DLPS183C March   2020  – March 2023 DLP3021-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Physical Characteristics of the Micromirror Array
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Micromirror Array
      2. 7.3.2 Double Data Rate (DDR) Interface
      3. 7.3.3 Micromirror Switching Control
      4. 7.3.4 DMD Voltage Supplies
      5. 7.3.5 Logic Reset
      6. 7.3.6 Temperature Sensing Diode
        1. 7.3.6.1 Temperature Sense Diode Theory
      7. 7.3.7 DMD JTAG Interface
    4. 7.4 System Optical Considerations
      1. 7.4.1 Numerical Aperture and Stray Light Control
      2. 7.4.2 Pupil Match
      3. 7.4.3 Illumination Overfill and Alignment
    5. 7.5 DMD Image Performance Specification
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
    3. 8.3 Application Mission Profile Consideration
  9. Power Supply Recommendations
    1. 9.1 Power Supply Sequencing Requirements
      1. 9.1.1 Power Up and Power Down
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Temperature Diode Pins
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Device Markings
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Device Handling
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

The DLP3021-Q1 Automotive DMD is primarily targeted for automotive exterior light control and display applications, such as ground projection with the ability to display dynamic content. Ground projections can help facilitate vehicle to pedestrian (V2P) communication, such as back up and door open warnings, in addition to orchestrating vehicle communication systems and vehicle personalization options. Due to their small form factor and low power operation, projectors with the DLP3021-Q1 chipset can support many projection applications. They can be placed in many locations in the car including inside the side mirror, door panel, tail light, front grill, and more. This chipset can be coupled with LEDs or lasers to create highly saturated colors with over 125% NTSC color gamut, and can be used with either RGB or white illumination sources. A DLP® Products FPGA configuration can be used to drive the DLP3021-Q1 Automotive DMD to reduce form factor for easy integration in a vehicle. The DLPC120-Q1 Automotive DMD controller can also be used to drive the DLP3021-Q1 Automotive DMD with support for 24-bit RGB video input to increase content flexibility.

Device Information
PART NUMBER(1)PACKAGEBODY SIZE (NOM)
DLP3021-Q1FQR (64)8.55 mm × 16.80 mm
For all available packages, see the orderable addendum at the end of the data sheet.
GUID-C86EE25D-A3F6-4673-916B-D0ED7306AA7F-low.gif DLP3021-Q1 System Block Diagram