SLASEX2A April   2021  – December 2021 DAC53004 , DAC63004

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Voltage Output
    6. 6.6  Electrical Characteristics: Current Output
    7. 6.7  Electrical Characteristics: Comparator Mode
    8. 6.8  Electrical Characteristics: General
    9. 6.9  Timing Requirements: I2C Standard Mode
    10. 6.10 Timing Requirements: I2C Fast Mode
    11. 6.11 Timing Requirements: I2C Fast Mode Plus
    12. 6.12 Timing Requirements: SPI Write Operation
    13. 6.13 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 0)
    14. 6.14 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 1)
    15. 6.15 Timing Requirements: GPIO
    16. 6.16 Timing Diagrams
    17. 6.17 Typical Characteristics: Voltage Output
    18. 6.18 Typical Characteristics: Current Output
    19. 6.19 Typical Characteristics: Comparator
    20. 6.20 Typical Characteristics: General
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Smart Digital-to-Analog Converter (DAC) Architecture
      2. 7.3.2 Digital Input/Output
      3. 7.3.3 Nonvolatile Memory (NVM)
      4. 7.3.4 Power Consumption
    4. 7.4 Device Functional Modes
      1. 7.4.1 Voltage-Output Mode
        1. 7.4.1.1 Voltage Reference and DAC Transfer Function
          1. 7.4.1.1.1 Internal Reference
          2. 7.4.1.1.2 External Reference
          3. 7.4.1.1.3 Power-Supply as Reference
      2. 7.4.2 Current-Output Mode
      3. 7.4.3 Comparator Mode
        1. 7.4.3.1 Programmable Hysteresis Comparator
        2. 7.4.3.2 Programmable Window Comparator
      4. 7.4.4 Fault-Dump Mode
      5. 7.4.5 Application-Specific Modes
        1. 7.4.5.1 Voltage Margining and Scaling
          1. 7.4.5.1.1 High-Impedance Output and PROTECT Input
          2. 7.4.5.1.2 Programmable Slew-Rate Control
          3. 7.4.5.1.3 PMBus Compatibility Mode
        2. 7.4.5.2 Function Generation
          1. 7.4.5.2.1 Triangular Waveform Generation
          2. 7.4.5.2.2 Sawtooth Waveform Generation
          3. 7.4.5.2.3 Sine Waveform Generation
      6. 7.4.6 Device Reset and Fault Management
        1. 7.4.6.1 Power-On Reset (POR)
        2. 7.4.6.2 External Reset
        3. 7.4.6.3 Register-Map Lock
        4. 7.4.6.4 NVM Cyclic Redundancy Check (CRC)
          1. 7.4.6.4.1 NVM-CRC-FAIL-USER Bit
          2. 7.4.6.4.2 NVM-CRC-FAIL-INT Bit
      7. 7.4.7 Power-Down Mode
        1. 7.4.7.1 Deep-Sleep Mode
    5. 7.5 Programming
      1. 7.5.1 SPI Programming Mode
      2. 7.5.2 I2C Programming Mode
        1. 7.5.2.1 F/S Mode Protocol
        2. 7.5.2.2 I2C Update Sequence
          1. 7.5.2.2.1 Address Byte
          2. 7.5.2.2.2 Command Byte
        3. 7.5.2.3 I2C Read Sequence
      3. 7.5.3 General-Purpose Input/Output (GPIO) Modes
    6. 7.6 Register Map
      1. 7.6.1  NOP Register (address = 00h) [reset = 0000h]
      2. 7.6.2  DAC-X-MARGIN-HIGH Register (address = 01h, 07h, 0Dh, 13h) [reset = 0000h]
      3. 7.6.3  DAC-X-MARGIN-LOW Register (address = 02h, 08h, 0Eh, 14h) [reset = 0000h]
      4. 7.6.4  DAC-X-VOUT-CMP-CONFIG Register (address = 03h, 09h, 0Fh, 15h) [reset = 0000h]
      5. 7.6.5  DAC-X-IOUT-MISC-CONFIG Register (address = 04h, 0Ah, 10h, 16h) [reset = 0000h]
      6. 7.6.6  DAC-X-CMP-MODE-CONFIG Register (address = 05h, 0Bh, 11h, 17h) [reset = 0000h]
      7. 7.6.7  DAC-X-FUNC-CONFIG Register (address = 06h, 0Ch, 12h, 18h) [reset = 0000h]
      8. 7.6.8  DAC-X-DATA Register (address = 19h, 1Ah, 1Bh, 1Ch) [reset = 0000h]
      9. 7.6.9  COMMON-CONFIG Register (address = 1Fh) [reset = 0FFFh]
      10. 7.6.10 COMMON-TRIGGER Register (address = 20h) [reset = 0000h]
      11. 7.6.11 COMMON-DAC-TRIG Register (address = 21h) [reset = 0000h]
      12. 7.6.12 GENERAL-STATUS Register (address = 22h) [reset = 00h, DEVICE-ID, VERSION-ID]
      13. 7.6.13 CMP-STATUS Register (address = 23h) [reset = 0000h]
      14. 7.6.14 GPIO-CONFIG Register (address = 24h) [reset = 0000h]
      15. 7.6.15 DEVICE-MODE-CONFIG Register (address = 25h) [reset = 0000h]
      16. 7.6.16 INTERFACE-CONFIG Register (address = 26h) [reset = 0000h]
      17. 7.6.17 SRAM-CONFIG Register (address = 2Bh) [reset = 0000h]
      18. 7.6.18 SRAM-DATA Register (address = 2Ch) [reset = 0000h]
      19. 7.6.19 DAC-X-DATA-8BIT Register (address = 40h, 41h, 42h, 43h) [reset = 0000h]
      20. 7.6.20 BRDCAST-DATA Register (address = 50h) [reset = 0000h]
      21. 7.6.21 PMBUS-PAGE Register [reset = 0300h]
      22. 7.6.22 PMBUS-OP-CMD-X Register [reset = 0000h]
      23. 7.6.23 PMBUS-CML Register [reset = 0000h]
      24. 7.6.24 PMBUS-VERSION Register [reset = 2200h]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RTE|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.18 Typical Characteristics: Current Output

