SLASFB3 November   2023 DAC530A2W , DAC532A3W

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: Voltage Output
    6. 5.6  Electrical Characteristics: Current Output
    7. 5.7  Electrical Characteristics: Comparator Mode
    8. 5.8  Electrical Characteristics: General
    9. 5.9  Timing Requirements: I2C Standard Mode
    10. 5.10 Timing Requirements: I2C Fast Mode
    11. 5.11 Timing Requirements: I2C Fast-Mode Plus
    12. 5.12 Timing Requirements: SPI Write Operation
    13. 5.13 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 0)
    14. 5.14 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 1)
    15. 5.15 Timing Requirements: GPIO
    16. 5.16 Timing Diagrams
    17. 5.17 Typical Characteristics: Voltage Output
    18. 5.18 Typical Characteristics: Current Output
    19. 5.19 Typical Characteristics: Comparator
    20. 5.20 Typical Characteristics: General
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Smart Digital-to-Analog Converter (DAC) Architecture
      2. 6.3.2 Digital Input/Output
      3. 6.3.3 Nonvolatile Memory (NVM)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Voltage-Output Mode
        1. 6.4.1.1 Voltage Reference and DAC Transfer Function
          1. 6.4.1.1.1 Internal Reference
          2. 6.4.1.1.2 Power-Supply as Reference
      2. 6.4.2 Current-Output Mode
      3. 6.4.3 Comparator Mode
        1. 6.4.3.1 Programmable Hysteresis Comparator
        2. 6.4.3.2 Programmable Window Comparator
      4. 6.4.4 Fault-Dump Mode
      5. 6.4.5 Application-Specific Modes
        1. 6.4.5.1 Voltage Margining and Scaling
          1. 6.4.5.1.1 High-Impedance Output and PROTECT Input
          2. 6.4.5.1.2 Programmable Slew-Rate Control
        2. 6.4.5.2 Function Generation
          1. 6.4.5.2.1 Triangular Waveform Generation
          2. 6.4.5.2.2 Sawtooth Waveform Generation
          3. 6.4.5.2.3 Sine Waveform Generation
      6. 6.4.6 Device Reset and Fault Management
        1. 6.4.6.1 Power-On Reset (POR)
        2. 6.4.6.2 External Reset
        3. 6.4.6.3 Register-Map Lock
        4. 6.4.6.4 NVM Cyclic Redundancy Check (CRC)
          1. 6.4.6.4.1 NVM-CRC-FAIL-USER Bit
          2. 6.4.6.4.2 NVM-CRC-FAIL-INT Bit
      7. 6.4.7 General-Purpose Input/Output (GPIO) Modes
    5. 6.5 Programming
      1. 6.5.1 SPI Programming Mode
      2. 6.5.2 I2C Programming Mode
        1. 6.5.2.1 F/S Mode Protocol
        2. 6.5.2.2 I2C Update Sequence
          1. 6.5.2.2.1 Address Byte
          2. 6.5.2.2.2 Command Byte
        3. 6.5.2.3 I2C Read Sequence
  8. 7 Register Map
    1. 7.1  NOP Register (address = 00h) [reset = 0000h]
    2. 7.2  DAC-0-MARGIN-HIGH Register (address = 0Dh) [reset = 0000h]
    3. 7.3  DAC-1-MARGIN-HIGH Register (address = 13h) [reset = 0000h]
    4. 7.4  DAC-2-MARGIN-HIGH Register (address = 01h) [reset = 0000h]
    5. 7.5  DAC-0-MARGIN-LOW Register (address = 0Eh) [reset = 0000h]
    6. 7.6  DAC-1-MARGIN-LOW Register (address = 14h) [reset = 0000h]
    7. 7.7  DAC-2-MARGIN-LOW Register (address = 02h) [reset = 0000h]
    8. 7.8  DAC-0-GAIN-CONFIG Register (address = 0Fh) [reset = 0000h]
    9. 7.9  DAC-1-GAIN-CMP-CONFIG Register (address = 15h) [reset = 0000h]
    10. 7.10 DAC-2-GAIN-CONFIG Register (address = 03h) [reset = 0000h]
    11. 7.11 DAC-1-CMP-MODE-CONFIG Register (address = 17h) [reset = 0000h]
    12. 7.12 DAC-0-FUNC-CONFIG Register (address = 12h) [reset = 0000h]
    13. 7.13 DAC-1-FUNC-CONFIG Register (address = 18h) [reset = 0000h]
    14. 7.14 DAC-2-FUNC-CONFIG Register (address = 06h) [reset = 0000h]
    15. 7.15 DAC-0-DATA Register (address = 1Bh) [reset = 0000h]
    16. 7.16 DAC-1-DATA Register (address = 1Ch) [reset = 0000h]
    17. 7.17 DAC-2-DATA Register (address = 19h) [reset = 0000h]
    18. 7.18 COMMON-CONFIG Register (address = 1Fh) [reset = 0FFFh]
    19. 7.19 COMMON-TRIGGER Register (address = 20h) [reset = 0000h]
    20. 7.20 COMMON-DAC-TRIG Register (address = 21h) [reset = 0000h]
    21. 7.21 GENERAL-STATUS Register (address = 22h) [reset = 20h, DEVICE-ID, VERSION-ID]
    22. 7.22 CMP-STATUS Register (address = 23h) [reset = 000Ch]
    23. 7.23 GPIO-CONFIG Register (address = 24h) [reset = 0000h]
    24. 7.24 DEVICE-MODE-CONFIG Register (address = 25h) [reset = 0000h]
    25. 7.25 INTERFACE-CONFIG Register (address = 26h) [reset = 0000h]
    26. 7.26 SRAM-CONFIG Register (address = 2Bh) [reset = 0000h]
    27. 7.27 SRAM-DATA Register (address = 2Ch) [reset = 0000h]
    28. 7.28 BRDCAST-DATA Register (address = 50h) [reset = 0000h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBH|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Overview

