SLASFB3 November   2023 DAC530A2W , DAC532A3W

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: Voltage Output
    6. 5.6  Electrical Characteristics: Current Output
    7. 5.7  Electrical Characteristics: Comparator Mode
    8. 5.8  Electrical Characteristics: General
    9. 5.9  Timing Requirements: I2C Standard Mode
    10. 5.10 Timing Requirements: I2C Fast Mode
    11. 5.11 Timing Requirements: I2C Fast-Mode Plus
    12. 5.12 Timing Requirements: SPI Write Operation
    13. 5.13 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 0)
    14. 5.14 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 1)
    15. 5.15 Timing Requirements: GPIO
    16. 5.16 Timing Diagrams
    17. 5.17 Typical Characteristics: Voltage Output
    18. 5.18 Typical Characteristics: Current Output
    19. 5.19 Typical Characteristics: Comparator
    20. 5.20 Typical Characteristics: General
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Smart Digital-to-Analog Converter (DAC) Architecture
      2. 6.3.2 Digital Input/Output
      3. 6.3.3 Nonvolatile Memory (NVM)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Voltage-Output Mode
        1. 6.4.1.1 Voltage Reference and DAC Transfer Function
          1. 6.4.1.1.1 Internal Reference
          2. 6.4.1.1.2 Power-Supply as Reference
      2. 6.4.2 Current-Output Mode
      3. 6.4.3 Comparator Mode
        1. 6.4.3.1 Programmable Hysteresis Comparator
        2. 6.4.3.2 Programmable Window Comparator
      4. 6.4.4 Fault-Dump Mode
      5. 6.4.5 Application-Specific Modes
        1. 6.4.5.1 Voltage Margining and Scaling
          1. 6.4.5.1.1 High-Impedance Output and PROTECT Input
          2. 6.4.5.1.2 Programmable Slew-Rate Control
        2. 6.4.5.2 Function Generation
          1. 6.4.5.2.1 Triangular Waveform Generation
          2. 6.4.5.2.2 Sawtooth Waveform Generation
          3. 6.4.5.2.3 Sine Waveform Generation
      6. 6.4.6 Device Reset and Fault Management
        1. 6.4.6.1 Power-On Reset (POR)
        2. 6.4.6.2 External Reset
        3. 6.4.6.3 Register-Map Lock
        4. 6.4.6.4 NVM Cyclic Redundancy Check (CRC)
          1. 6.4.6.4.1 NVM-CRC-FAIL-USER Bit
          2. 6.4.6.4.2 NVM-CRC-FAIL-INT Bit
      7. 6.4.7 General-Purpose Input/Output (GPIO) Modes
    5. 6.5 Programming
      1. 6.5.1 SPI Programming Mode
      2. 6.5.2 I2C Programming Mode
        1. 6.5.2.1 F/S Mode Protocol
        2. 6.5.2.2 I2C Update Sequence
          1. 6.5.2.2.1 Address Byte
          2. 6.5.2.2.2 Command Byte
        3. 6.5.2.3 I2C Read Sequence
  8. 7 Register Map
    1. 7.1  NOP Register (address = 00h) [reset = 0000h]
    2. 7.2  DAC-0-MARGIN-HIGH Register (address = 0Dh) [reset = 0000h]
    3. 7.3  DAC-1-MARGIN-HIGH Register (address = 13h) [reset = 0000h]
    4. 7.4  DAC-2-MARGIN-HIGH Register (address = 01h) [reset = 0000h]
    5. 7.5  DAC-0-MARGIN-LOW Register (address = 0Eh) [reset = 0000h]
    6. 7.6  DAC-1-MARGIN-LOW Register (address = 14h) [reset = 0000h]
    7. 7.7  DAC-2-MARGIN-LOW Register (address = 02h) [reset = 0000h]
    8. 7.8  DAC-0-GAIN-CONFIG Register (address = 0Fh) [reset = 0000h]
    9. 7.9  DAC-1-GAIN-CMP-CONFIG Register (address = 15h) [reset = 0000h]
    10. 7.10 DAC-2-GAIN-CONFIG Register (address = 03h) [reset = 0000h]
    11. 7.11 DAC-1-CMP-MODE-CONFIG Register (address = 17h) [reset = 0000h]
    12. 7.12 DAC-0-FUNC-CONFIG Register (address = 12h) [reset = 0000h]
    13. 7.13 DAC-1-FUNC-CONFIG Register (address = 18h) [reset = 0000h]
    14. 7.14 DAC-2-FUNC-CONFIG Register (address = 06h) [reset = 0000h]
    15. 7.15 DAC-0-DATA Register (address = 1Bh) [reset = 0000h]
    16. 7.16 DAC-1-DATA Register (address = 1Ch) [reset = 0000h]
    17. 7.17 DAC-2-DATA Register (address = 19h) [reset = 0000h]
    18. 7.18 COMMON-CONFIG Register (address = 1Fh) [reset = 0FFFh]
    19. 7.19 COMMON-TRIGGER Register (address = 20h) [reset = 0000h]
    20. 7.20 COMMON-DAC-TRIG Register (address = 21h) [reset = 0000h]
    21. 7.21 GENERAL-STATUS Register (address = 22h) [reset = 20h, DEVICE-ID, VERSION-ID]
    22. 7.22 CMP-STATUS Register (address = 23h) [reset = 000Ch]
    23. 7.23 GPIO-CONFIG Register (address = 24h) [reset = 0000h]
    24. 7.24 DEVICE-MODE-CONFIG Register (address = 25h) [reset = 0000h]
    25. 7.25 INTERFACE-CONFIG Register (address = 26h) [reset = 0000h]
    26. 7.26 SRAM-CONFIG Register (address = 2Bh) [reset = 0000h]
    27. 7.27 SRAM-DATA Register (address = 2Ch) [reset = 0000h]
    28. 7.28 BRDCAST-DATA Register (address = 50h) [reset = 0000h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBH|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

GUID-20231119-SS0I-QXLQ-BDLZ-HBK2MJH1MMXF-low.svg Figure 4-1 DAC532A3W: YBH (16-pin DSBGA) Package, Top View
Table 4-1 DAC532A3W: Pin Functions
PIN TYPE DESCRIPTION
NO. NAME
A1 PVDD Power Power supply for the current source. Connect this pin to VDD with low trace impedance
A2 VOUT1 Output Voltage output on DAC channel 1.
