Over operating
free-air temperature range (unless otherwise noted)(1)(2)
|
MIN |
NOM |
MAX |
UNIT |
SUPPLY VOLTAGE RANGE(3)
|
VDD |
Supply voltage for LVCMOS core logic Supply voltage for LPSDR low-speed interface |
1.65 |
1.8 |
1.95 |
V |
VDDI |
Supply voltage for SubLVDS receivers |
1.65 |
1.8 |
1.95 |
V |
VOFFSET |
Supply voltage for HVCMOS and micromirror electrode(4)
|
9.5 |
10 |
10.5 |
V |
VBIAS |
Supply voltage for mirror electrode |
17.5 |
18 |
18.5 |
V |
VRESET |
Supply voltage for micromirror electrode |
–14.5 |
–14 |
–13.5 |
V |
|VDDI–VDD| |
Supply voltage delta (absolute value)(5)
|
|
|
0.3 |
V |
|VBIAS–VOFFSET| |
Supply voltage delta (absolute value)(6)
|
|
|
10.5 |
V |
|VBIAS–VRESET| |
Supply voltage delta (absolute value)(7)
|
|
|
33 |
V |
OUTPUT TERMINALS
|
IOH |
High-level output current at Voh = 0.8 × VDD |
|
|
–30 |
mA |
IOL |
Low-level output current at Vol = 0.2 × VDD |
|
|
30 |
mA |
CLOCK FREQUENCY
|
ƒclock |
Clock frequency for low speed interface LS_CLK(8)
|
108 |
|
120 |
MHz |
ƒclock |
Clock frequency for high speed interface DCLK(9)
|
300 |
|
600 |
MHz |
|
Duty cycle distortion DCLK |
44% |
|
56% |
|
SUBLVDS INTERFACE(9)
|
|VID| |
SubLVDS input differential voltage (absolute value) Figure 6-8, Figure 6-9
|
150 |
250 |
350 |
mV |
VCM |
Common mode voltage Figure 6-8, Figure 6-9
|
700 |
900 |
1100 |
mV |
VSUBLVDS |
SubLVDS voltage Figure 6-8, Figure 6-9
|
575 |
|
1225 |
mV |
ZLINE |
Line differential impedance (PWB/trace) |
90 |
100 |
110 |
Ω |
ZIN |
Internal differential termination resistance Figure 6-10 |
80 |
100 |
120 |
Ω |
|
100-Ω differential PCB trace |
6.35 |
|
152.4 |
mm |
LPSDR INTERFACE(10)
|
ZLINE |
Line differential impedance (PWB/trace) |
61.2 |
68 |
74.8 |
Ω |
ENVIRONMENTAL
|
TARRAY |
Array temperature – long-term operational(11)
(12)
(13)
|
0 |
|
40 to 70(11)
|
°C |
Array temperature – short-term operational, 25 hr max(13)(14)
|
–20 |
|
-10 |
Array temperature – short-term operational, 500hr max (13)(14) |
-10 |
|
0 |
Array temperature – short-term operational, 500hr max (13)(14) |
70 |
|
75 |
TWINDOW |
Window temperature – operational(15)
(17) |
|
|
90 |
°C |
|TDELTA| |
Absolute temperature difference between any point on the window
edge and the ceramic test point TP1(16)
|
|
|
15 |
°C |
CTELR |
Cumulative time in elevated dew point temperature range |
|
|
6 |
Months |
ILLUV |
Illumination, wavelength < 420 nm |
|
|
0.68 |
mW/cm2 |
ILLVIS |
Illumination wavelengths between 420 nm and 700 nm |
Thermally limited |
|
|
|
ILLNIR |
Illumination, wavelength 700 - 2500 nm |
|
|
2000 |
mW/cm2 |
ILLIR |
Illumination, wavelength > 2500 nm |
|
|
10 |
mW/cm2 |
ILLθ |
Illumination marginal ray angle(17) |
|
|
55 |
deg |
(1) Recommended Operating Conditions are applicable after the DMD is installed in the final product.
(2) The functional performance of the device specified in this datasheet is achieved when operating the device within the limits defined by the Recommended Operating Conditions. No level of performance is implied when
operating the device above or below the Recommended Operating Conditions limits.
(3) All voltage values are with respect to the ground pins (VSS).
(4) VOFFSET supply transients must fall within specified max voltages.
(5) To prevent excess current, the supply voltage delta |VDDI – VDD| must be less than specified limit.
(6) To prevent excess current, the supply voltage delta |VBIAS – VOFFSET| must be less than the specified limit.
(7) To prevent excess current, the supply voltage delta |VBIAS – VRESET| must be less than the specified limit.
(8) LS_CLK must run as specified to ensure internal DMD timing for reset waveform commands.
(9) Refer to the SubLVDS timing requirements in
Section 6.7.
(10) Refer to the LPSDR timing requirements in
Section 6.7.
(11) Per
Figure 6-1, the
maximum operational array temperature should be derated based on the micromirror
landed duty cycle that the DMD experiences in the end application. Refer to
Section 7.7 for a definition of micromirror landed duty cycle.
(12) Long-term is defined as the usable life of the device.
(13) The array temperature cannot be measured directly and must be
computed analytically from the temperature measured at test point 1 (TP1) shown
in
Figure 7-1 and the package thermal resistance using
Section 7.6.
(14) Short-term is the total cumulative time over the useful life of the device.
(15) Window temperature is the highest temperature on the window
edge shown in
Figure 7-1. The locations of thermal test points TP2 and TP3 in
Figure 7-1 are intended to measure the highest window edge temperature. If a particular
application causes another point on the window edge to be at a higher
temperature, a test point should be added to that location.
(16) Temperature delta is the highest difference from the ceramic
test point 1 (TP1) and anywhere on the window edge shown in
Figure 7-1. The window test points TP2 and TP3 shown in
Figure 7-1 are intended to result in the worst case delta temperature. If a particular
application causes another point on the window edge to result in a larger delta
temperature, that point should be used.
(17) The maximum marginal ray angle of the incoming illumination light at any point in the micromirror array, including Pond of Micromirrors (POM), should not exceed 55 degrees from the normal to the device array plane. The
device window aperture has not necessarily been designed to allow incoming light at higher maximum angles to pass to the micromirrors, and the device performance has not been tested nor qualified at angles exceeding this. Illumination
light exceeding this angle outside the micromirror array (including POM) will contribute to thermal limitations described in this document, and may negatively affect lifetime.