The three-channel DAC532A3W and the dual-channel DAC530A2W (DAC53xAxW) are a 10-bit, buffered voltage-output and current-output smart DACs. The DAC channel 2 acts as a current source. The DAC channel 1 is configurable as voltage output or comparator input. The DAC outputs are changed to Hi-Z when VDD is off; a feature useful in voltage-margining applications. This smart DAC contains NVM, an internal reference, automatically detectable I2C or SPI, force-sense output, and a general-purpose input. This device supports Hi-Z power-down modes by default, which can be configured to 10 kΩ-GND or 100 kΩ-GND for voltage-output channels using the NVM. The DAC53xAxW has a power-on-reset (POR) circuit that makes sure all the registers start with default or user-programmed settings using NVM. The DAC53xAxW operates with either an internal reference or with a power supply as the reference.

The DAC53xAxW supports I2C standard mode (100kbps), fast mode (400kbps), and fast-mode plus (1Mbps). The I2C interface can be configured with four target addresses using the A0 pin. SPI mode supports a 3-wire interface by default with up to 50-MHz SCLK input. The GPIO/SDO input can be configured as SDO in the NVM for SPI read capability. The GPIO/SDO input can alternatively be configurable as LDAC, PD, STATUS, FAULT-DUMP, RESET, and PROTECT functions.

The DAC53xAxW also include digital slew rate control, and supports standard waveform generation such as sine, cosine, triangular, and sawtooth waveforms. These devices can generate pulse-width modulation (PWM) output with the combination of the triangular or sawtooth waveform and the FB1 pin. The force-sense outputs of channel 1 can be used as a programmable comparator. The comparator mode allows programmable hysteresis, latching comparator, window comparator, and fault-dump to the NVM. These features enable the DAC53xAxW to go beyond the limitations of a conventional DAC that depends on a processor to function. As a result of processor-less operation and the smart feature set, the DAC53xAxW is called a smart DAC.