SGLS387H July   2007  – August 2016 DAC5675A-SP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 DC Electrical Characteristics (Unchanged After 100 kRad)
    6. 7.6 AC Electrical Characteristics (Unchanged After 100 kRad)
    7. 7.7 Digital Specifications (Unchanged After 100 kRad)
    8. 7.8 Electrical Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Digital Inputs
      2. 8.3.2 Clock Input
      3. 8.3.3 Supply Inputs
      4. 8.3.4 DAC Transfer Function
      5. 8.3.5 Reference Operation
      6. 8.3.6 Analog Current Outputs
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Definitions of Specifications and Terminology
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • HFG|52
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage AVDD(2) –0.3 3.6 V
DVDD(3) –0.3 3.6 V
AVDD to DVDD –0.7 0.7 V
Voltage between AGND and DGND –0.3 0.5 V
CLK, CLKC(2) –0.3 AVDD + 0.3 V
Digital input D[13:0]A, D[13:0]B(3), SLEEP, DLLOFF –0.3 DVDD + 0.3 V
IOUT1, IOUT2(2) –1 AVDD + 0.3 V
EXTIO, BIASJ(2) –1 AVDD + 0.3 V
Peak input current (any input) 20 mA
Peak total input current (all inputs) –30 mA
Lead temperature 1.6 mm (1/16 inch) from the case for 10 s 260 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Measured with respect to AGND
(3) Measured with respect to DGND

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±4000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)
MIN NOM MAX UNIT
AVDD Analog supply voltage 3.15 3.3 3.6 V
DVDD Digital supply voltage 3.15 3.3 3.6 V
TJ Operating junction temperature 5962-0720401 –55 125 °C
5962-0720402 –55 115

7.4 Thermal Information

THERMAL METRIC(1) DAC5675A-SP UNIT
HFG (CQFP)
52 PINS
RθJA Junction-to-free-air thermal resistance(2) 21.813 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance(3) 0.849 °C/W
RθJB Junction-to-board thermal resistance N/A
ψJT Junction-to-top characterization parameter N/A
ψJB Junction-to-board characterization parameter N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) Board mounted, per JESD 51-5 methodology
(3) MIL-STD-883 test method 1012

7.5 DC Electrical Characteristics (Unchanged After 100 kRad)

over operating junction temperature range, typical values at 25°C, AVDD = 3.3 V, DVDD = 3.3 V, IO(FS) = 20 mA (unless otherwise noted)
PARAMETER TEST CONDITIONS 5962-0720401 5962-0720402 UNIT
MIN TYP MAX MIN TYP MAX
Resolution 14 14 bit
DC ACCURACY(1)
INL Integral nonlinearity TMIN to TMAX –4 ±1.5 4.6 –4 ±1.5 4.6 LSB
DNL Differential nonlinearity T25°C to TMAX –2 ±0.6 2.2 –2 ±0.6 2.2 LSB
TMIN –2 ±0.6 2.5 –2 ±0.6 2.5 LSB
Monotonicity Monotonic 12b level Monotonic 12b level
ANALOG OUTPUT
IO(FS) Full-scale output current 2 20 2 20 mA
Output compliance range AVDD = 3.15 to 3.45 V,
IO(FS) = 20 mA		 AVDD – 1 AVDD + 0.3 AVDD – 1 AVDD + 0.3 V
Offset error 0.01 0.01 %FSR
Gain error Without internal reference –10 5 10 –10 5 10 %FSR
With internal reference –10 2.5 10 –10 2.5 10 %FSR
Output resistance 300 300 kΩ
Output capacitance 5 5 pF
REFERENCE OUTPUT
V(EXTIO) Reference voltage 1.17 1.23 1.3 1.17 1.23 1.3 V
Reference output current(2) 100 100 nA
REFERENCE INPUT
V(EXTIO) Input reference voltage 0.6 1.2 1.25 0.6 1.2 1.25 V
Input resistance 1 1 MΩ
Small-signal bandwidth 1.4 1.4 MHz
Input capacitance 100 100 pF
TEMPERATURE COEFFICIENTS
Offset drift 12 12 ppm of FSR/°C
ΔV(EXTIO) Reference voltage drift ±50 ±50 ppm/°C
POWER SUPPLY
AVDD Analog supply voltage 3.15 3.3 3.6 3.15 3.3 3.6 V
DVDD Digital supply voltage 3.15 3.3 3.6 3.15 3.3 3.6 V
I(AVDD) Analog supply current(3) 115 148 115 138 mA
I(DVDD) Digital supply current(3) 85 130 85 120 mA
PD Power dissipation Sleep mode 18 18 mW
AVDD = 3.3 V, DVDD = 3.3 V 660 900 660 850 mW
APSRR Analog and digital power-supply rejection ratio AVDD = 3.15 to 3.45 V –0.9 ±0.1 0.9 –0.9 ±0.1 0.9 %FSR/V
DPSRR –0.9 ±0.1 0.9 –0.9 ±0.1 0.9
(1) Measured differential at IOUT1 and IOUT2: 25 Ω to AVDD.
(2) Use an external buffer amplifier with high impedance input to drive any external load.
(3) Measured at ƒCLK = 400 MSPS and ƒOUT = 70 MHz.

