DLPS053B October   2014  – October 2016

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Typical Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Micromirror Array Physical Characteristics
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
    5. 7.5 Window Characteristics and Optics
      1. 7.5.1 Optical Interface and System Image Quality
      2. 7.5.2 Numerical Aperture and Stray Light Control
      3. 7.5.3 Pupil Match
      4. 7.5.4 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-on/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
  9. 9 Power Supply Requirements
    1. 9.1 DMD Power Supply Requirements
    2. 9.2 DMD Power Supply Power-Up Procedure
    3. 9.3 DMD Mirror Park Sequence Requirements
      1. 9.3.1 DLPC900
      2. 9.3.2 DLPC910
    4. 9.4 DMD Power Supply Power-Down Procedure
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 General PCB Recommendations
    2. 10.2 Layout Example
      1. 10.2.1 Board Stack and Impedance Requirements
        1. 10.2.1.1 Power Planes
        2. 10.2.1.2 LVDS Signals
        3. 10.2.1.3 Critical Signals
        4. 10.2.1.4 Device Placement
        5. 10.2.1.5 Device Orientation
        6. 10.2.1.6 Fiducials
  11. 11Device Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Device Markings
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • FYE|350
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (February 2016) to B Revision

  • Updated features to include additional digital controller.Go
  • Added additional simplified diagram.Go
  • Separated TCASE into TARRAY and TWINDOW and changed TGRADIENT to TDELTA in Absolute Maximum Ratings.Go
  • Added additional parameters in Storage ConditionsGo
  • Change TDMD to TArray and TCERAMIC-WINDOW-DELTA to TDELTA, and updated values in Recommended Operating Conditions.Go
  • Updated current and power section in Electrical Characteristics.Go
  • Added typical characteristics when DMD is controlled with the DLPC910.Go
  • Added recommended idle mode operation for maximizing mirror useful life.Go
  • Added additional typical application schematic.Go
  • Added DMD mirror park sequence requirements.Go
  • Added cross reference to the DMD mirror park seuqence requirements.Go
  • Updated device nomenclature and markings.Go

Changes from * Revision (October 2014) to A Revision

  • Changed the Device Information table package dimensions from: 40.6 x 31.8 x 6 mm to: 35.0 × 32.2 × 5.1 mmGo
  • Changed Note (4) of the Pin Functions table From: "Dielectric Constant for the DMD" Type A To: "Dielectric Constant for the DMD S600" Go
  • Removed pin number Z27 in the Pin Functions (continued) tableGo
  • Deleted pin number AA25 from VOFFSET in the Pin Functions (continued) table Go
  • Changed ƒclock in Absolute Maximum Ratings From: "DCLK_A and DCLK_B rows To: one row "DCLK (all channels)" Go
  • Changed Note (9) of the Absolute Maximum Ratings table.Go
  • Added the Storage Conditions table Go
  • Added the ESD Ratings table Go
  • Changed the test conditions in row 1 of the Window Characteristics table From: "Corning 7056" To: "Corning Eagle XG"Go
  • Changed the test conditions in row 2 of the Window Characteristics table From: "at wavelength 589 nm" To: "at wavelength 546.1 nm" and the NOM value From: 1.487 To 1.5119Go