SLASFB3 November   2023 DAC530A2W , DAC532A3W

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: Voltage Output
    6. 5.6  Electrical Characteristics: Current Output
    7. 5.7  Electrical Characteristics: Comparator Mode
    8. 5.8  Electrical Characteristics: General
    9. 5.9  Timing Requirements: I2C Standard Mode
    10. 5.10 Timing Requirements: I2C Fast Mode
    11. 5.11 Timing Requirements: I2C Fast-Mode Plus
    12. 5.12 Timing Requirements: SPI Write Operation
    13. 5.13 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 0)
    14. 5.14 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 1)
    15. 5.15 Timing Requirements: GPIO
    16. 5.16 Timing Diagrams
    17. 5.17 Typical Characteristics: Voltage Output
    18. 5.18 Typical Characteristics: Current Output
    19. 5.19 Typical Characteristics: Comparator
    20. 5.20 Typical Characteristics: General
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Smart Digital-to-Analog Converter (DAC) Architecture
      2. 6.3.2 Digital Input/Output
      3. 6.3.3 Nonvolatile Memory (NVM)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Voltage-Output Mode
        1. 6.4.1.1 Voltage Reference and DAC Transfer Function
          1. 6.4.1.1.1 Internal Reference
          2. 6.4.1.1.2 Power-Supply as Reference
      2. 6.4.2 Current-Output Mode
      3. 6.4.3 Comparator Mode
        1. 6.4.3.1 Programmable Hysteresis Comparator
        2. 6.4.3.2 Programmable Window Comparator
      4. 6.4.4 Fault-Dump Mode
      5. 6.4.5 Application-Specific Modes
        1. 6.4.5.1 Voltage Margining and Scaling
          1. 6.4.5.1.1 High-Impedance Output and PROTECT Input
          2. 6.4.5.1.2 Programmable Slew-Rate Control
        2. 6.4.5.2 Function Generation
          1. 6.4.5.2.1 Triangular Waveform Generation
          2. 6.4.5.2.2 Sawtooth Waveform Generation
          3. 6.4.5.2.3 Sine Waveform Generation
      6. 6.4.6 Device Reset and Fault Management
        1. 6.4.6.1 Power-On Reset (POR)
        2. 6.4.6.2 External Reset
        3. 6.4.6.3 Register-Map Lock
        4. 6.4.6.4 NVM Cyclic Redundancy Check (CRC)
          1. 6.4.6.4.1 NVM-CRC-FAIL-USER Bit
          2. 6.4.6.4.2 NVM-CRC-FAIL-INT Bit
      7. 6.4.7 General-Purpose Input/Output (GPIO) Modes
    5. 6.5 Programming
      1. 6.5.1 SPI Programming Mode
      2. 6.5.2 I2C Programming Mode
        1. 6.5.2.1 F/S Mode Protocol
        2. 6.5.2.2 I2C Update Sequence
          1. 6.5.2.2.1 Address Byte
          2. 6.5.2.2.2 Command Byte
        3. 6.5.2.3 I2C Read Sequence
  8. 7 Register Map
    1. 7.1  NOP Register (address = 00h) [reset = 0000h]
    2. 7.2  DAC-0-MARGIN-HIGH Register (address = 0Dh) [reset = 0000h]
    3. 7.3  DAC-1-MARGIN-HIGH Register (address = 13h) [reset = 0000h]
    4. 7.4  DAC-2-MARGIN-HIGH Register (address = 01h) [reset = 0000h]
    5. 7.5  DAC-0-MARGIN-LOW Register (address = 0Eh) [reset = 0000h]