7.6 AC Electrical Characteristics (Unchanged After 100 kRad)

over operating junction temperature range, typical values at 25°C, AVDD = 3.3 V, DVDD = 3.3 V, IO(FS) = 20 mA, differential transformer-coupled output, 50-Ω doubly-terminated load (unless otherwise noted)
PARAMETER TEST CONDITIONS 5962-0720401 5962-0720402 UNIT
MIN TYP MAX MIN TYP MAX
ANALOG OUTPUT
ƒCLK Output update rate 400 400 MSPS
ts(DAC) Output setting time to 0.1% Transition: code x2000 to x23FF 12 12 ns
tPD Output propagation delay 1 1 ns
tr(IOUT) Output rise time, 10% to 90% 300 300 ps
tf(IOUT) Output fall time, 90% to 10% 300 300 ps
Output noise IOUTFS = 20 mA 55 55 pA/√Hz
IOUTFS = 2 mA 30 30
AC LINEARITY
THD Total harmonic distortion ƒCLK = 100 MSPS, ƒOUT = 19.9 MHz 70 70 dBc
ƒCLK = 160 MSPS, ƒOUT = 41 MHz 72 72
ƒCLK = 200 MSPS, ƒOUT = 70 MHz 68 68
ƒCLK =
400 MSPS		 ƒOUT = 20 MHz 60 68 62 68
ƒOUT = 20 MHz, for TMIN 57 57
ƒOUT = 70 MHz 67 67
ƒOUT = 140 MHz 55 55
SFDR Spurious-free dynamic range to Nyquist ƒCLK = 100 MSPS, ƒOUT = 19.9 MHz 70 70 dBc
ƒCLK = 160 MSPS, ƒOUT = 41 MHz 73 73
ƒCLK = 200 MSPS, ƒOUT = 70 MHz 70 70
ƒCLK =
400 MSPS		 ƒOUT = 20 MHz 62 68 63 68
ƒOUT = 20 MHz, for TMIN 61 61
ƒOUT = 70 MHz 69 69
ƒOUT = 140 MHz 56 56
SFDR Spurious-free dynamic range within a window, 5 MHz span ƒCLK = 100 MSPS, ƒOUT = 19.9 MHz 82 82 dBc
ƒCLK = 160 MSPS, ƒOUT = 41 MHz 77 77
ƒCLK = 200 MSPS, ƒOUT = 70 MHz 82 82
ƒCLK =
400 MSPS		 ƒOUT = 20 MHz 82 82
ƒOUT = 70 MHz 82 82
ƒOUT = 140 MHz 75 75
SNR Signal-to-noise ratio ƒCLK = 400 MSPS, ƒOUT = 20 MHz 60 67 60 67 dBc
ACPR Adjacent channel power ratio WCDM A with 3.84 MHz BW, 5 MHz channel spacing ƒCLK = 122.88 MSPS, IF = 30.72 MHz, see Figure 9 73 73 dB
ƒCLK = 245.76 MSPS, IF = 61.44 MHz, 71 71
ƒCLK = 399.36 MSPS, IF = 153.36 MHz, see Figure 11 65 65
IMD Two-tone intermodulation
to Nyquist (each tone at
–6 dBfs)		 ƒCLK = 400 MSPS, ƒOUT1 = 70 MHz, ƒOUT2 = 71 MHz 73 73 dBc
ƒCLK = 400 MSPS, ƒOUT1 = 140 MHz, ƒOUT2 = 141 MHz 62 62
Four-tone intermodulation, 15-MHz span, missing center tone (each tone at –16 dBfs) ƒCLK = 156 MSPS, ƒOUT = 15.6, 15.8, 16.2, 16.4 MHz 82 82
ƒCLK = 400 MSPS, ƒOUT = 68.1, 69.3, 71.2, 72 MHz 74 74