at TA = 25°C, VDD = 5.5 V, output range: ±250 μA (unless otherwise noted)

 
Figure 6-31 Current Output INL vs Digital Input Code
Output range: 0 μA to –240 μA
Figure 6-33 Current Output INL vs Digital Input Code
 
Figure 6-35 Current Output INL vs Supply Voltage
Output range: 0 μA to 250 μA
Figure 6-37 Current Output DNL vs Digital Input Code
 
Figure 6-39 Current Output DNL vs Temperature
 
Figure 6-41 Current Output TUE vs Digital Input Code
Output range: 0 μA to –240 μA
Figure 6-43 Current Output TUE vs Digital Input Code
DAC channels at midscale
Figure 6-45 Current Output TUE vs Supply Voltage
 
Figure 6-47 Current Output Gain Error vs Temperature
 
Figure 6-49 Current Output Setting Time, Rising Edge
DAC at mid scale (0 μA) stored in EEPROM
Figure 6-51 Current Output Power-On Glitch
Channel 4 is victim, all other channels are aggressors
Figure 6-53 Current Output Channel-to-Channel Crosstalk
Output range: 0 μA to 250 μA
Figure 6-55 Current Output Noise Density
Output range: 0 μA to 250 μA, f = 0.1 Hz to 10 Hz
Figure 6-57 Current Output Flicker Noise
Output range: 0 μA to 250 μA
Figure 6-32 Current Output INL vs Digital Input Code
 
Figure 6-34 Current Output INL vs Temperature
 
Figure 6-36 Current Output DNL vs Digital Input Code
Output range: 0 μA to –240 μA
Figure 6-38 Current Output DNL vs Digital Input Code
 
Figure 6-40 Current Output DNL vs Supply Voltage
Output range: 0 μA to 250 μA
Figure 6-42 Current Output TUE vs Digital Input Code
DAC channels at midscale
Figure 6-44 Current Output TUE vs Temperature
 
Figure 6-46 Current Output Offset Error vs Temperature
 
Figure 6-48 Current Output vs Load Voltage
 
Figure 6-50 Current Output Setting Time, Falling Edge
DAC at mid scale (0 μA)
Figure 6-52 Current Output Power-Off Glitch
 
 
Figure 6-54 Current Output AC PSRR vs Frequency
 
Figure 6-56 Current Output Noise Density
f = 0.1 Hz to 10 Hz
Figure 6-58 Current Output Flicker Noise