A3 VOUT0 Output Voltage output on DAC channel 0.
A4 GPIO/SDO Input/Output General-purpose input/output configurable as LDAC, PD, PROTECT, RESET, SDO, and STATUS. For STATUS and SDO, connect the pin to the I/O voltage with an external pullup resistor. If unused, connect the GPIO/SDO pin to VDD or AGND using an external resistor. This pin can ramp up before VDD.
B1 VDD Power Supply voltage.
B2 FB1 Input Voltage feedback pin for channel 1. In voltage-output mode, connect to VOUT1 for closed-loop amplifier output. Use this pin as analog input in comparator mode.
B3 PGND Ground Ground return path for the current source. Connect this pin to AGND.
B4 SCL/SYNC Output I2C serial interface clock or SPI chip select input. This pin must be connected to the I/O voltage using an external pullup resistor. This pin can ramp up before VDD.
C1 AGND Ground Ground reference point for all circuitry on the device.
C2 PVDD Power Power supply for the current source. Connect this pin to VDD.
C3 IOUT Output Current output on channel 2.
C4 A0/SDI Input Address configuration pin for I2C or serial data input for SPI.
For A0, connect this pin to VDD, AGND, SDA, or SCL for address configuration (see the Address Byte section).
For SDI, this pin need not be pulled up or pulled down. This pin can ramp up before VDD.
D1 CAP Power External bypass capacitor for the internal LDO. Connect a capacitor (approximately 1.5 μF) between CAP and AGND.
D2 PVDD Power Power supply for the current source. Connect this pin to VDD.
D3 IOUT Output Current output on channel 2.
D4 SDA/SCLK Input/Output Bidirectional I2C serial data bus or SPI clock input. This pin must be connected to the I/O voltage using an external pullup resistor in the I2C mode. This pin can ramp up before VDD.
GUID-20231119-SS0I-CJHC-HMSQ-G0XBSH0LKWHF-low.svg Figure 4-2 DAC530A2W: YBH (16-pin DSBGA) Package, Top View
Table 4-2 DAC530A2W: Pin Functions
PIN TYPE DESCRIPTION
NO. NAME
A1 PVDD Power Power supply for the current source. Connect this pin to VDD with low trace impedance
A2 VOUT1 Output Voltage output on DAC channel 1.
A3 NC -- Solder this ball to the pad.
A4 GPIO/SDO Input/Output General-purpose input/output configurable as LDAC, PD, PROTECT, RESET, SDO, and STATUS. For STATUS and SDO, connect the pin to the I/O voltage with an external pullup resistor. If unused, connect the GPIO/SDO pin to VDD or AGND using an external resistor. This pin can ramp up before VDD.
B1 VDD Power Supply voltage.
B2 FB1 Input Voltage feedback pin for channel 1. In voltage-output mode, connect to VOUT1 for closed-loop amplifier output. Use this pin as analog input in comparator mode.
B3 PGND Ground Ground return path for the current source. Connect this pin to AGND.
B4 SCL/SYNC Output I2C serial interface clock or SPI chip select input. This pin must be connected to the I/O voltage using an external pullup resistor. This pin can ramp up before VDD.
C1 AGND Ground Ground reference point for all circuitry on the device.
C2 PVDD Power Power supply for the current source. Connect this pin to VDD.
C3 IOUT Output Current output on channel 2.
C4 A0/SDI Input Address configuration pin for I2C or serial data input for SPI.
For A0, connect this pin to VDD, AGND, SDA, or SCL for address configuration (see the Address Byte section).
For SDI, this pin need not be pulled up or pulled down. This pin can ramp up before VDD.
D1 CAP Power External bypass capacitor for the internal LDO. Connect a capacitor (approximately 1.5 μF) between CAP and AGND.
D2 PVDD Power Power supply for the current source. Connect this pin to VDD.
D3 IOUT Output Current output on channel 2.
D4 SDA/SCLK Input/Output Bidirectional I2C serial data bus or SPI clock input. This pin must be connected to the I/O voltage using an external pullup resistor in the I2C mode. This pin can ramp up before VDD.