground connection, connect VA to a power supply plane or trace that is separate from the connection for digital logic until VA is connected at the power entry point.

Bypass the DAC121S101-SEP power supply with 10µF and 0.1µF capacitors, as close as possible to the device with the 0.1µF directly at the device supply pin. The 0.1µF capacitor must be a low ESL, low ESR type. Decouple the power supply of DAC121S101-SEP from noisy circuits.