DLPS119B December   2018  – May 2022 DLP2010NIR

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Physical Characteristics of the Micromirror Array
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
      1. 6.13.1 Software Requirements
    14. 6.14 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Low-Speed Interface
      3. 7.3.3 High-Speed Interface
      4. 7.3.4 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Optical Interface and System Image Quality
        1. 7.5.1.1 Numerical Aperture and Stray Light Control
        2. 7.5.1.2 Pupil Match
        3. 7.5.1.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Power-Up Procedure
    2. 9.2 Power Supply Power-Down Procedure
    3. 9.3 Power Supply Sequencing Requirements
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
      3. 11.1.3 Device Markings
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • FQJ|40
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.6 Micromirror Array Temperature Calculation

GUID-E6A84E9C-A548-4274-9056-EB491BDDAB35-low.gif Figure 7-1 DMD Thermal Test Points

Micromirror array temperature can be computed analytically from measurement points on the outside of the package, the ceramic package thermal resistance, the electrical power dissipation, and the illumination heat load. The relationship between micromirror array temperature and the reference ceramic temperature is provided by the following equations:

Equation 1. TARRAY = TCERAMIC + (QARRAY × RARRAY–TO–CERAMIC)
Equation 2. QARRAY = QELECTRICAL + QILLUMINATION
Equation 3. QILLUMINATION = (AILLUMINATION × PNIR X DMD absorption factor)

where

  • TARRAY = Computed DMD array temperature (°C)
  • TCERAMIC = Measured ceramic temperature (°C), TP1 location in Figure 7-1
  • RARRAY–TO–CERAMIC = DMD package thermal resistance from array to outside ceramic (°C/W) specified in Section 6.5
  • QARRAY = Total DMD power; electrical, specified in Electrical Characteristics, plus absorbed (calculated) (W)
  • QELECTRICAL = Nominal DMD electrical power dissipation (W), specified in Electrical Characteristics
  • AILLUMINATION = Illumination area (assumes 83.7% on the active array and 16.3% overfill)
  • PNIR = Illumination Power Density (W/cm2)

Electrical power dissipation of the DMD is variable and depends on the voltages, data rates and operating frequencies. Refer to the specifications in Electrical Characteristics. Absorbed power from the illumination source is variable and depends on the operating state of the mirrors and the intensity of the light source.      The DMD absorption constant of 0.42 assumes nominal operation with an illumination distribution of 83.7% on the DMD active array, and 16.3% on the DMD array border and window aperture.

A sample calculation is detailed below:

TCERAMIC = 35 °C, assumed system measurement; see Recommended Operating Conditions for specification limits
PNIR= 2 W/cm2
QELECTRICAL = 0.0908 W; See the table notes in Recommended Operating Conditions for details.
AILLUMINATION = 0.143 cm2
QARRAY = QELECTRICAL + (QILLUMINATION X DMD absoprtion factor) = 0.0908 W + (2 W/cm2 X 0.143 cm2 X 0.42) = 0.211 W
TARRAY = 35 °C + (0.211 W × 7.9°C/W) = 36.67 °C