    6. 7.6  DAC-1-MARGIN-LOW Register (address = 14h) [reset = 0000h]
    7. 7.7  DAC-2-MARGIN-LOW Register (address = 02h) [reset = 0000h]
    8. 7.8  DAC-0-GAIN-CONFIG Register (address = 0Fh) [reset = 0000h]
    9. 7.9  DAC-1-GAIN-CMP-CONFIG Register (address = 15h) [reset = 0000h]
    10. 7.10 DAC-2-GAIN-CONFIG Register (address = 03h) [reset = 0000h]
    11. 7.11 DAC-1-CMP-MODE-CONFIG Register (address = 17h) [reset = 0000h]
    12. 7.12 DAC-0-FUNC-CONFIG Register (address = 12h) [reset = 0000h]
    13. 7.13 DAC-1-FUNC-CONFIG Register (address = 18h) [reset = 0000h]
    14. 7.14 DAC-2-FUNC-CONFIG Register (address = 06h) [reset = 0000h]
    15. 7.15 DAC-0-DATA Register (address = 1Bh) [reset = 0000h]
    16. 7.16 DAC-1-DATA Register (address = 1Ch) [reset = 0000h]
    17. 7.17 DAC-2-DATA Register (address = 19h) [reset = 0000h]
    18. 7.18 COMMON-CONFIG Register (address = 1Fh) [reset = 0FFFh]
    19. 7.19 COMMON-TRIGGER Register (address = 20h) [reset = 0000h]
    20. 7.20 COMMON-DAC-TRIG Register (address = 21h) [reset = 0000h]
    21. 7.21 GENERAL-STATUS Register (address = 22h) [reset = 20h, DEVICE-ID, VERSION-ID]
    22. 7.22 CMP-STATUS Register (address = 23h) [reset = 000Ch]
    23. 7.23 GPIO-CONFIG Register (address = 24h) [reset = 0000h]
    24. 7.24 DEVICE-MODE-CONFIG Register (address = 25h) [reset = 0000h]
    25. 7.25 INTERFACE-CONFIG Register (address = 26h) [reset = 0000h]
    26. 7.26 SRAM-CONFIG Register (address = 2Bh) [reset = 0000h]
    27. 7.27 SRAM-DATA Register (address = 2Ch) [reset = 0000h]
    28. 7.28 BRDCAST-DATA Register (address = 50h) [reset = 0000h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBH|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.9 DAC-1-GAIN-CMP-CONFIG Register (address = 15h) [reset = 0000h]

Figure 7-9 DAC-1-GAIN-CMP-CONFIG Register
1514131211109876543210
XREF-GAIN-1XCMP-1-OD-ENCMP-1-OUT-ENCMP-1-HIZ-IN-DISCMP-1-INV-ENCMP-1-EN
X-0hR/W-0hX-0hR/W-0hR/W-0hR/W-0hR/W-0hR/W-0h
Table 7-13 DAC-1-GAIN-CMP-CONFIG Register Field Descriptions
Bit Field Type Reset Description
15-13 X X 0h Don't care
12-10 REF-GAIN-1 R/W 0h 001: Gain = 1 ×, VDD as reference.
010: Gain = 1.5 ×, internal reference.
011: Gain = 2 ×, internal reference.
100: Gain = 3 ×, internal reference.
101: Gain = 4 ×, internal reference.
Others: Invalid.
9-5 X X 0h Don't care
4 CMP-1-OD-EN R/W 0h 0: Set VOUT1 pin as push-pull.
1: Set VOUT1 pin as open-drain in comparator mode.
(CMP-1-EN = 1 and CMP-1-OUT-EN = 1).
3 CMP-1-OUT-EN R/W 0h 0: Generate comparator output but consume internally.
1: Bring comparator output to the respective VOUT1 pin.
2 CMP-1-HIZ-IN-DIS R/W 0h 0: FB1 input has high-impedance.
1: FB1 input has finite impedance as per the Electrical Characteristics: Voltage Output section.
1 CMP-1-INV-EN R/W 0h 0: Don't invert the comparator output.
1: Invert the comparator output.
0 CMP-1-EN R/W 0h 0: Disable comparator mode.
1: Enable comparator mode. DAC channel 1 must be enabled.