The DAC5675A-SP is a radiation-tolerant, 14-bit resolution high-speed digital-to-analog
converter (DAC) primarily suited for space satellite applications. The DAC5675A-SP is designed for
high-speed digital data transmission in wired and wireless communication systems, high-frequency
direct digital synthesis (DDS), and waveform reconstruction in test and measurement applications.
The DAC5675A-SP has excellent SFDR at high intermediate frequencies, which makes it well suited for
multicarrier transmission in TDMA and CDMA based cellular base transceiver stations (BTSs).
The DAC5675A-SP operates from a single supply voltage of 3.3 V. Power dissipation is 660
mW at ƒCLK = 400 MSPS, ƒOUT = 70 MHz. The DAC5675A-SP
provides a nominal full-scale differential current output of 20 mA, supporting both single-ended
and differential applications. The output current can be directly fed to the load with no
additional external output buffer required. The output is referred to the analog supply voltage
AVDD.
The DAC5675A-SP includes a low-voltage differential signaling (LVDS) interface for
high-speed digital data input. LVDS features a low differential voltage swing with a low constant
power consumption across frequency, allowing for high-speed data transmission with low noise levels
(low electromagnetic interference (EMI)).
LVDS is typically implemented in low-voltage digital CMOS processes, making it the ideal
technology for high-speed interfacing between the DAC5675A-SP and high-speed low-voltage CMOS ASICs
or FPGAs.
The DAC5675A-SP current-source-array architecture supports update rates of up to 400
MSPS. On-chip edge-triggered input latches provide for minimum setup and hold times, thereby
relaxing interface timing.
The DAC5675A-SP is specifically designed for a differential transformer-coupled output
with a 50-Ω doubly-terminated load. With the 20-mA full-scale output current, both a 4:1 impedance
ratio (resulting in an output power of 4 dBm) and 1:1 impedance ratio transformer (–2 dBm) is
supported. The last configuration is preferred for optimum performance at high output frequencies
and update rates. The outputs are terminated to AVDD and have voltage compliance ranges from
AVDD – 1 to AVDD + 0.3 V.
An accurate on-chip 1.2-V temperature-compensated bandgap reference and control amplifier
allows the user to adjust this output current from 20 to 2 mA. This provides 20-dB gain range
control capabilities. Alternatively, an external reference voltage may be applied. The DAC5675A-SP
features a SLEEP mode, which reduces the standby power to approximately 18 mW.
The DAC5675A-SP is available in a 52-pin ceramic nonconductive tie-bar package (HFG). The
device is specified for operation over the military temperature range of –55°C to 125°C and W
temperature range of –55°C to 115°C.
The DAC5675A-SP is a radiation-tolerant, 14-bit resolution high-speed digital-to-analog
converter (DAC) primarily suited for space satellite applications. The DAC5675A-SP is designed for
high-speed digital data transmission in wired and wireless communication systems, high-frequency
direct digital synthesis (DDS), and waveform reconstruction in test and measurement applications.
The DAC5675A-SP has excellent SFDR at high intermediate frequencies, which makes it well suited for
multicarrier transmission in TDMA and CDMA based cellular base transceiver stations (BTSs).
The DAC5675A-SP operates from a single supply voltage of 3.3 V. Power dissipation is 660
mW at ƒCLK = 400 MSPS, ƒOUT = 70 MHz. The DAC5675A-SP
provides a nominal full-scale differential current output of 20 mA, supporting both single-ended
and differential applications. The output current can be directly fed to the load with no
additional external output buffer required. The output is referred to the analog supply voltage
AVDD.
The DAC5675A-SP includes a low-voltage differential signaling (LVDS) interface for
high-speed digital data input. LVDS features a low differential voltage swing with a low constant
power consumption across frequency, allowing for high-speed data transmission with low noise levels
(low electromagnetic interference (EMI)).
LVDS is typically implemented in low-voltage digital CMOS processes, making it the ideal
technology for high-speed interfacing between the DAC5675A-SP and high-speed low-voltage CMOS ASICs
or FPGAs.
The DAC5675A-SP current-source-array architecture supports update rates of up to 400
MSPS. On-chip edge-triggered input latches provide for minimum setup and hold times, thereby
relaxing interface timing.
The DAC5675A-SP is specifically designed for a differential transformer-coupled output
with a 50-Ω doubly-terminated load. With the 20-mA full-scale output current, both a 4:1 impedance
ratio (resulting in an output power of 4 dBm) and 1:1 impedance ratio transformer (–2 dBm) is
supported. The last configuration is preferred for optimum performance at high output frequencies
and update rates. The outputs are terminated to AVDD and have voltage compliance ranges from
AVDD – 1 to AVDD + 0.3 V.
An accurate on-chip 1.2-V temperature-compensated bandgap reference and control amplifier
allows the user to adjust this output current from 20 to 2 mA. This provides 20-dB gain range
control capabilities. Alternatively, an external reference voltage may be applied. The DAC5675A-SP
features a SLEEP mode, which reduces the standby power to approximately 18 mW.
The DAC5675A-SP is available in a 52-pin ceramic nonconductive tie-bar package (HFG). The
device is specified for operation over the military temperature range of –55°C to 125°C and W
temperature range of –55°C to 115°C.