100% burn-in eliminated (all TTL, LS, STTL products line. All package configurations.)

Level B/Q only

Constant acceleration eliminated (all products in the 8, 14, 16, 20, pin DIP)

Level B/Q only

100% high magnification inspection eliminated (TTL, LS, STTL, ALS HCMOS, F, AS, and 55 series products lines. All packages configurations)

Level B/Q only

100% burn-in on certain linear product eliminated (contact TI or DLA Land and Maritime for specific linear products)

Level B/Q only

Final electrical, 25°C (ALS, AS, FAST, 54ABT32316 parent device types eliminated)

Level B/Q only

100% burn-in (HCMOS, all packages) eliminated

Level B/Q only

100% burn-in (ALS, AS, FAST) eliminated

Level B/Q only

100% temperature cycle (all CPAK) eliminated

Level B/Q only

100% constant acceleration (all CPAK) eliminated

Level B/Q only

100% -55°C screening and group A (HC and HCT) eliminated

Level B/Q only

100% -55°C screening (ABT, AC, ACT, BCT) eliminated

Level B/Q only

Burn-in reduction on 4 Meg DRAM

Level B/Q only

Class V, P, Y

Eliminated read and record data

Class V

X-ray (monitor only, for glass-frit seal)

Class V

Eliminated Non-Destructive Bond Pull

Class V

Eliminated PIND and Centrifuge on all flip chip mounted die

100% burn-in (selected DSP/MCU) eliminated

Level B/Q only

100% -55°C screening (selected DSP/MCU) eliminated

Level B/Q only

100% X-ray eliminated on welded lid parts

QCI Group B Subgroup 1 Class V

Physical Dimensions and Internal Water Vapor Performed as part of Generic Group D QCI by package family within 36 week window

QCI Group B Subgroup 2 Class V

Resistance to Solvents, Bond Strength and Die shear are done as part of Generic group B QCI by package family by week of seal. Main body 38535 group B.

Internal visual and mechanical is covered by 100% pre-cap inspection.

QCI Group B Subgroup 3 Class V

Solder-ability performed as part of Generic Group B QCI by package family per week of seal.

QCI Group B Subgroup 4 Class V

Lead Integrity, Seal are performed as part of generic group D CQI by package family within 36-week window.

Lid torque testing eliminated for all package families

QCI Group B Subgroup 5 Class V

End point electrical, Steady State Life and End point electrical performed as part of Wafer Lot acceptance by wafer lot

QCI Group B Subgroup 6 Class V

End-point electrical, temp cycle, constant acceleration, seal and endpoint electrical parameters performed as part of generic Group D QCI by package family within 36 week window

DS16F95

DS26F31 and 32

DS96F172 through 175

Level S/V only

Minimum percentage of the metallization cross sectional area required over the passivation steps in Method 2018, SEM Inspection, reduced from 50% to 30% for Method 5007, Wafer Lot Acceptance

All part numbers for Level S/V only

Method 5007, parts a. and c., Thermal Stability test (C-V plot) reduced from each wafer lot to pre-designated maintenance events of the sputter metal deposition system (for example, venting, and so on.)

M2001, Constant Acceleration eliminated for screen

Ultrasonic inspection per Method 2030 is being performed instead of Radiography on ceramic package with a copper-tungsten heat slug

LM124

LM139

Level B/Q only

Burn-in reduced from inspection lot screen to fab lot sample. Life test frequency increased from yearly to quarterly and can use non-burned-in parts.

LM124, LM124A

Level B/Q only

Screen for A-2, A-3 final electricals moved prior to burn-in

JL111, LM111

Level B/Q only

Burn-in reduced from inspection lot screen to fab lot sample. Life test frequency increased from yearly to quarterly and can use non-burned-in parts.

LM158

Level B/Q only

Burn-in reduced from inspection lot screen to fab lot sample. Life test frequency increased from yearly to quarterly and can use non-burned-in parts.

DS96F173 and 175

Level B/Q only

Burn-in reduced from inspection lot screen to fab lot sample. Life test frequency increased from yearly to quarterly and can use non-burned-in parts.

JL148, LM148

Level B/Q only

Burn-in reduced from inspection lot screen to fab lot sample. Life test frequency increased from yearly to quarterly and can use non-burned-in parts.

LM139, LM139A

Level B/Q only

Screen for A-2, A-3 final electricals moved prior to burn-in

LM741

Level B/Q only

Burn-in reduced from inspection lot screen to fab lot sample. Life test frequency increased from yearly to quarterly and can use non-burned-in parts.

LM136A

Level B/Q only

Screen for A-2, A-3 final electricals moved prior to burn-in

LM136 Screen for 25°C, -55°C, +125°C and temperature coefficient testing can be performed prior to burn-in.

LM148 Screen for -55°C, 125°C moved prior to burn-in

LM723

Level B/Q only

Burn-in reduced from inspection lot screen to fab lot sample. Life test frequency increased from yearly to quarterly and can use non-burned-in parts.

DS26LS31

Level B/Q only

Burn-in reduced from inspection lot screen to fab lot sample. Life test frequency increased from yearly to quarterly and can use non-burned-in parts.

TI systems do not support Marking as described in Section 3.1 (p.13-14): Marking for plastic packages. Follow TI Standard Marking/Symbolization. Actual product symbolization can be documented in the SMD.

Clarification:

Perform UHAST per one of the following conditions:

130C, 85%RH – 96 Hours

110C, 85%RH – 264 Hours.

Allowed per Note 18.

Clarified NiPdAu thickness. TI devices meet NiPdAu thickness indicated below.

Over plating thickness (microinch/micrometer):

Min 20/0.51

Max NS

Flip Chip containing PB free bumps:

Biased Humidity option to run JESD22- A101 (THB) or A110 (Biased HAST)

Conditions:

• 85C/ 85% relative humidity, 1000 hours or
• 130C/85% relative Humidity, 96 hours, or
• 110C/85% relative humidity, 264 hours

Clarification:

QML P devices may use 0.96mil (0.00096 inch) wire

Class Q, V, Y (flip chip):

Group 2:

a. Thermal shocks N/A

b. Temperature cycles TM 1010, condition C, 100 cycles or JESD22-A104

c. HAST(Biased) JESD22-A110 or THB JESD22-A101

d. Visual inspection TM 1010 and TM 1004 visual criteria

e. Not applicable

Class N, P:

Group #5 High Temp

Storage performed per JESD 22 A103

Bake 150C, 1000 Hours or equivalent.

Class N, P:

Group#2 Moisture sensitivity level per manufacturer’s specification or JEDEC JSTD- 020/ JESD 22-A113

Group #3

b. Biased HAST (130C/85%RH/96, 192hr) or (110C/85% RH/264, 528hr) or (85C/85%RH/1000, 2000hr) per JESD22-A110/JESD22-A101

Approved alternate inline methods to record readings for Wafer Lot Acceptance requirements:

• Sheet resistance inline measurements (#2 Metallization Thickness)

• Oxide/Nitride inline measurements (#5 Glassivation/Passivation (PO) thickness)