Thermal resistance, active area to test point 1 (TP1)(1)
0.90
°C/W
(1) The DMD is designed to conduct absorbed and dissipated heat to the back of the
package. The cooling system must be capable of
maintaining the package within the temperature
range specified in the
Section 6.4.
The total heat load
on the DMD is largely driven by the incident light
absorbed by the active area; although other
contributions include light energy absorbed by the
window aperture and electrical power dissipation
of the array.
Optical systems must be designed to minimize the
light energy falling outside the window clear
aperture since any additional thermal load in this
area can significantly degrade the reliability of
the device.