DLPS159D April   2019  – December 2024 DLP470NE

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Storage Conditions
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics
    7. 5.7  Capacitance at Recommended Operating Conditions
    8. 5.8  Timing Requirements
    9. 5.9  System Mounting Interface Loads
    10. 5.10 Micromirror Array Physical Characteristics
    11. 5.11 Micromirror Array Optical Characteristics
    12. 5.12 Window Characteristics
    13. 5.13 Chipset Component Usage Specification
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Interface
      2. 6.3.2 Timing
    4. 6.4 Device Functional Modes
    5. 6.5 Optical Interface and System Image Quality Considerations
      1. 6.5.1 Numerical Aperture and Stray Light Control
      2. 6.5.2 Pupil Match
      3. 6.5.3 Illumination Overfill
    6. 6.6 Micromirror Array Temperature Calculation
    7. 6.7 Micromirror Power Density Calculation
    8. 6.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.8.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 6.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 DMD Die Temperature Sensing
  9. 8 Power Supply Recommendations
    1. 8.1 DMD Power Supply Power-Up Procedure
    2. 8.2 DMD Power Supply Power-Down Procedure
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
      1. 9.2.1 Layers
      2. 9.2.2 Impedance Requirements
      3. 9.2.3 Trace Width, Spacing
        1. 9.2.3.1 Voltage Signals
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Device Support
      1. 10.2.1 Device Nomenclature
      2. 10.2.2 Device Markings
    3. 10.3 Documentation Support
      1. 10.3.1 Related Documentation
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13.   Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.8 Timing Requirements

MIN NOM MAX UNIT
SCP(1)
tr Rise time 20% to 80% reference points 30 ns
tf Fall time 80% to 20% reference points 30 ns
LVDS(2)
tr Rise slew rate 20% to 80% reference points 0.7 1 V/ns
tf Fall slew rate 80% to 20% reference points 0.7 1 V/ns
tC Clock cycle DCLK_C,LVDS pair 2.5 ns
DCLK_D, LVDS pair 2.5 ns
tW Pulse duration DCLK_C LVDS pair 1.19 1.25 ns
DCLK_D LVDS pair 1.19 1.25 ns
tSu Setup time D_C(15:0) before DCLK_C, LVDS pair 0.275 ns
D_D(15:0) before DCLK_D, LVDS pair 0.275 ns
SCTRL_C before DCLK_C, LVDS pair 0.275 ns
SCTRL_D before DCLK_D, LVDS pair 0.275 ns
th Hold time D_C(15:0) after DCLK_C, LVDS pair 0.195 ns
D_D(15:0) after DCLK_D, LVDS pair 0.195 ns
SCTRL_C after DCLK_C, LVDS pair 0.195 ns
SCTRL_D after DCLK_D, LVDS pair 0.195 ns
tSKEW Skew time Channel D relative to Channel C(3)(4), LVDS pair –1.25 1.25 ns
(1) See Figure 5-3 for Rise Time and Fall Time for SCP.
(2) See Figure 5-5 for Timing Requirements for LVDS.
(3) Channel C (Bus C) includes the following LVDS pairs: DCLK_CN and DCLK_CP, SCTRL_CN and SCTRL_CP, D_CN(15:0) and D_CP(15:0).
(4) Channel D (Bus D) includes the following LVDS pairs: DCLK_DN and DCLK_DP, SCTRL_DN and SCTRL_DP, D_DN(15:0) and D_DP(15:0).
DLP470NE SCP Timing Requirements Figure 5-2 SCP Timing Requirements

See Recommended Operating Conditions for fSCPCLK, tSCP_DS, tSCP_DH, and tSCP_PD specifications.

DLP470NE SCP Requirements for Rise and Fall Figure 5-3 SCP Requirements for Rise and Fall

See Timing Requirements for tr and tf specifications and conditions.

DLP470NE Test Load Circuit for Output Propagation Measurement Figure 5-4 Test Load Circuit for Output Propagation Measurement

For output timing analysis, the tester pin electronics and its transmission line effects must be taken into account. System designers use IBIS or other simulation tools to correlate the timing reference load to a system environment. See Figure 5-4.

DLP470NE LVDS Waveform Requirements Figure 5-5 LVDS Waveform Requirements

See Recommended Operating Conditions for VCM, VID, and VLVDS specifications and conditions.

DLP470NE Timing Requirements Figure 5-6 Timing Requirements

See Timing Requirements for timing requirements and LVDS pairs per channel (bus) defining D_P(?:0) and D_N(?:0).