SLASFK2 December   2024 DAC121S101-SEP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagram
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 DAC Section
      2. 6.3.2 Resistor String
      3. 6.3.3 Output Amplifier
    4. 6.4 Device Functional Modes
      1. 6.4.1 Power-On Reset
      2. 6.4.2 Power-Down Modes
    5. 6.5 Programming
      1. 6.5.1 Serial Interface
      2. 6.5.2 Input Shift Register
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Bipolar Operation
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VA Supply voltage, VA to GND –0.3 6.5 V
Voltage on any input pin to GND –0.3 VA + 0.3 V
Input current at any pin(2) 10 mA
Package input current(2) 20 mA
Power consumption at TA = 25°C See(3)
Soldering temperature, infrared, 10s(4) 235 °C
TJ Junction temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) When the input voltage at any pin exceeds the power supplies (that is, less than GND, or greater than VA), the current at that pin must be limited to 10mA. The 20mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10mA to two.
(3) The absolute maximum junction temperature (TJMAX) for this device is 150°C. The maximum allowable power dissipation is dictated by TJMAX, the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula PDMAX = (TJMAX − TA) / θJA. The values for maximum power dissipation will be reached only when the device is operated in a severe fault condition (for example, when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Obviously, such conditions must always be avoided.
(4) See the section entitled Surface Mount found in any post 1986 National Semiconductor Linear Data Book for methods of soldering surface mount devices.