DLPS272A May   2024  – December 2024 DLP472NE

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Storage Conditions
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
    5.     11
    6.     12
    7. 5.5  Thermal Information
    8. 5.6  Electrical Characteristics
    9. 5.7  Switching Characteristics
    10. 5.8  Timing Requirements
    11. 5.9  System Mounting Interface Loads
    12. 5.10 Micromirror Array Physical Characteristics
    13. 5.11 Micromirror Array Optical Characteristics
    14. 5.12 Window Characteristics
    15. 5.13 Chipset Component Usage Specification
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Interface
      2. 6.3.2 Timing
    4. 6.4 Device Functional Modes
    5. 6.5 Optical Interface and System Image Quality Considerations
      1. 6.5.1 Numerical Aperture and Stray Light Control
      2. 6.5.2 Pupil Match
      3. 6.5.3 Illumination Overfill
    6. 6.6 Micromirror Array Temperature Calculation
    7. 6.7 Micromirror Power Density Calculation
    8. 6.8 Window Aperture Illumination Overfill Calculation
    9. 6.9 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.9.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.9.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.9.3 Landed Duty Cycle and Operational DMD Temperature
      4. 6.9.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Temperature Sensor Diode
  9. Power Supply Recommendations
    1. 8.1 DMD Power Supply Power-Up Procedure
    2. 8.2 DMD Power Supply Power-Down Procedure
  10. Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Impedance Requirements
    3. 9.3 Layers
    4. 9.4 Trace Width, Spacing
    5. 9.5 Power
    6. 9.6 Trace Length Matching Recommendations
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Device Support
      1. 10.2.1 Device Nomenclature
      2. 10.2.2 Device Markings
    3. 10.3 Documentation Support
      1. 10.3.1 Related Documentation
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics

Over operating free-air temperature range and supply voltages (unless otherwise noted)
PARAMETER (1)(2)TEST CONDITIONS (1)MINTYPMAXUNIT
CURRENT – TYPICAL
IDDSupply current VDD(3)8001200mA
IDDASupply current VDDA(3)10001200mA
IDDASupply current VDDA(3)Single macro mode500600mA
IOFFSETSupply current VOFFSET(4)(5)2025mA
IBIASSupply current VBIAS(4)(5)2.54.0mA
IRESETSupply current VRESET(5)-9.3-6.9mA
POWER – TYPICAL
PDDSupply power dissipation VDD(3)14402437.5mW
PDDASupply power dissipation VDDA(3)16202340mW
PDDASupply power dissipation VDDA(3)single macro mode9001170mW
POFFSETSupply power dissipation VOFFSET(4)(5)230367.5mW
PBIASSupply power dissipation VBIAS(4)(5)43.270.3mW
PRESETSupply power dissipation VRESET(5)107.8152.25mW
PTOTALSupply power dissipation Total34415367.55mW
LVCMOS INPUT
IILLow level input current (6)VDD = 1.95V, VI = 0V–100nA
IIHHigh level input current (6)VDD = 1.95V, VI = 1.95V135µA
LVCMOS OUTPUT
VOHDC output high voltage (7)IOH = -2 mA0.8 x VDDV
VOLDC output low voltage (7)IOL = 2 mA0.2 x VDDV
RECEIVER EYE CHARACTERISTICS
A1Minimum data eye opening (8)(9)100600mV
Minimum clock eye opening (8)(9)295600mV
A2Maximum data signal swing (8)(9)600mV
X1Maximum data eye closure (8)0.275UI
X2Maximum data eye closure (8)0.4UI
| tDRIFT |Drift between Clock and Data between Training Patterns20ps
CAPACITANCE
CINInput capacitance LVCMOSf = 1MHz10pF
CINInput capacitance LSIF (low speed interface)f = 1MHz20pF
CINInput capacitance HSSI (high speed serial interface)f = 1MHz20pF
COUTOutput capacitancef = 1MHz10pF
All power supply connections are required to operate the DMD: VDD, VDDA, VOFFSET, VBIAS, and VRESET. All VSS connections are required to operate the DMD.
All voltage values are with respect to the ground pins (VSS).
To prevent excess current, the supply voltage delta | VDDA – VDD | must be less than the specified limit.
To prevent excess current, the supply voltage delta | VBIAS – VOFFSET | must be less than the specified limit.
Supply power dissipation based on 3 global resets in 200µs.
LVCMOS input specifications are for pin DMD_DEN_ARSTZ.
LVCMOS output specification is for pins LS_RDATA_A and LS_RDATA_B.
Refer to Figure 5-12, Receiver Eye Mask (1e-12 BER).
Defined in Section 5.4.