SLASFB3 November   2023 DAC530A2W , DAC532A3W

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: Voltage Output
    6. 5.6  Electrical Characteristics: Current Output
    7. 5.7  Electrical Characteristics: Comparator Mode
    8. 5.8  Electrical Characteristics: General
    9. 5.9  Timing Requirements: I2C Standard Mode
    10. 5.10 Timing Requirements: I2C Fast Mode
    11. 5.11 Timing Requirements: I2C Fast-Mode Plus
    12. 5.12 Timing Requirements: SPI Write Operation
    13. 5.13 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 0)
    14. 5.14 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 1)
    15. 5.15 Timing Requirements: GPIO
    16. 5.16 Timing Diagrams
    17. 5.17 Typical Characteristics: Voltage Output
    18. 5.18 Typical Characteristics: Current Output
    19. 5.19 Typical Characteristics: Comparator
    20. 5.20 Typical Characteristics: General
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Smart Digital-to-Analog Converter (DAC) Architecture
      2. 6.3.2 Digital Input/Output
      3. 6.3.3 Nonvolatile Memory (NVM)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Voltage-Output Mode
        1. 6.4.1.1 Voltage Reference and DAC Transfer Function
          1. 6.4.1.1.1 Internal Reference
          2. 6.4.1.1.2 Power-Supply as Reference
      2. 6.4.2 Current-Output Mode
      3. 6.4.3 Comparator Mode
        1. 6.4.3.1 Programmable Hysteresis Comparator
        2. 6.4.3.2 Programmable Window Comparator
      4. 6.4.4 Fault-Dump Mode
      5. 6.4.5 Application-Specific Modes
        1. 6.4.5.1 Voltage Margining and Scaling
          1. 6.4.5.1.1 High-Impedance Output and PROTECT Input
          2. 6.4.5.1.2 Programmable Slew-Rate Control
        2. 6.4.5.2 Function Generation
          1. 6.4.5.2.1 Triangular Waveform Generation
          2. 6.4.5.2.2 Sawtooth Waveform Generation
          3. 6.4.5.2.3 Sine Waveform Generation
      6. 6.4.6 Device Reset and Fault Management
        1. 6.4.6.1 Power-On Reset (POR)
        2. 6.4.6.2 External Reset
        3. 6.4.6.3 Register-Map Lock
        4. 6.4.6.4 NVM Cyclic Redundancy Check (CRC)
          1. 6.4.6.4.1 NVM-CRC-FAIL-USER Bit
          2. 6.4.6.4.2 NVM-CRC-FAIL-INT Bit
      7. 6.4.7 General-Purpose Input/Output (GPIO) Modes
    5. 6.5 Programming
      1. 6.5.1 SPI Programming Mode
      2. 6.5.2 I2C Programming Mode
        1. 6.5.2.1 F/S Mode Protocol
        2. 6.5.2.2 I2C Update Sequence
          1. 6.5.2.2.1 Address Byte
          2. 6.5.2.2.2 Command Byte
        3. 6.5.2.3 I2C Read Sequence
  8. 7 Register Map
    1. 7.1  NOP Register (address = 00h) [reset = 0000h]
    2. 7.2  DAC-0-MARGIN-HIGH Register (address = 0Dh) [reset = 0000h]
    3. 7.3  DAC-1-MARGIN-HIGH Register (address = 13h) [reset = 0000h]
    4. 7.4  DAC-2-MARGIN-HIGH Register (address = 01h) [reset = 0000h]
    5. 7.5  DAC-0-MARGIN-LOW Register (address = 0Eh) [reset = 0000h]
    6. 7.6  DAC-1-MARGIN-LOW Register (address = 14h) [reset = 0000h]
    7. 7.7  DAC-2-MARGIN-LOW Register (address = 02h) [reset = 0000h]
    8. 7.8  DAC-0-GAIN-CONFIG Register (address = 0Fh) [reset = 0000h]
    9. 7.9  DAC-1-GAIN-CMP-CONFIG Register (address = 15h) [reset = 0000h]
    10. 7.10 DAC-2-GAIN-CONFIG Register (address = 03h) [reset = 0000h]
    11. 7.11 DAC-1-CMP-MODE-CONFIG Register (address = 17h) [reset = 0000h]
    12. 7.12 DAC-0-FUNC-CONFIG Register (address = 12h) [reset = 0000h]
    13. 7.13 DAC-1-FUNC-CONFIG Register (address = 18h) [reset = 0000h]
    14. 7.14 DAC-2-FUNC-CONFIG Register (address = 06h) [reset = 0000h]
    15. 7.15 DAC-0-DATA Register (address = 1Bh) [reset = 0000h]
    16. 7.16 DAC-1-DATA Register (address = 1Ch) [reset = 0000h]
    17. 7.17 DAC-2-DATA Register (address = 19h) [reset = 0000h]
    18. 7.18 COMMON-CONFIG Register (address = 1Fh) [reset = 0FFFh]
    19. 7.19 COMMON-TRIGGER Register (address = 20h) [reset = 0000h]
    20. 7.20 COMMON-DAC-TRIG Register (address = 21h) [reset = 0000h]
    21. 7.21 GENERAL-STATUS Register (address = 22h) [reset = 20h, DEVICE-ID, VERSION-ID]
    22. 7.22 CMP-STATUS Register (address = 23h) [reset = 000Ch]
    23. 7.23 GPIO-CONFIG Register (address = 24h) [reset = 0000h]
    24. 7.24 DEVICE-MODE-CONFIG Register (address = 25h) [reset = 0000h]
    25. 7.25 INTERFACE-CONFIG Register (address = 26h) [reset = 0000h]
    26. 7.26 SRAM-CONFIG Register (address = 2Bh) [reset = 0000h]
    27. 7.27 SRAM-DATA Register (address = 2Ch) [reset = 0000h]
    28. 7.28 BRDCAST-DATA Register (address = 50h) [reset = 0000h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBH|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.7 Electrical Characteristics: Comparator Mode

all minimum and maximum specifications at –40°C ≤ TA ≤ +125°C and typical specifications at TA = 25°C,
3 V ≤ VDD ≤ 5.5 V, VDD reference, gain = 1 ×, voltage-output DAC output pin (VOUTx) loaded with resistive load (RL = 5 kΩ to AGND) and capacitive load (CL = 200 pF to AGND), and digital inputs at VDD or AGND (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
STATIC PERFORMANCE
Offset error(1) (2) 3 V ≤ VDD ≤ 5.5 V; DAC at midscale, comparator input at Hi-Z –6 0 6 mV
Offset error time drift(1) VDD = 5.5 V, TA = 125°C, FB1 in Hi-Z mode, DAC at full scale and VFB at 0 V or DAC at zero scale and VF1B at 1.84 V, drift specified for 10 years of continuous operation 4 mV
OUTPUT
Input voltage VFB1 resistor network connected to ground 0 VDD V
VFB1 resistor network disconnected from ground 0 VDD × (1/3 – 1/100)
VOL Logic low output voltage ILOAD = 100 μA, output in open-drain mode 0.1 V
DYNAMIC PERFORMANCE
tresp Output response time DAC at midscale with 10-bit resolution, FB1 input at Hi-Z, and transition step at FB1 node is (VDAC – 2 LSB) to (VDAC + 2 LSB), transition time measured between 10% and 90% of output, output current of 100 µA, comparator output configured in push-pull mode, load capacitor at DAC output is 25 pF 10 µs
(1) Specified by design and characterization, not production tested.
(2) This specification does not include the total unadjusted error (TUE) of the DAC.