7.7 Digital Specifications (Unchanged After 100 kRad)

over operating junction temperature range, typical values at 25°C, AVDD = 3.3 V, DVDD = 3.3 V (unless otherwise noted)
PARAMETER TEST CONDITIONS 5962-0720401 5962-0720402 UNIT
MIN TYP MAX MIN TYP MAX
LVDS INTERFACE: NODES D[13:0]A, D[13:0]B
VITH+ Positive-going differential input voltage threshold 100 100 mV
VITH– Negative-going differential input voltage threshold –100 –100 mV
ZT Internal termination impedance 90 110 132 90 110 132 Ω
CI Input capacitance 2 2 pF
CMOS INTERFACE (SLEEP)
VIH High-level input voltage 2 3.3 2 3.3 V
VIL Low-level input voltage 0 0.8 0 0.8 V
IIH High-level input current 10 100 10 100 μA
IIL Low-level input current –10 10 –10 10 μA
Input capacitance 2 2 pF
CLOCK INTERFACE (CLK, CLKC)
|CLK-CLKC| Clock differential input voltage 0.4 0.8 0.4 0.8 VPP
tw(H) Clock pulse width high 1.25 1.25 ns
tw(L) Clock pulse width low 1.25 1.25 ns
Clock duty cycle 40% 60% 40% 60%
VCM Common-mode voltage range 1.6 2 2.4 1.6 2 2.4 V
Input resistance Node CLK, CLKC 670 670 Ω
Input capacitance Node CLK, CLKC 2 2 pF
Input resistance Differential 1.3 1.3 kΩ
Input capacitance Differential 1 1 pF
TIMING
tSU Input setup time 1.5 1.5 ns
tH Input hold time 0 0 ns
tDD Digital delay time (DAC latency) 3 3 clk
DAC5675A-SP td01b_gls387.gif Figure 1. Timing Diagram

7.8 Electrical Characteristics(1)

over operating junction temperature range, AVDD = 3.3 V, DVDD = 3.3 V, IO(FS) = 20 mA (unless otherwise noted)
APPLIED VOLTAGES RESULTING DIFFERENTIAL INPUT VOLTAGE RESULTING COMMON-MODE INPUT VOLTAGE LOGICAL BIT BINARY EQUIVALENT COMMENT
VA (V) VB (V) VA,B (mV) VCOM (V)
1.25 1.15 100 1.2 1 Operation with minimum differential voltage
(±100 mV) applied to the complementary inputs versus common-mode range
1.15 1.25 –100 1.2 0
2.4 2.3 100 2.35 1
2.3 2.4 –100 2.35 0
0.1 0 100 0.05 1
0 0.1 –100 0.05 0
1.5 0.9 600 1.2 1 Operation with maximum differential voltage
(±600 mV) applied to the complementary inputs versus common-mode range
0.9 1.5 –600 1.2 0
2.4 1.8 600 2.1 1
1.8 2.4 –600 2.1 0
0.6 0 600 0.3 1
0 0.6 –600 0.3 0
(1) Specifications subject to change.
DAC5675A-SP td2b_gls387.gif Figure 2. LVDS Timing Test Circuit and Input Test Levels

7.9 Typical Characteristics

DAC5675A-SP tc_dnl-inptb_gls387.gif
Figure 3. Differential Nonlinearity (DNL) vs Input Code
DAC5675A-SP tc_pwr-fqc1b_gls387.gif
Figure 5. Two-Tone IMD (Power) vs Frequency
DAC5675A-SP tc_pwr_fqc2b_gls387.gif
Figure 7. Single-Tone Spectrum Power vs Frequency
DAC5675A-SP tc_pwr-fqc3b_gls387.gif
Figure 9. W-CDMA TM1 Single Carrier Power vs Frequency
DAC5675A-SP tc_aclr_fob_gls387.gif
Figure 11. W-CDMA TM1 Single Carrier ACLR vs Output Frequency
DAC5675A-SP tc_inl-inptb_gls387.gif
Figure 4. Integral Nonlinearity (INL) vs Input Code
DAC5675A-SP tc_2imd-fib_gls387.gif
Figure 6. Two-Tone IMD3 vs Frequency
DAC5675A-SP tc6_sfdr_fo2b_gls387.gif
Figure 8. Spurious-Free Dynamic Range vs Frequency
DAC5675A-SP tc_pwr-fqc4b_gls387.gif
Figure 10. W-CDMA TM1 Dual Carrier Power vs Frequency