SLASEW8A October   2020  – September 2023 DAC43701-Q1 , DAC53701-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: I2C Standard Mode
    7. 6.7  Timing Requirements: I2C Fast Mode
    8. 6.8  Timing Requirements: I2C Fast-Mode Plus
    9. 6.9  Timing Requirements: GPI
    10. 6.10 Timing Diagram
    11. 6.11 Typical Characteristics: VDD = 5.5 V (Reference = VDD) or VDD = 5 V (Internal Reference)
    12. 6.12 Typical Characteristics: VDD = 1.8 V (Reference = VDD) or VDD = 2 V (Internal Reference)
    13. 6.13 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital-to-Analog Converter (DAC) Architecture
        1. 7.3.1.1 Reference Selection and DAC Transfer Function
          1. 7.3.1.1.1 Power Supply as Reference
          2. 7.3.1.1.2 Internal Reference
      2. 7.3.2 General-Purpose Input (GPI)
      3. 7.3.3 DAC Update
        1. 7.3.3.1 DAC Update Busy
      4. 7.3.4 Nonvolatile Memory (EEPROM or NVM)
        1. 7.3.4.1 NVM Cyclic Redundancy Check
        2. 7.3.4.2 NVM_CRC_ALARM_USER Bit
        3. 7.3.4.3 NVM_CRC_ALARM_INTERNAL Bit
      5. 7.3.5 Programmable Slew Rate
      6. 7.3.6 Power-On Reset (POR)
      7. 7.3.7 Software Reset
      8. 7.3.8 Device Lock Feature
      9. 7.3.9 PMBus Compatibility
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Down Mode
      2. 7.4.2 Continuous Waveform Generation (CWG) Mode
      3. 7.4.3 PMBus Compatibility Mode
    5. 7.5 Programming
      1. 7.5.1 F/S Mode Protocol
      2. 7.5.2 I2C Update Sequence
        1. 7.5.2.1 Address Byte
          1. 7.5.2.1.1 Target Address Configuration
        2. 7.5.2.2 Command Byte
      3. 7.5.3 I2C Read Sequence
    6. 7.6 Register Map
      1. 7.6.1  STATUS Register (address = D0h) [reset = 000Ch or 0014h]
      2. 7.6.2  GENERAL_CONFIG Register (address = D1h) [reset = 01F0h]
      3. 7.6.3  CONFIG2 Register (address = D2h) [reset = device-specific]
      4. 7.6.4  TRIGGER Register (address = D3h) [reset = 0008h]
      5. 7.6.5  DAC_DATA Register (address = 21h) [reset = 0000h]
      6. 7.6.6  DAC_MARGIN_HIGH Register (address = 25h) [reset = device-specific]
      7. 7.6.7  DAC_MARGIN_LOW Register (address = 26h) [reset =device-specific]
      8. 7.6.8  PMBUS_OPERATION Register (address = 01h) [reset = 0000h]
      9. 7.6.9  PMBUS_STATUS_BYTE Register (address = 78h) [reset = 0000h]
      10. 7.6.10 PMBUS_VERSION Register (address = 98h) [reset = 2200h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Power-Supply Margining
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 LED Thermal Foldback
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.2 General-Purpose Input (GPI)

The GPI pin of DACx3701-Q1 enables processorless operation. Table 7-1 shows that the GPI pin can be configured to trigger various functions. The GPI_EN bit in the TRIGGER (Section 7.6.4) register enables or disables the GPI input. The GPI_CONFIG field in the CONFIG2 (Section 7.6.3) register maps the GPI pin to various functions. The GPI operations are edge-triggered after the device boots up. After the power supply ramps up, the device registers the GPI level and executes the associated command. Use this feature configure the initial output state at power on. By default, the GPI pin is not mapped to any operation. Pull the GPI pin to high or low when not used. When the GPI pin is mapped to a specific function, the corresponding software bit functionality is disabled to avoid a race condition. When the GPI is mapped to margin-high or low trigger function, the output changes dynamically, unlike the behavior with I2C-based programming. All other constraints of the functions are applied to the GPI-based trigger.

Table 7-1 GPI Configuration
REGISTER NAME GPI_EN GPI_CONFIG PIN FUNCTION PIN EDGE COMMAND
D2h, CONFIG2 and
D3h, TRIGGER		 0 X None X No Operation (Default)
1 000 Power-Up, Down (Hi-Z) Rising Power-Up
Falling Hi-Z Power-Down
1 001 Power-Up, Down (10-kΩ) Rising Power-Up
Falling 10-kΩ Power-Down
1 010 Margin-High, Low Rising Margin High Trigger
Falling Margin Low Trigger
1 011 Function Generation Rising Start Function Generation
Falling Stop Function Generation
1 100 High-Priority Medical Alarm Rising Start High-Priority Medical Alarm
Falling Stop High-Priority Medical Alarm
1 101 Medium-Priority Medical Alarm Rising Start Medium-Priority Medical Alarm
Falling Stop Medium-Priority Medical Alarm
1 110 Low-Priority Medical Alarm Rising Start Low-Priority Medical Alarm
Falling Stop Low-Priority Medical Alarm
1 111 I2C Target Address Rising Enable I2C Target Address Update
Falling Disable I2C Target Address Update